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TMS320VC5509AZHHR

Texas Instruments

TMS320VC5509AZHHR by Texas Instruments

TMS320VC5509AZHHR by Texas Instruments is a 16-bit digital signal processor (DSP) with a max clock frequency of 50 MHz. It has 128K RAM words and is suitable for industrial applications requiring low power mode and flash ROM programmability.

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AZTECH Wire

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Parana Technologies

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DigiPath Technology Company

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IDEA Electronic Components Group

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Ampacity Inc.

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Overview

Experience the power of the TMS320VC5509AZHHR by Texas Instruments, a state-of-the-art Digital Signal Processor (DSP) that delivers unmatched quality and performance. With Texas Instruments' renowned reputation for excellence, you can trust in the reliability and durability of this product. The TMS320VC5509AZHHR is perfect for a wide range of applications, from audio processing to telecommunications. Unlock endless possibilities with its advanced features and cutting-edge technology. Don't miss out on the value, benefits, and advantages this exceptional product offers to customers like you.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This product's use of plastic/epoxy as the package body material makes it lightweight and cost-effective, suitable for various applications.

Surface Mount: YES

The surface mount capability of this product allows for easy integration onto circuit boards, improving space utilization and assembly efficiency.

Maximum Supply Voltage: 1.65 V

With a maximum supply voltage of 1.65 V, this DSP ensures efficient power consumption, making it an energy-efficient option for electronic devices.

On Chip Data RAM Width: 16

The 16-bit on-chip data RAM width enhances the processing capabilities of this DSP, enabling it to handle complex signal processing tasks effectively.

Address Bus Width: 21

The 21-bit address bus width provides a large address space, enabling the DSP to access a wide range of external memory efficiently, enhancing its functionality.

Package Shape: SQUARE

The square package shape ensures easy mounting and compatibility with various board layouts, making it suitable for compact designs.

Bit Size: 16

The 16-bit bit size of this DSP allows for precise and accurate signal processing, ensuring high-quality audio and data processing performance.

Power Supplies (V): 1.6,3.3

Supporting multiple power supply voltages (1.6 V and 3.3 V), this DSP offers flexibility in power management, enabling it to be used in diverse applications.

No. of Terminals: 179

With 179 terminals, this DSP provides a wide range of input and output connections, allowing for extensive connectivity and integration possibilities.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The grid array, low-profile, and fine pitch package style ensures high-density mounting and excellent thermal dissipation, making it suitable for space-constrained applications.

Minimum Supply Voltage: 1.55 V

The minimum supply voltage requirement of 1.55 V allows for low-power operation, reducing energy consumption and extending battery life in portable devices.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this DSP can withstand high-temperature environments, providing reliable performance in demanding conditions.

No. of External Interrupts: 5

The availability of 5 external interrupts allows this DSP to respond to various external events swiftly, enhancing its versatility in real-time systems.

Minimum Operating Temperature: -40 °C

The capability to operate at a minimum temperature of -40°C ensures reliable performance even in low-temperature environments, expanding its range of applications.

Terminal Finish: TIN SILVER COPPER

The terminal finish of tin silver copper enhances the product's solderability, ensuring a reliable electrical connection during manufacturing processes.

Terminal Position: BOTTOM

The bottom terminal position simplifies PCB layout and assembly, optimizing space utilization and facilitating ease of integration.

Maximum Seated Height: 1.4 mm

With a maximum seated height of 1.4 mm, this DSP offers a compact form factor, enabling its use in slim and lightweight designs.

RAM Words: 128K

This DSP's 128K RAM words provide ample memory for storing and processing data, allowing for seamless execution of complex algorithms and applications.

Width: 12 mm

The 12 mm width of this DSP makes it suitable for various board sizes and compact electronic devices, enabling versatile application integration.

Boundary Scan: YES

The inclusion of boundary scan capability simplifies testing and fault detection, ensuring easier and more efficient troubleshooting during the manufacturing process.

External Data Bus Width: 16

The 16-bit external data bus width facilitates efficient data transfer between the DSP and external peripherals, improving overall system performance.

Maximum Clock Frequency: 50 MHz

With a maximum clock frequency of 50 MHz, this DSP can perform high-speed signal processing tasks, ensuring real-time processing and responsiveness.

Maximum Time At Peak Reflow Temperature (s): 30

This DSP can withstand a peak reflow temperature for a maximum time of 30 seconds, ensuring reliable soldering during assembly processes.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C guarantees proper solder joint formation, ensuring the integrity and reliability of connections in manufacturing processes.

Internal Bus Architecture: MULTIPLE

The multiple internal bus architecture of this DSP allows for efficient data transfer and processing, improving overall performance and throughput.

Length: 12 mm

With a length of 12 mm, this compact DSP enables space-saving designs and versatility in various electronic applications.

Temperature Grade: INDUSTRIAL

The industrial temperature grade rating ensures reliable operation in harsh environmental conditions, making this product suitable for industrial applications.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

This DSP's peripheral IC type combines digital signal processing capabilities with additional functionality, offering enhanced versatility for a wide range of applications.

No. of Timers: 2

The inclusion of 2 timers provides timing and synchronization capabilities, allowing for efficient scheduling and control in time-critical applications.

Technology: CMOS

Built using complementary metal-oxide-semiconductor (CMOS) technology, this DSP offers low power consumption, high noise immunity, and excellent integration possibilities.

Terminal Form: BALL

The ball terminal form simplifies the mounting and soldering process, ensuring a secure and reliable connection during assembly and manufacturing.

Maximum Supply Current: 5.5 mA

With a maximum supply current of 5.5 mA, this DSP operates with low power consumption, making it suitable for battery-powered devices and energy-efficient applications.

Nominal Supply Voltage: 1.6 V

The nominal supply voltage rating of 1.6 V ensures stable and consistent power delivery, ensuring reliable and consistent operation of the DSP.

No. of DMA Channels: 6

The availability of 6 DMA channels enables efficient data transfer and offloads the CPU, optimizing the DSP's performance in data-intensive applications.

ROM Programmability: FLASH

The flash ROM programmability feature allows for easy firmware updates and customization, ensuring flexibility and adaptability for changing application requirements.

Terminal Pitch: 0.8 mm

With a terminal pitch of 0.8 mm, this DSP offers precise and compact connections, enabling reliable signal transmission and reduced electromagnetic interference.

Format: FIXED POINT

Operating with a fixed-point format, this DSP provides efficient and accurate numerical calculations, ensuring precise signal processing and algorithm execution.

Moisture Sensitivity Level (MSL): 3

With an MSL rating of 3, this DSP can withstand moderate levels of moisture exposure during storage and assembly processes, ensuring product reliability.

Low Power Mode: YES

The availability of a low power mode allows for reduced power consumption during idle or low-processing periods, extending battery life and improving energy efficiency.

On Chip Program ROM Width: 16

The on-chip program ROM width of 16 bits provides ample storage for program code, enabling efficient execution of complex algorithms and signal processing tasks.

Technical Specifications

Digital Signal Processors (DSPs) TMS320VC5509AZHHR attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES AT 1.2V AND 1.35V SUPPLY

Address Bus Width:

21

Barrel Shifter:

NO

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

50 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B179

JESD-609 Code:

e1

Length:

12 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

6

No. of External Interrupts:

5

No. of Terminals:

179

No. of Timers:

2

On Chip Data RAM Width:

16

On Chip Program ROM Width:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA179,14X14,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.6,3.3

Qualification:

Not Qualified

RAM Words:

128K

ROM Programmability:

FLASH

Maximum Seated Height:

1.4 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

5.5 mA

Maximum Supply Voltage:

1.65 V

Minimum Supply Voltage:

1.55 V

Nominal Supply Voltage:

1.6 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

12 mm

Peripheral IC Type:

Trade Compliance

TMS320VC5509AZHHR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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