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TMS32C6415EZLZ6E3

Texas Instruments

TMS32C6415EZLZ6E3 by Texas Instruments

TMS32C6415EZLZ6E3 by Texas Instruments is a 32-bit DSP with integrated cache, 64-bit external data bus width, and max clock frequency of 75.18 MHz. Ideal for digital signal processing applications requiring high-speed performance in a compact package.

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Digiode

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Quantum Digital Technology

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Sensible Micro Corp

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Speed Components Ltd

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Bristol Electronics

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Atlantic Semiconductor

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Ampacity Inc.

Singapore . 130 parts In-Stock

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AZTECH Wire

Italy . 626 parts In-Stock

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Parana Technologies

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DigiPath Technology Company

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ChromeModa Solutions

Germany . 4,631 parts In-Stock

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IDEA Electronic Components Group

UK . 1,821 parts In-Stock

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One Stop Electronics

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Advanced Electronics

New Zealand . 900 parts In-Stock

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Corohmni

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Microchip USA

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Authorized Procurement Solutions

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Overview

Experience unparalleled performance and reliability with the TMS32C6415EZLZ6E3 by Texas Instruments. As a leading manufacturer in digital signal processors, Texas Instruments delivers cutting-edge technology that exceeds industry standards. Ideal for various applications in telecommunications, audio processing, and control systems, this DSP offers unmatched value and benefits to customers. Trust Texas Instruments to provide you with a high-quality product that will elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used in electronic components as it provides good insulation and protection for the internal circuitry.

Integrated Cache: YES

Having an integrated cache helps improve the processing speed and efficiency of the DSP.

Maximum Supply Voltage: 1.44 V

This allows for flexibility in power supply options and ensures stable operation.

Address Bus Width: 32

A wider address bus allows for larger memory addressability which is essential for data processing.

Package Shape: SQUARE

Square packages are more space-efficient and can be easily mounted on a circuit board.

Bit Size: 32

A 32-bit architecture allows for handling large chunks of data efficiently and performing complex calculations.

Power Supplies (V): 1.4,3.3

Supporting multiple power supply voltages enables compatibility with various systems and applications.

No. of Terminals: 532

A higher number of terminals provide more connectivity options for interfacing with other components.

Maximum Operating Temperature: 90 °C

With a high maximum operating temperature, this DSP can function reliably in demanding environments.

Minimum Operating Temperature: 0 °C

The ability to operate at low temperatures ensures reliable performance in a wide range of conditions.

Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)

This terminal finish offers good conductivity and corrosion resistance for long-term reliability.

RAM Words: 16384

Having a large RAM capacity allows for storing and processing a significant amount of data.

Maximum Clock Frequency: 75.18 MHz

A high clock frequency enables fast data processing and execution of instructions.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, ideal for digital signal processing.

Terminal Form: BALL

Ball terminals offer reliability and ease of soldering for secure connections on the circuit board.

Maximum Supply Current: 125 mA

Operating at a low supply current helps in reducing power consumption and heat dissipation.

No. of DMA Channels: 64

Having multiple DMA channels allows for efficient data transfer between memory and peripherals.

Format: FIXED POINT

Fixed-point format simplifies arithmetic operations and can be more efficient in DSP applications.

Low Power Mode: YES

The availability of a low power mode helps in conserving energy and extending battery life in portable devices.

Technical Specifications

Digital Signal Processors (DSPs) TMS32C6415EZLZ6E3 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3VI/O SUPPLY

Address Bus Width:

32

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

75.18 MHz

External Data Bus Width:

64

Format:

FIXED POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B532

JESD-609 Code:

e1

Length:

23 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of DMA Channels:

64

No. of External Interrupts:

4

No. of Terminals:

532

No. of Timers:

3

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA532,26X26,32

Package Shape:

Package Style (Meter):

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.4,3.3

Qualification:

Not Qualified

RAM Words:

16384

Maximum Seated Height:

3.3 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

125 mA

Maximum Supply Voltage:

1.44 V

Minimum Supply Voltage:

1.36 V

Nominal Supply Voltage:

1.4 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

23 mm

Peripheral IC Type:

Trade Compliance

TMS32C6415EZLZ6E3 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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