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TMS320VC5502GZZ200

Texas Instruments

TMS320VC5502GZZ200 by Texas Instruments

TMS320VC5502GZZ200 by Texas Instruments is a 16-bit DSP with integrated cache, 32-bit external data bus width, and 50 MHz max clock frequency. Ideal for industrial applications requiring low power consumption and fixed-point format processing.

Median Price

$7.360

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

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Rochester

USA . 82 parts In-Stock

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$7.360

100+ parts

$7.210

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$7.070

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Distributors (In-Stock)

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Digiode

USA . 2,680 parts In-Stock

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$6.992

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Vyrian

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Chip Stock

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Semi Source

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Euro-Tech

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Pegasus Components GmbH

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R&J Components

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Distributors (Availability)

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Corphita

USA . 3,046 parts In-Stock

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$6.624

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Advanced Electronics

New Zealand . 450 parts In-Stock

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$13.831

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$12.586

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$11.341

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AZTECH Wire

Italy . 505 parts In-Stock

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Corohmni

South Africa . 1,088 parts In-Stock

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Parana Technologies

USA . 2,209 parts In-Stock

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$33.959

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$3,153.593

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DigiPath Technology Company

USA . 1,627 parts In-Stock

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$37.393

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$34.401

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ChromeModa Solutions

Germany . 6,765 parts In-Stock

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$38.156

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$31.288

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IDEA Electronic Components Group

UK . 2,176 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 16,579 parts In-Stock

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Microchip USA

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Authorized Procurement Solutions

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Kepictronics

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Overview

Unleash the power of advanced digital signal processing with the TMS320VC5502GZZ200 by Texas Instruments. Designed with precision and expertise, this DSP offers unparalleled performance and efficiency for a wide range of applications. From audio processing to communications systems, this versatile device delivers top-notch quality and reliability. With integrated cache and low power mode, customers can enjoy seamless operation and enhanced functionality. Experience the difference with Texas Instruments and elevate your projects to new heights with the TMS320VC5502GZZ200.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product suitable for a wide range of applications.

Integrated Cache: YES

Having an integrated cache improves the processing speed and efficiency of the DSP, making it ideal for high-performance tasks.

Maximum Supply Voltage: 1.32 V

Being able to operate at a relatively high supply voltage ensures stable performance under varying conditions.

On Chip Data RAM Width: 16

With a wide data RAM width, the DSP can handle large amounts of data simultaneously, enhancing its processing capabilities.

Address Bus Width: 20

A wide address bus allows for efficient memory addressing, enabling the DSP to access data quickly and accurately.

Package Shape: SQUARE

The square package shape is space-efficient and easy to mount, making it suitable for compact electronic devices.

Bit Size: 16

Having a 16-bit architecture offers a good balance between performance and power efficiency, making the DSP suitable for a wide range of applications.

Power Supplies (V): 1.2,3.3

Supporting multiple power supply options allows for flexible integration into various systems and ensures compatibility with different voltage requirements.

No. of Terminals: 201

Having a large number of terminals provides ample connectivity options for interfacing with other components, making the DSP versatile and adaptable.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The package style offers a compact footprint, low profile design, and fine pitch for efficient mounting and space-saving in electronic assemblies.

Minimum Supply Voltage: 1.2 V

Operating at a low minimum supply voltage ensures energy efficiency and reliability, especially in battery-powered devices.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the DSP can function reliably in harsh environmental conditions without overheating.

No. of External Interrupts: 4

Supporting multiple external interrupts allows the DSP to respond quickly to external events and signals, enhancing its real-time processing capabilities.

Minimum Operating Temperature: -40 °C

Being able to operate at low temperatures makes the DSP suitable for use in cold environments or industrial applications where temperature extremes are common.

Terminal Finish: TIN LEAD

The terminal finish provides good conductivity and reliability for secure connections, ensuring stable performance of the DSP.

Terminal Position: BOTTOM

Having terminals positioned at the bottom simplifies the mounting process and improves thermal management in the system, enhancing overall performance and reliability.

RAM Words: 32768

With a large RAM capacity, the DSP can store and access a significant amount of data for processing complex algorithms and tasks efficiently.

Width: 15 mm

Having a compact width allows for space-saving integration of the DSP in electronic systems, especially in size-constrained applications.

Boundary Scan: YES

Supporting boundary scan capability allows for easy testing and debugging of the DSP during manufacturing and maintenance, ensuring product quality and reliability.

External Data Bus Width: 32

With a wide external data bus, the DSP can transfer data at high speeds and handle large datasets efficiently, making it suitable for data-intensive applications.

Maximum Clock Frequency: 50 MHz

Operating at a high clock frequency enables fast data processing and response times, making the DSP suitable for real-time applications and high-speed computations.

Maximum Time At Peak Reflow Temperature (s): 20

Having a short reflow time at peak temperature ensures efficient soldering during manufacturing, reducing production time and cost.

Peak Reflow Temperature °C: 220

The peak reflow temperature allows for reliable soldering of the DSP in manufacturing processes, ensuring secure connections and optimal performance.

Internal Bus Architecture: MULTIPLE

Having multiple internal buses improves data throughput and allows for concurrent processing of multiple instructions, enhancing the overall performance of the DSP.

Length: 15 mm

With a compact length, the DSP can be easily integrated into space-constrained devices and electronic systems without compromising performance or functionality.

Temperature Grade: INDUSTRIAL

Being rated for industrial temperature range ensures reliable operation in demanding environments, making the DSP suitable for industrial automation and control applications.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

The DSP's peripheral IC type indicates its specialized processing capabilities for digital signals and other functions, making it suitable for specific application requirements.

No. of Timers: 4

Supporting multiple timers allows for precise event scheduling and timing functions, enhancing the DSP's ability to coordinate tasks and manage time-sensitive operations.

Technology: CMOS

Utilizing CMOS technology offers low power consumption, high speed, and reliability, making the DSP energy-efficient and suitable for battery-powered devices or portable applications.

Terminal Form: BALL

Having ball terminals facilitates secure connections and simplifies mounting and soldering processes, ensuring reliable performance and durability.

Maximum Supply Current: 239 mA

Operating at a moderate supply current level ensures efficient power consumption and thermal management, making the DSP suitable for various power-sensitive applications.

Nominal Supply Voltage: 1.26 V

Having a stable nominal supply voltage ensures consistent and reliable operation of the DSP, improving overall performance and reducing the risk of voltage fluctuations.

No. of DMA Channels: 6

Supporting multiple DMA channels allows for efficient data transfer and processing, offloading the CPU and enhancing system performance for data-intensive tasks.

ROM Programmability: MROM

Having MROM (Mask ROM) programmability offers secure and non-volatile storage for firmware and software, ensuring data integrity and preventing unauthorized modifications.

Terminal Pitch: 0.8 mm

The tight terminal pitch allows for high-density mounting and space-saving integration, making the DSP suitable for compact and lightweight electronic devices.

Format: FIXED POINT

Operating in fixed-point format offers fast and efficient arithmetic processing, suitable for real-time signal processing and control applications requiring precise calculations.

Moisture Sensitivity Level (MSL): 3

With a moderate MSL level, the DSP can withstand typical manufacturing and storage conditions, ensuring product reliability and performance over time.

Low Power Mode: YES

Having a low power mode option allows the DSP to operate in energy-efficient modes, extending battery life and reducing power consumption in standby or idle states.

On Chip Program ROM Width: 16

With a wide on-chip program ROM width, the DSP can store and execute program instructions efficiently, optimizing performance for algorithmic tasks and data processing.

Technical Specifications

Digital Signal Processors (DSPs) TMS320VC5502GZZ200 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

20

Barrel Shifter:

NO

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

50 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B201

JESD-609 Code:

e0

Length:

15 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

6

No. of External Interrupts:

4

No. of Terminals:

201

No. of Timers:

4

On Chip Data RAM Width:

16

On Chip Program ROM Width:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA201,17X17,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

220

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Words:

32768

ROM Programmability:

MROM

Maximum Seated Height:

1.4 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

239 mA

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.2 V

Nominal Supply Voltage:

1.26 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

20

Width:

15 mm

Peripheral IC Type:

Trade Compliance

TMS320VC5502GZZ200 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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