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TMS320VC5509AZHH

Texas Instruments

TMS320VC5509AZHH by Texas Instruments

TMS320VC5509AZHH by Texas Instruments is a 16-bit digital signal processor (DSP) with a max clock frequency of 50 MHz. It has 128K RAM words and can operate in low power mode. This DSP is commonly used in industrial applications requiring high-speed processing and low power consumption.

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AZTECH Wire

Italy . 478 parts In-Stock

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Parana Technologies

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IDEA Electronic Components Group

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Overview

Experience the power and precision of the TMS320VC5509AZHH by Texas Instruments. As a leader in digital signal processors (DSPs), Texas Instruments ensures top-notch quality and reliability in every product. The TMS320VC5509AZHH offers unparalleled performance for a wide range of applications, from audio and video processing to telecommunications and industrial control systems. With its low power mode and advanced features, this DSP delivers exceptional value and benefits to customers. Discover the advantages of Texas Instruments and unlock endless possibilities with the TMS320VC5509AZHH.

Feature Benefit Bullets

Package Body Material

PLASTIC/EPOXY - This material ensures the product's durability and resistance to environmental factors, making it suitable for various applications.

Surface Mount

YES - Surface mount capability allows for easier integration and space-saving in electronic designs.

Maximum Supply Voltage

1.65 V - This higher supply voltage capability enables the product to handle a wide range of power input levels.

On Chip Data RAM Width

16 - With a wide on-chip data RAM width, the product can efficiently process and store a large amount of data simultaneously.

Address Bus Width

21 - The wide address bus width enhances the product's memory addressing capability, enabling it to handle larger memory spaces.

Package Shape

SQUARE - The square package shape provides a compact and symmetrical form, allowing for efficient use of space on circuit boards.

Bit Size

16 - The 16-bit processing capability allows for high-resolution and accurate signal processing, resulting in improved /formance.

Power Supplies (V)

1.6,3.3 - The product supports multiple power supply voltages, offering flexibility and compatibility with different system requirements.

No. of Terminals

179 - With a high number of terminals, the product allows for versatile connectivity options and integration with various external components.

Package Style (Meter)

GRID ARRAY, LOW PROFILE, FINE PITCH - The grid array package style, along with a low profile and fine pitch, enables efficient and reliable PCB assembly, especially in space-constrained environments.

Minimum Supply Voltage

1.55 V - The product's ability to o/ate reliably at a low supply voltage makes it energy-efficient and suitable for low-power applications.

Maximum O/ating Tem/ature

85 °C - The high maximum o/ating tem/ature ensures the product's reliability and /formance even under demanding environmental conditions.

No. of External Interrupts

5 - The presence of multiple external interrupts allows the product to respond to various external events, enhancing its versatility and real-time processing capabilities.

Minimum O/ating Tem/ature

40 °C - The ability to o/ate at extremely low tem/atures makes the product suitable for use in harsh or extreme environments.

Terminal Finish

TIN SILVER COP/ - The terminal finish composition provides excellent electrical conductivity and corrosion resistance, ensuring long-term reliability.

Terminal Position

BOTTOM - The terminal position at the bottom of the package facilitates easy soldering and efficient PCB layout.

Maximum Seated Height

1.4 mm - The low maximum seated height allows for compact and slim designs, making it ideal for applications with space constraints.

RAM Words

128K - With a large RAM capacity, the product can handle extensive data storage and processing requirements.

Width

12 mm - The compact width dimension allows for space-efficient integration into electronic designs.

Boundary Scan

YES - The presence of boundary scan capability simplifies testing and debugging processes during manufacturing, increasing the product's overall yield and reliability.

External Data Bus Width

16 - The wide external data bus width enables efficient data transfer between the product and external components, enhancing system /formance.

Maximum Clock Frequency

50 MHz - The high maximum clock frequency allows for fast and responsive signal processing, contributing to improved system /formance.

Maximum Time At Peak Reflow Tem/ature (s)

30 - The product's ability to withstand peak reflow tem/ature for a specified duration ensures its reliability during manufacturing processes.

Peak Reflow Tem/ature °C

260 - The high peak reflow tem/ature capability enables the product to withstand the required soldering tem/atures during assembly, ensuring robust connections.

Internal Bus Architecture

MULTIPLE - The multiple internal bus architecture enhances data flow and communication within the product, resulting in efficient and parallel processing capabilities.

Length

12 mm - The compact length dimension allows for space-efficient integration into electronic designs.

Tem/ature Grade

INDUSTRIAL - Designed for industrial applications, this tem/ature grade ensures the product's reliability and /formance in harsh o/ating conditions.

/ipheral IC Type

DIGITAL SIGNAL PROCESSOR, OTHER - The product's /ipheral IC type, being a digital signal processor, provides specialized processing capabilities and compatibility with various digital signal processing algorithms.

No. of Timers

2 - The inclusion of multiple timers provides accurate timing and synchronization functionalities, making the product suitable for applications requiring precise control.

Technology

CMOS - The use of CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of electronic designs.

Terminal Form

BALL - The ball terminal form facilitates reliable and efficient soldering, especially for surface-mount applications.

Maximum Supply Current

5.5 mA - The low maximum supply current consumption helps in reducing power consumption, making it suitable for battery-powered or energy-efficient applications.

Nominal Supply Voltage

1.6 V - The specified nominal supply voltage ensures a stable and consistent power input, contributing to the product's reliable /formance.

No. of DMA Channels

6 - The provision of multiple DMA channels allows for efficient and high-speed data transfer, improving overall system /formance.

ROM Programmability

FLASH - The product's ROM programmability using flash technology provides flexibility for firmware updates, customization, and adaptability to evolving requirements.

Terminal Pitch

0.8 mm - The small terminal pitch enables higher pin density and allows for compact and high-/formance PCB designs.

Format

FIXED POINT - The fixed-point format allows for precise and efficient numerical calculations, which is advantageous for applications requiring accurate signal processing.

Moisture Sensitivity Level (MSL)

3 - The product's MSL level indicates its resistance to moisture, ensuring its reliability and preventing damage during storage or soldering.

Low Power Mode

YES - The availability of a low power mode allows the product to conserve energy while not compromising its /formance, making it ideal for battery-powered or energy-conscious applications.

On Chip Program ROM Width

16 - With a wide on-chip program ROM width, the product can store a larger amount of program code, facilitating complex signal processing and algorithm execution.

Technical Specifications

Digital Signal Processors (DSPs) TMS320VC5509AZHH attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES AT 1.2V AND 1.35V SUPPLY

Address Bus Width:

21

Barrel Shifter:

NO

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

50 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B179

JESD-609 Code:

e1

Length:

12 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

6

No. of External Interrupts:

5

No. of Terminals:

179

No. of Timers:

2

On Chip Data RAM Width:

16

On Chip Program ROM Width:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA179,14X14,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.6,3.3

Qualification:

Not Qualified

RAM Words:

128K

ROM Programmability:

FLASH

Maximum Seated Height:

1.4 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

5.5 mA

Maximum Supply Voltage:

1.65 V

Minimum Supply Voltage:

1.55 V

Nominal Supply Voltage:

1.6 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

12 mm

Peripheral IC Type:

Trade Compliance

TMS320VC5509AZHH Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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