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TMS5701224BPGEQQ1

Texas Instruments

TMS5701224BPGEQQ1 by Texas Instruments

TMS5701224BPGEQQ1 by Texas Instruments is a 32-bit microcontroller with 144 terminals, operating at up to 80 MHz. It features 24-Ch 12-Bit ADCs, 64K Data EEPROM, and peripherals like CAN, I2C, LIN for automotive applications.

Median Price

$20.740

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,849 parts In-Stock

1+ parts

$20.740

100+ parts

$20.330

1k+ parts

$19.910

10k+ parts

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1,849

$20.740

$20.330

$19.910

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Distributors (In-Stock)

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Vyrian

USA . 5,487 parts In-Stock

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5,487

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Digiode

USA . 2,943 parts In-Stock

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Sensible Micro Corp

USA . 21 parts In-Stock

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Nova Conductors

Japan . 10 parts In-Stock

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10

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Bristol Electronics

USA . 10 parts In-Stock

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10

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Distributors (Availability)

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Ampacity Inc.

Singapore . 1,420 parts In-Stock

1+ parts

$13.000

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$13.000

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AZTECH Wire

Italy . 676 parts In-Stock

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$14.516

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676

$14.516

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One Stop Electronics

USA . 1,249 parts In-Stock

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$22.000

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$22.000

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Parana Technologies

USA . 1,362 parts In-Stock

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$62.359

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$62.359

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ChromeModa Solutions

Germany . 5,149 parts In-Stock

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$70.066

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$57.454

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5,149

$70.066

$57.454

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IDEA Electronic Components Group

UK . 2,029 parts In-Stock

1+ parts

$70.066

100+ parts

$66.563

1k+ parts

$63.059

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2,029

$70.066

$66.563

$63.059

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QUARKTWIN TECHNOLOGY LTD

USA . 19,786 parts In-Stock

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Kepictronics

USA . 9,000 parts In-Stock

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Microchip USA

USA . 4,524 parts In-Stock

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Corphita

USA . 3,068 parts In-Stock

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DigiPath Technology Company

USA . 1,825 parts In-Stock

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$63.172

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1,825

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Aranea Global

USA . 1,000 parts In-Stock

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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iodParts Technologies Inc.

India . 150 parts In-Stock

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Overview

Elevate your automotive electronics with the TMS5701224BPGEQQ1 from Texas Instruments. As a leader in microcontroller technology, Texas Instruments delivers unmatched quality and reliability. This powerful 32-bit microcontroller offers a wide range of applications, from automotive to industrial. With advanced features like ADC channels, DMA channels, and PWM capabilities, this microcontroller provides optimal performance and efficiency. Trust Texas Instruments to provide cutting-edge solutions for all your electronics needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the package lightweight and durable, making it suitable for a wide range of applications.

Surface Mount: YES

Surface mount design allows for easy and efficient PCB assembly, saving time and cost.

Maximum Supply Voltage: 1.32 V

Low maximum supply voltage helps in reducing power consumption and heat dissipation.

Screening Level: AEC-Q100

AEC-Q100 screening level ensures reliability and quality standards for automotive applications.

Package Shape: SQUARE

Square package shape enables efficient use of PCB space and simplifies layout design.

Bit Size: 32

32-bit architecture provides enhanced computational capabilities and performance for demanding applications.

Power Supplies (V): 1.2,3.3

Support for multiple power supply voltages allows flexibility in system design and compatibility with various components.

No. of Terminals: 144

144 terminals provide ample I/O options for interfacing with external devices and peripherals.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Various package styles cater to different PCB design requirements, offering versatility in mounting and space constraints.

Minimum Supply Voltage: 1.14 V

Low minimum supply voltage ensures efficient operation even in low power scenarios.

Technical Specifications

Microcontrollers TMS5701224BPGEQQ1 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-R4F

Maximum Clock Frequency:

80 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e4

Length:

20 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

64

No. of Terminals:

144

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP144,.87SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Bytes:

196608

ROM Words:

1310720

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.6 mm

Speed:

160 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

350 mA

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

20 mm

Peripheral IC Type:

Data EEPROM Size:

64K

Connectivity:

CAN(3), I2C, LIN, MIBSPI(3), SCI(2), SPI

Peripherals:

CAP(6), DMA(16), POR, PWM(14), QEP(2), TIMER(40), WDT

Analog To Digital Convertors:

24-Ch 12-Bit

Trade Compliance

TMS5701224BPGEQQ1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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