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TMS470R1A288PZA

Texas Instruments

TMS470R1A288PZA by Texas Instruments

TMS470R1A288PZA by Texas Instruments is a 32-bit ARM7 microcontroller with 27-bit address bus, operating at up to 10 MHz. It features 16384 bytes of RAM, flash ROM programmability, and ADC/DMA channels. Ideal for industrial applications requiring low-profile, fine-pitch package style with quad terminal position.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,491 parts In-Stock

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5,491

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Digiode

USA . 4,671 parts In-Stock

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4,671

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Distributors (Availability)

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AZTECH Wire

Italy . 727 parts In-Stock

1+ parts

$11.386

100+ parts

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727

$11.386

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One Stop Electronics

USA . 748 parts In-Stock

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$18.000

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748

$18.000

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Parana Technologies

USA . 1,038 parts In-Stock

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$41.532

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1,038

$41.532

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DigiPath Technology Company

USA . 140 parts In-Stock

1+ parts

$45.732

100+ parts

$42.073

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140

$45.732

$42.073

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ChromeModa Solutions

Germany . 3,337 parts In-Stock

1+ parts

$46.665

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$38.265

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3,337

$46.665

$38.265

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IDEA Electronic Components Group

UK . 2,163 parts In-Stock

1+ parts

$46.665

100+ parts

$44.332

1k+ parts

$41.998

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2,163

$46.665

$44.332

$41.998

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Corphita

USA . 441 parts In-Stock

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441

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Microchip USA

USA . 268 parts In-Stock

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Overview

Experience next-level performance and reliability with the TMS470R1A288PZA microcontroller from Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers cutting-edge technology for a wide range of applications. This microcontroller offers exceptional value with its high-quality design and versatile features, providing customers with seamless integration and optimal performance. Whether you're working on automotive systems, industrial controls, or consumer electronics, the TMS470R1A288PZA is the perfect solution to meet your needs. Trust Texas Instruments to deliver excellence in every product they create.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides durability and protection to the microcontroller, making it suitable for various applications.

Surface Mount: YES

The surface mount feature allows for easy and efficient installation on PCBs, saving space and simplifying the overall design.

Maximum Supply Voltage: 2.05 V

With a maximum supply voltage of 2.05 V, this microcontroller is power-efficient and helps in reducing energy consumption.

Address Bus Width: 27

The wide address bus width of 27 enables efficient processing of memory addresses, enhancing overall performance.

Bit Size: 32

The 32-bit architecture provides enhanced processing power and speed, making the microcontroller suitable for complex tasks and calculations.

Power Supplies (V): 1.8,3.3

Support for multiple power supply voltages (1.8V and 3.3V) offers flexibility in design and compatibility with different components.

No. of Terminals: 100

The high number of terminals allows for connectivity with various external devices and peripherals, enhancing the versatility of the microcontroller.

Maximum Clock Frequency: 10 MHz

The high maximum clock frequency of 10 MHz enables rapid execution of instructions and faster overall performance.

Technical Specifications

Microcontrollers TMS470R1A288PZA attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

27

Bit Size:

32

CPU Family:

ARM7

Maximum Clock Frequency:

10 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

8

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

No. of I/O Lines:

14

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

RAM Bytes:

16384

ROM Words:

294912

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

48 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.05 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Trade Compliance

TMS470R1A288PZA Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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