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TMS470R1B768PGET

Texas Instruments

TMS470R1B768PGET by Texas Instruments

TMS470R1B768PGET by Texas Instruments is a 32-bit ARM7TDMI microcontroller with 27-bit address bus and 8-bit on-chip data RAM. It features 16 external interrupts, 12-Ch 10-Bit ADCs, and peripherals like AWD, DMA(16), DWD, TIMER. Ideal for industrial applications requiring low power consumption and high-speed processing up to 20 MHz.

Median Price

$30.120

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 60 parts In-Stock

1+ parts

$38.980

100+ parts

$28.565

1k+ parts

$26.810

10k+ parts

-

60

$38.980

$28.565

$26.810

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Rochester

USA . 1 parts In-Stock

1+ parts

-

100+ parts

$21.260

1k+ parts

$19.020

10k+ parts

$17.900

1

-

$21.260

$19.020

$17.900

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,804 parts In-Stock

1+ parts

$19.513

100+ parts

-

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1,804

$19.513

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-

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Vyrian

USA . 3,483 parts In-Stock

1+ parts

-

100+ parts

-

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3,483

-

-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,982 parts In-Stock

1+ parts

$18.486

100+ parts

-

1k+ parts

-

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3,982

$18.486

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-

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Component Stockers USA

USA . 237 parts In-Stock

1+ parts

$20.850

100+ parts

$24.550

1k+ parts

-

10k+ parts

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237

$20.850

$24.550

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-

Advanced Electronics

New Zealand . 3,000 parts In-Stock

1+ parts

$49.155

100+ parts

$44.731

1k+ parts

$40.307

10k+ parts

-

3,000

$49.155

$44.731

$40.307

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Parana Technologies

USA . 532 parts In-Stock

1+ parts

$57.294

100+ parts

-

1k+ parts

-

10k+ parts

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532

$57.294

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-

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ChromeModa Solutions

Germany . 3,298 parts In-Stock

1+ parts

$64.375

100+ parts

$52.788

1k+ parts

-

10k+ parts

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3,298

$64.375

$52.788

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IDEA Electronic Components Group

UK . 1,918 parts In-Stock

1+ parts

$64.375

100+ parts

$61.156

1k+ parts

$57.938

10k+ parts

-

1,918

$64.375

$61.156

$57.938

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Lixinc

USA . 16,845 parts In-Stock

1+ parts

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16,845

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DigiPath Technology Company

USA . 935 parts In-Stock

1+ parts

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100+ parts

$58.040

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935

-

$58.040

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Microchip USA

USA . 254 parts In-Stock

1+ parts

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254

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Perfect Parts

USA . 253 parts In-Stock

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253

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iodParts Technologies Inc.

India . 150 parts In-Stock

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150

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Overview

Experience the cutting-edge technology of the TMS470R1B768PGET microcontroller by Texas Instruments, a leader in innovation. This versatile device is ideal for a wide range of applications, offering high-quality performance and reliability. With features like advanced connectivity options, low power mode, and a wide range of peripherals, this microcontroller provides unmatched value and flexibility to customers. Elevate your projects with the TMS470R1B768PGET and unlock endless possibilities in industrial automation, automotive electronics, and more. Trust Texas Instruments for exceptional quality and unbeatable performance in every application.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material, suitable for various applications.

Maximum Supply Voltage: 2.05 V

Allows for a wide range of power supply options.

Address Bus Width: 27

Provides a large address space for efficient memory access.

Bit Size: 32

High-performance computing capabilities.

CPU Family: ARM7TDMI

A proven and reliable processor architecture.

ADC Channels: YES

Analog to digital conversion capability for sensor interfacing.

DMA Channels: YES

Supports Direct Memory Access for efficient data transfer.

Peripherals: AWD, DMA(16), DWD, TIMER

A variety of integrated peripherals for versatile functionality.

Connectivity: CAN(2), I2C(3), SCI(3), SPI(2)

Multiple communication interfaces for seamless connectivity.

Low Power Mode: YES

Energy-efficient operation for longer battery life.

Technical Specifications

Microcontrollers TMS470R1B768PGET attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

27

Bit Size:

32

Boundary Scan:

YES

CPU Family:

ARM7TDMI

Maximum Clock Frequency:

20 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e4

Length:

20 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

16

No. of External Interrupts:

16

No. of I/O Lines:

87

No. of Serial I/Os:

5

No. of Terminals:

144

No. of Timers:

1

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP144,.87SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

RAM Bytes:

49152

RAM Words:

4

ROM Words:

786432

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

60 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

115 mA

Maximum Supply Voltage:

2.05 V

Minimum Supply Voltage:

1.81 V

Nominal Supply Voltage:

2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

20 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"CAN(2), I2C(3), SCI(3), SPI(2)"

Peripherals:

"AWD, DMA(16), DWD, TIMER"

Analog To Digital Convertors:

12-Ch 10-Bit

Trade Compliance

TMS470R1B768PGET Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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