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TMS470R1B1MPGEAR

Texas Instruments

TMS470R1B1MPGEAR by Texas Instruments

TMS470R1B1MPGEAR by Texas Instruments is a 32-bit ARM7TDMI microcontroller with 8-bit data RAM and 27-bit address bus. It features 12-Ch 10-Bit ADC, 16 DMA channels, and PWM support. Ideal for industrial applications requiring low power consumption and high-speed connectivity via CAN, I2C, SCI, and SPI interfaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,588 parts In-Stock

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Digiode

USA . 1,569 parts In-Stock

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Parana Technologies

USA . 712 parts In-Stock

1+ parts

$14.622

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-

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$15.059

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712

$14.622

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$15.059

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AZTECH Wire

Italy . 508 parts In-Stock

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$14.781

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508

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DigiPath Technology Company

USA . 2,151 parts In-Stock

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$16.100

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$14.812

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$16.100

$14.812

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ChromeModa Solutions

Germany . 3,455 parts In-Stock

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$16.429

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$13.472

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3,455

$16.429

$13.472

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IDEA Electronic Components Group

UK . 2,024 parts In-Stock

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$16.429

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$15.608

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$14.786

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2,024

$16.429

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$14.786

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One Stop Electronics

USA . 280 parts In-Stock

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$25.000

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280

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Microchip USA

USA . 1,559 parts In-Stock

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$56.680

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$55.690

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$55.200

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$54.700

1,559

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$55.690

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$54.700

QUARKTWIN TECHNOLOGY LTD

USA . 17,659 parts In-Stock

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Lixinc

USA . 9,660 parts In-Stock

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Perfect Parts

USA . 1,680 parts In-Stock

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Corphita

USA . 667 parts In-Stock

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Overview

Unleash the power of innovation with the TMS470R1B1MPGEAR by Texas Instruments. Designed with precision and reliability, this microcontroller offers unmatched performance in a compact package. From industrial automation to automotive applications, this device delivers seamless connectivity and efficient operation. Trust Texas Instruments to provide cutting-edge technology that brings value and benefits to your projects. Upgrade to the TMS470R1B1MPGEAR and experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the package durable and lightweight.

Maximum Supply Voltage: 2.05 V

Operates efficiently at a maximum supply voltage of 2.05V.

Bit Size: 32

32-bit architecture for fast and efficient processing.

No. of Terminals: 144

High number of terminals for versatile connectivity options.

ROM Words: 1048576

Large ROM capacity for storing program instructions.

Temperature Grade: INDUSTRIAL

Suitable for industrial applications with a wide operating temperature range.

Analog To Digital Convertors: 12-Ch 10-Bit

12 channels of 10-bit ADCs for accurate analog to digital conversion.

Connectivity: CAN(2), I2C(3), SCI(3), SPI(2)

Multiple connectivity options for interfacing with different devices.

Speed: 60 rpm

Capable of operating at a speed of 60 rpm for time-critical applications.

No. of I/O Lines: 93

High number of I/O lines for connecting to external peripherals.

Technical Specifications

Microcontrollers TMS470R1B1MPGEAR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

27

Bit Size:

32

Boundary Scan:

YES

CPU Family:

ARM7TDMI

Maximum Clock Frequency:

10 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e4

Length:

20 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

16

No. of External Interrupts:

16

No. of I/O Lines:

93

No. of Serial I/Os:

5

No. of Terminals:

144

No. of Timers:

1

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP144,.87SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

RAM Bytes:

65536

RAM Words:

64

ROM Words:

1048576

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

60 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

125 mA

Maximum Supply Voltage:

2.05 V

Minimum Supply Voltage:

1.81 V

Nominal Supply Voltage:

2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

20 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"CAN(2), I2C(3), SCI(3), SPI(2)"

Peripherals:

"AWD, DMA(16), DWD, TIMER"

Analog To Digital Convertors:

12-Ch 10-Bit

Trade Compliance

TMS470R1B1MPGEAR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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