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TMS32C6414DGLZW5E0

Texas Instruments

TMS32C6414DGLZW5E0 by Texas Instruments

TMS32C6414DGLZW5E0 by Texas Instruments is a 32-bit DSP with 4096 RAM words, 64-bit external data bus width, and 75.18 MHz max clock frequency. Ideal for digital signal processing applications due to its low power mode, fixed-point format, and boundary scan capability.

Median Price

$63.006

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 24 parts In-Stock

1+ parts

-

100+ parts

$54.650

1k+ parts

$48.900

10k+ parts

$46.020

24

-

$54.650

$48.900

$46.020

DigiKey

USA . 24 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

24

-

-

-

-

Verical

USA . 24 parts In-Stock

1+ parts

-

100+ parts

$71.362

1k+ parts

$64.525

10k+ parts

-

24

-

$71.362

$64.525

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,010 parts In-Stock

1+ parts

$57.694

100+ parts

-

1k+ parts

-

10k+ parts

-

4,010

$57.694

-

-

-

Vyrian

USA . 4,581 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,581

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 81 parts In-Stock

1+ parts

$52.117

100+ parts

-

1k+ parts

-

10k+ parts

-

81

$52.117

-

-

-

Corphita

USA . 3,874 parts In-Stock

1+ parts

$54.657

100+ parts

-

1k+ parts

-

10k+ parts

-

3,874

$54.657

-

-

-

Parana Technologies

USA . 611 parts In-Stock

1+ parts

$71.519

100+ parts

-

1k+ parts

-

10k+ parts

-

611

$71.519

-

-

-

DigiPath Technology Company

USA . 2,115 parts In-Stock

1+ parts

$78.751

100+ parts

$72.451

1k+ parts

-

10k+ parts

-

2,115

$78.751

$72.451

-

-

ChromeModa Solutions

Germany . 4,552 parts In-Stock

1+ parts

$80.358

100+ parts

$65.894

1k+ parts

-

10k+ parts

-

4,552

$80.358

$65.894

-

-

IDEA Electronic Components Group

UK . 2,031 parts In-Stock

1+ parts

$80.358

100+ parts

$76.340

1k+ parts

$72.322

10k+ parts

-

2,031

$80.358

$76.340

$72.322

-

Microchip USA

USA . 2,284 parts In-Stock

1+ parts

$134.070

100+ parts

$131.740

1k+ parts

$130.570

10k+ parts

$129.400

2,284

$134.070

$131.740

$130.570

$129.400

Overview

Unlock the power of cutting-edge technology with the TMS32C6414DGLZW5E0 by Texas Instruments. As a leader in digital signal processors, Texas Instruments delivers top-quality products that guarantee superior performance in a wide range of applications. From telecommunications to audio processing, this DSP offers unmatched value, benefits, and advantages to customers looking for efficient and reliable solutions. Experience the future of technology with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used in electronic components for its durability and resistance to heat, making the DSP reliable for long-term use.

Surface Mount: YES

Surface mount technology allows for easier assembly and compact design, making the DSP suitable for space-constrained applications.

Maximum Supply Voltage: 1.26 V

The low maximum supply voltage helps in reducing power consumption and heat generation, making the DSP energy-efficient.

Address Bus Width: 32

With a wider address bus, the DSP can efficiently handle larger amounts of data and instructions, improving processing speed.

Package Shape: SQUARE

The square package shape is space-efficient and allows for easier integration into circuit boards, enhancing overall design flexibility.

Bit Size: 32

With a 32-bit architecture, the DSP can perform complex mathematical calculations and signal processing tasks with high precision and accuracy.

Power Supplies (V): 1.2, 3.3

Having multiple power supply options allows for compatibility with a wide range of systems and voltage requirements, making the DSP versatile.

No. of Terminals: 532

The high number of terminals provides ample connectivity options for interfacing with other components and peripherals, enhancing the DSP's functionality.

Package Style (Meter): GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

The combination of these package styles offers efficient thermal management, secure mounting, and compact design, making the DSP suitable for demanding applications.

Minimum Supply Voltage: 1.14 V

The low minimum supply voltage ensures stable operation even under low power conditions, improving the overall reliability of the DSP.

Terminal Finish: TIN LEAD

Tin lead finish provides good solderability and corrosion resistance, ensuring secure connections and long-lasting performance of the DSP.

RAM Words: 4096

With a large RAM capacity, the DSP can efficiently store and access data during processing, improving overall system performance and responsiveness.

Width: 23 mm

The compact width of the DSP allows for easy integration into space-constrained designs while maintaining high functionality.

Boundary Scan: YES

Boundary scan support simplifies testing and debugging of the DSP, ensuring quicker and more efficient development and maintenance processes.

External Data Bus Width: 64

A wider external data bus allows for faster data transfer between the DSP and external devices, enhancing overall processing speed and efficiency.

Maximum Clock Frequency: 75.18 MHz

The high clock frequency enables the DSP to execute instructions and process data at a fast pace, making it suitable for real-time signal processing applications.

Internal Bus Architecture: MULTIPLE

A multiple internal bus architecture allows for parallel processing and efficient data flow within the DSP, enhancing overall performance and speed.

Length: 23 mm

The compact length of the DSP contributes to a space-saving design and easy integration into various electronic systems and devices.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Support for multiple peripheral IC types enhances the DSP's compatibility with a wide range of devices and applications, making it a versatile choice.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and fast switching speeds, making the DSP energy-efficient and reliable for long-term use.

Terminal Form: BALL

Ball terminals provide secure connections and enable easy installation of the DSP, ensuring reliable performance in various operating conditions.

Nominal Supply Voltage: 1.2 V

The nominal supply voltage ensures stable and efficient operation of the DSP under standard operating conditions, enhancing overall system reliability.

Terminal Pitch: 0.8 mm

With a small terminal pitch, the DSP allows for high-density mounting and space-efficient designs, making it suitable for compact electronic devices.

Format: FIXED POINT

Fixed-point format enables efficient arithmetic operations and accurate computation within the DSP, making it well-suited for a wide range of signal processing applications.

Moisture Sensitivity Level (MSL): 4

MSL 4 indicates the DSP's resistance to moisture absorption, ensuring reliable performance in humid environments and improving overall durability.

Low Power Mode: YES

The low power mode allows the DSP to operate at reduced power levels when not performing intensive tasks, helping to conserve energy and extend battery life in portable devices.

Technical Specifications

Digital Signal Processors (DSPs) TMS32C6414DGLZW5E0 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3VI/O SUPPLY

Address Bus Width:

32

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

75.18 MHz

External Data Bus Width:

64

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B532

JESD-609 Code:

e0

Length:

23 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

532

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA532,26X26,32

Package Shape:

Package Style (Meter):

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Words:

4096

Maximum Seated Height:

3.3 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

23 mm

Peripheral IC Type:

Trade Compliance

TMS32C6414DGLZW5E0 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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