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TMS32C6414EZLZA5E0

Texas Instruments

TMS32C6414EZLZA5E0 by Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 532; Package Code: HFBGA; Package Shape: SQUARE;

Median Price

$122.490

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 126 parts In-Stock

1+ parts

$122.490

100+ parts

$115.140

1k+ parts

$107.790

10k+ parts

-

126

$122.490

$115.140

$107.790

-

DigiKey

USA . 136 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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136

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-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,682 parts In-Stock

1+ parts

$135.451

100+ parts

-

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4,682

$135.451

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DigiKey Marketplace

USA . 136 parts In-Stock

1+ parts

$137.310

100+ parts

-

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136

$137.310

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Vyrian

USA . 7,813 parts In-Stock

1+ parts

-

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-

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7,813

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Chip Stock

USA . 355 parts In-Stock

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-

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355

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 2,365 parts In-Stock

1+ parts

$32.393

100+ parts

-

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2,365

$32.393

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Parana Technologies

USA . 1,121 parts In-Stock

1+ parts

$65.173

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1,121

$65.173

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DigiPath Technology Company

USA . 324 parts In-Stock

1+ parts

$71.763

100+ parts

-

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324

$71.763

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ChromeModa Solutions

Germany . 1,114 parts In-Stock

1+ parts

$73.228

100+ parts

$60.047

1k+ parts

-

10k+ parts

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1,114

$73.228

$60.047

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IDEA Electronic Components Group

UK . 425 parts In-Stock

1+ parts

$73.228

100+ parts

$69.567

1k+ parts

$65.905

10k+ parts

-

425

$73.228

$69.567

$65.905

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Ampacity Inc.

Singapore . 136 parts In-Stock

1+ parts

$121.190

100+ parts

-

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136

$121.190

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Corphita

USA . 3,351 parts In-Stock

1+ parts

$128.322

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-

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3,351

$128.322

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Microchip USA

USA . 1,133 parts In-Stock

1+ parts

$141.790

100+ parts

$138.010

1k+ parts

$136.120

10k+ parts

$134.220

1,133

$141.790

$138.010

$136.120

$134.220

QUARKTWIN TECHNOLOGY LTD

USA . 20,604 parts In-Stock

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-

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20,604

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Technical Specifications

Digital Signal Processors (DSPs) TMS32C6414EZLZA5E0 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3VI/O SUPPLY

Address Bus Width:

32

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

75.18 MHz

External Data Bus Width:

64

Format:

FIXED POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B532

JESD-609 Code:

e1

Length:

23 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of DMA Channels:

64

No. of External Interrupts:

4

No. of Terminals:

532

No. of Timers:

3

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA532,26X26,32

Package Shape:

Package Style (Meter):

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Words:

16384

Maximum Seated Height:

3.3 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

125 mA

Maximum Supply Voltage:

1.31 V

Minimum Supply Voltage:

1.19 V

Nominal Supply Voltage:

1.25 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

23 mm

Peripheral IC Type:

Trade Compliance

TMS32C6414EZLZA5E0 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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