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TMS320VC5507GHH

Texas Instruments

TMS320VC5507GHH by Texas Instruments

TMS320VC5507GHH by Texas Instruments is a 16-bit DSP with 179 terminals, operating at up to 50 MHz. It features 65536 RAM words and supports boundary scan. Ideal for industrial applications requiring low power consumption and high-speed signal processing capabilities.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Vyrian

USA . 5,521 parts In-Stock

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Digiode

USA . 3,933 parts In-Stock

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

USA . 23 parts In-Stock

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LWI Electronics Inc

India . 1 parts In-Stock

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AZTECH Wire

Italy . 347 parts In-Stock

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$13.483

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One Stop Electronics

USA . 243 parts In-Stock

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$22.000

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

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$25.750

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$23.433

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$21.115

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$25.750

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Parana Technologies

USA . 267 parts In-Stock

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$59.313

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DigiPath Technology Company

USA . 1,375 parts In-Stock

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$65.311

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ChromeModa Solutions

Germany . 847 parts In-Stock

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$66.644

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$54.648

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IDEA Electronic Components Group

UK . 238 parts In-Stock

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$66.644

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$63.312

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$59.980

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Corohmni

South Africa . 665 parts In-Stock

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Corphita

USA . 4,473 parts In-Stock

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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Perfect Parts

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Microchip USA

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Overview

Experience unparalleled performance and reliability with the TMS320VC5507GHH by Texas Instruments, a leading manufacturer in the field of Digital Signal Processors. This versatile product offers a wide range of applications and benefits, making it the ideal choice for customers looking for top-notch quality and value. From its low power mode to its advanced technology, this DSP ensures seamless functionality and efficiency, setting a new standard in the industry. Upgrade your projects with the TMS320VC5507GHH and discover the endless possibilities it has to offer.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Maximum Supply Voltage: 1.65 V

Allows for efficient power usage while providing enough voltage for the processor to function optimally.

RAM Words: 65536

Large RAM capacity allows for smooth and efficient processing of a high volume of data.

Maximum Clock Frequency: 50 MHz

High clock frequency enables fast processing speeds for applications requiring real-time data analysis.

Temperature Grade: INDUSTRIAL

Suitable for use in industrial environments with wide temperature ranges, ensuring consistent performance in challenging conditions.

Technical Specifications

Digital Signal Processors (DSPs) TMS320VC5507GHH attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES AT 1.2V AND 1.35 V SUPPLY

Address Bus Width:

21

Barrel Shifter:

NO

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

50 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B179

JESD-609 Code:

e0

Length:

12 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

6

No. of External Interrupts:

5

No. of Terminals:

179

No. of Timers:

3

On Chip Data RAM Width:

16

On Chip Program ROM Width:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA179,14X14,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

220

Power Supplies (V):

1.6,3.3

Qualification:

Not Qualified

RAM Words:

65536

ROM Programmability:

MROM

Maximum Seated Height:

1.4 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.65 V

Minimum Supply Voltage:

1.55 V

Nominal Supply Voltage:

1.6 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

20

Width:

12 mm

Peripheral IC Type:

Trade Compliance

TMS320VC5507GHH Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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