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TMS470R1A384PZ-T

Texas Instruments

TMS470R1A384PZ-T by Texas Instruments

TMS470R1A384PZ-T by Texas Instruments is a 32-bit ARM7TDMI microcontroller with 393216 ROM words and 32768 RAM bytes. It features 12-Ch 10-Bit ADCs, 16 DMA channels, and peripherals like AWD, DWD, TIMER. Ideal for industrial applications requiring low power consumption and high-speed connectivity via CAN(2), I2C(3), SCI(3), SPI(2).

Median Price

$16.837

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 130 parts In-Stock

1+ parts

-

100+ parts

$13.470

1k+ parts

$12.050

10k+ parts

$11.340

130

-

$13.470

$12.050

$11.340

DigiKey

USA . 130 parts In-Stock

1+ parts

-

100+ parts

$17.730

1k+ parts

-

10k+ parts

-

130

-

$17.730

-

-

Verical

USA . 60 parts In-Stock

1+ parts

-

100+ parts

$16.837

1k+ parts

$15.063

10k+ parts

$14.175

60

-

$16.837

$15.063

$14.175

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,924 parts In-Stock

1+ parts

$12.360

100+ parts

-

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-

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1,924

$12.360

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Vyrian

USA . 4,914 parts In-Stock

1+ parts

-

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-

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4,914

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DigiKey Marketplace

USA . 260 parts In-Stock

1+ parts

-

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-

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260

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-

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Rebound Electronics

UK . 90 parts In-Stock

1+ parts

-

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90

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,972 parts In-Stock

1+ parts

$11.709

100+ parts

-

1k+ parts

-

10k+ parts

-

4,972

$11.709

-

-

-

Microchip USA

USA . 2,835 parts In-Stock

1+ parts

$44.900

100+ parts

$44.260

1k+ parts

$43.940

10k+ parts

$43.620

2,835

$44.900

$44.260

$43.940

$43.620

Parana Technologies

USA . 333 parts In-Stock

1+ parts

$60.054

100+ parts

-

1k+ parts

-

10k+ parts

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333

$60.054

-

-

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ChromeModa Solutions

Germany . 885 parts In-Stock

1+ parts

$67.476

100+ parts

$55.330

1k+ parts

-

10k+ parts

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885

$67.476

$55.330

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IDEA Electronic Components Group

UK . 205 parts In-Stock

1+ parts

$67.476

100+ parts

$64.102

1k+ parts

$60.728

10k+ parts

-

205

$67.476

$64.102

$60.728

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Perfect Parts

USA . 1,120 parts In-Stock

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1,120

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DigiPath Technology Company

USA . 1,059 parts In-Stock

1+ parts

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100+ parts

$60.836

1k+ parts

-

10k+ parts

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1,059

-

$60.836

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-

Overview

Unleash the power of innovation with the TMS470R1A384PZ-T microcontroller by Texas Instruments. Designed with precision and quality in mind, this product offers a wide range of applications for your projects. From industrial automation to consumer electronics, this microcontroller provides reliability, efficiency, and performance. With its advanced features and cutting-edge technology, customers can trust in the value and benefits that this product brings to their designs. Elevate your creations with the TMS470R1A384PZ-T and experience the advantage of choosing Texas Instruments as your trusted manufacturer.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used for microcontrollers due to its durability and cost-effectiveness.

Surface Mount: YES

Surface mount technology allows for a more compact design and efficient assembly process.

Maximum Supply Voltage: 2.05 V

This range of supply voltage provides flexibility in power requirements for various applications.

ADC Channels: YES

The presence of ADC channels allows for analog to digital conversion, essential for many sensor applications.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture typically enables faster and more efficient processing, making it a good choice for high-performance applications.

Moisture Sensitivity Level (MSL): 3

MSL level 3 suggests that the product can withstand a certain level of moisture exposure during storage and handling.

Technical Specifications

Microcontrollers TMS470R1A384PZ-T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

27

Bit Size:

32

Boundary Scan:

YES

CPU Family:

ARM7TDMI

Maximum Clock Frequency:

20 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

16

No. of External Interrupts:

16

No. of I/O Lines:

14

No. of Serial I/Os:

5

No. of Terminals:

100

No. of Timers:

1

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.9,3.3

Qualification:

Not Qualified

RAM Bytes:

32768

RAM Words:

32

ROM Words:

393216

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

48 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

115 mA

Maximum Supply Voltage:

2.05 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"CAN(2), I2C(3), SCI(3), SPI(2)"

Peripherals:

"AWD, DMA(16), DWD, TIMER"

Analog To Digital Convertors:

12-Ch 10-Bit

Trade Compliance

TMS470R1A384PZ-T Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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