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TMS320VC5510AZAVA2

Texas Instruments

TMS320VC5510AZAVA2 by Texas Instruments

TMS320VC5510AZAVA2 by Texas Instruments is a 16-bit DSP with integrated cache and 32-bit external data bus width. It operates at a max clock frequency of 200 MHz, making it ideal for industrial applications requiring high-speed signal processing in low power mode. With a package style of grid array and low profile, this DSP offers efficient performance within compact dimensions.

Median Price

$29.794

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 628 parts In-Stock

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$29.794

100+ parts

$26.483

1k+ parts

$19.473

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628

$29.794

$26.483

$19.473

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Mouser Electronics

USA . 373 parts In-Stock

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$44.170

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$32.800

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373

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$32.800

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Chip1Stop

Japan . 882 parts In-Stock

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$28.980

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882

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Distributors (In-Stock)

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Digiode

USA . 2,646 parts In-Stock

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$28.304

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$28.304

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Nova Conductors

Japan . 15 parts In-Stock

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$30.469

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Vyrian

USA . 1,949 parts In-Stock

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Chip Stock

USA . 619 parts In-Stock

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TME

Poland . 252 parts In-Stock

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$37.360

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Distributors (Availability)

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Ampacity Inc.

Singapore . 391 parts In-Stock

1+ parts

$24.630

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$24.630

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Corphita

USA . 2,910 parts In-Stock

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$26.815

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Netroflash

USA . 2,000 parts In-Stock

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$30.469

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$30.469

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Continental Prestige Electronics

USA . 1,360 parts In-Stock

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$30.469

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$29.860

1,360

$30.469

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$29.860

Corohmni

South Africa . 1,886 parts In-Stock

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$30.823

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$30.823

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Parana Technologies

USA . 113 parts In-Stock

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$41.974

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DigiPath Technology Company

USA . 924 parts In-Stock

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$46.219

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$42.521

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ChromeModa Solutions

Germany . 6,834 parts In-Stock

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$47.162

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$38.673

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IDEA Electronic Components Group

UK . 921 parts In-Stock

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$47.162

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$44.804

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$42.446

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921

$47.162

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$42.446

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QUARKTWIN TECHNOLOGY LTD

USA . 24,208 parts In-Stock

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Lixinc

USA . 16,636 parts In-Stock

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Argo Parts USA

USA . 4,237 parts In-Stock

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Overview

Unleash the power of cutting-edge technology with the TMS320VC5510AZAVA2 by Texas Instruments. This digital signal processor is designed to deliver superior performance and reliability, making it the perfect choice for a wide range of applications. With integrated cache, low power mode, and a maximum clock frequency of 200 MHz, this DSP offers unmatched value and benefits to customers. Whether you're working on audio processing, telecommunications, or industrial control systems, the TMS320VC5510AZAVA2 will take your projects to the next level. Trust Texas Instruments for quality and innovation that you can rely on.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable devices.

Integrated Cache: YES

The integrated cache improves processing speed and efficiency, making this DSP suitable for high-performance applications.

Surface Mount: YES

The surface mount feature enables easy installation and space-saving design, perfect for compact electronic devices.

Maximum Supply Voltage: 1.65 V

The low maximum supply voltage ensures energy efficiency and compatibility with a wide range of power sources.

On Chip Data RAM Width: 16

The 16-bit on-chip data RAM width allows for fast data processing and storage, enhancing overall performance.

Address Bus Width: 22

The wide 22-bit address bus accommodates larger memory access, making the DSP suitable for complex algorithms and tasks.

Package Shape: RECTANGULAR

The rectangular package shape offers easy integration into circuit boards and efficient use of space.

Bit Size: 16

The 16-bit processing capability provides a good balance between speed and precision for various applications.

No. of Terminals: 240

With 240 terminals, this DSP can support multiple connections and peripherals, making it versatile for different systems.

Package Style: GRID ARRAY, LOW PROFILE, FINE PITCH

The grid array, low profile, and fine pitch package style ensures efficient heat dissipation and space-saving layout.

Minimum Supply Voltage: 1.55 V

The low minimum supply voltage allows for flexibility in power management and extends battery life in portable devices.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature range makes the DSP suitable for industrial applications with varying environmental conditions.

No. of External Interrupts: 6

Having 6 external interrupts allows for efficient handling of external signals and events, enhancing system responsiveness.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature range enables reliable performance in harsh cold environments.

Terminal Finish: TIN SILVER COPPER

The terminal finish of tin, silver, and copper provides excellent conductivity and durability for reliable connections.

Terminal Position: BOTTOM

The bottom terminal position simplifies PCB layout and assembly, making it easier to integrate the DSP into electronic systems.

Maximum Seated Height: 1.4 mm

The low maximum seated height allows for slim and compact device designs without compromising on performance.

RAM Words: 163840

With 163840 RAM words, the DSP can efficiently handle large amounts of data, ideal for complex signal processing tasks.

Width: 15 mm

The compact 15mm width makes the DSP suitable for space-constrained applications without sacrificing functionality.

Boundary Scan: YES

The boundary scan feature enables easy testing and debugging of the DSP during production and maintenance stages.

External Data Bus Width: 32

The wide 32-bit external data bus width allows for high-speed data transfer between the DSP and external devices.

Maximum Clock Frequency: 200 MHz

The high maximum clock frequency ensures fast processing speeds and real-time performance for demanding applications.

Maximum Time At Peak Reflow Temperature: 30s

The short 30-second time at peak reflow temperature ensures reliable soldering during manufacturing processes.

Peak Reflow Temperature: 260C

The high peak reflow temperature tolerance allows for robust soldering connections, ensuring product longevity.

Internal Bus Architecture: MULTIPLE

The multiple internal bus architecture enhances data flow and processing efficiency within the DSP, improving overall performance.

Length: 15 mm

The 15mm length provides a compact form factor, making the DSP suitable for space-sensitive applications.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in harsh environments with wide temperature fluctuations.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

The peripheral IC type of digital signal processor, along with other functionalities, makes this DSP versatile for a range of applications.

No. of Timers: 2

With 2 timers, the DSP can manage time-sensitive tasks and scheduling functions efficiently, enhancing system control.

Technology: CMOS

The CMOS technology offers low power consumption and high noise immunity, making the DSP energy-efficient and reliable.

Terminal Form: BALL

The ball terminal form provides secure and reliable connections for stable data transfer and signal processing.

Maximum Supply Current: 112 mA

The low maximum supply current ensures power efficiency and extended battery life for portable applications.

Nominal Supply Voltage: 1.6 V

The nominal supply voltage of 1.6V provides stable power delivery for consistent performance and reliability.

No. of DMA Channels: 6

With 6 DMA channels, the DSP can efficiently manage data transfer and processing tasks, improving system throughput.

ROM Programmability: MROM

The MROM programmability ensures secure and non-volatile memory storage for critical data and program instructions.

Terminal Pitch: 0.8 mm

The 0.8mm terminal pitch allows for high-density terminal arrangements, optimizing PCB layout and space utilization.

Format: FIXED POINT

The fixed-point format offers precise numerical representation and calculation capabilities, suitable for signal processing applications.

Moisture Sensitivity Level (MSL): 3

The MSL 3 rating indicates moderate moisture sensitivity, ensuring reliable performance even in humid environments.

Low Power Mode: YES

The low power mode feature allows for energy-saving operation, making the DSP suitable for battery-powered devices.

Technical Specifications

Digital Signal Processors (DSPs) TMS320VC5510AZAVA2 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

22

Barrel Shifter:

NO

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

200 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

R-PBGA-B240

JESD-609 Code:

e1

Length:

15 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

6

No. of External Interrupts:

6

No. of Terminals:

240

No. of Timers:

2

On Chip Data RAM Width:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA240,17X17,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Words:

163840

ROM Programmability:

MROM

Maximum Seated Height:

1.4 mm

Maximum Supply Current:

112 mA

Maximum Supply Voltage:

1.65 V

Minimum Supply Voltage:

1.55 V

Nominal Supply Voltage:

1.6 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

15 mm

Peripheral IC Type:

Trade Compliance

TMS320VC5510AZAVA2 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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