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TMS320VC5410APGE16

Texas Instruments

TMS320VC5410APGE16 by Texas Instruments

TMS320VC5410APGE16 by Texas Instruments is a 16-bit DSP with 23-bit address bus, operating at max 20 MHz. Ideal for industrial applications, it features low power mode, on-chip data RAM of 16 bits and ROM programmability.

Median Price

$37.050

Lifecycle Status

Suppliers In-Stock

15

In-Stock Inventory

1k+

Distributors (Authorized)

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Texas Instruments

USA . 70 parts In-Stock

1+ parts

$24.627

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$21.891

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$16.096

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70

$24.627

$21.891

$16.096

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Chip1Stop

Japan . 30 parts In-Stock

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$37.000

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$24.500

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$20.400

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$37.000

$24.500

$20.400

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DigiKey

USA . 56 parts In-Stock

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$37.100

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$27.179

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$25.505

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56

$37.100

$27.179

$25.505

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Mouser Electronics

USA . 16 parts In-Stock

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$37.100

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$27.180

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$25.500

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16

$37.100

$27.180

$25.500

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Distributors (In-Stock)

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Digiode

USA . 3,369 parts In-Stock

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$23.396

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3,369

$23.396

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Nova Conductors

Japan . 700 parts In-Stock

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$28.007

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$28.007

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Vyrian

USA . 5,400 parts In-Stock

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Chip Stock

USA . 3,900 parts In-Stock

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3,900

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Sternenhof Electronics

Switzerland . 140 parts In-Stock

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Rebound Electronics

UK . 84 parts In-Stock

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Velocity Electronics

USA . 60 parts In-Stock

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Pride Electronics

USA . 43 parts In-Stock

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PC Components Company LLC

USA . 22 parts In-Stock

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Bristol Electronics

USA . 19 parts In-Stock

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J & M Industries LLC

USA . 3 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 260 parts In-Stock

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$14.894

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$14.894

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Corphita

USA . 1,641 parts In-Stock

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$22.164

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$22.164

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Parana Technologies

USA . 513 parts In-Stock

1+ parts

$24.128

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$24.779

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513

$24.128

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$24.779

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ChromeModa Solutions

Germany . 4,083 parts In-Stock

1+ parts

$27.110

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$22.230

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4,083

$27.110

$22.230

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IDEA Electronic Components Group

UK . 765 parts In-Stock

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$27.110

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$25.754

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$24.399

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765

$27.110

$25.754

$24.399

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Aranea Global

USA . 50 parts In-Stock

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$27.447

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$26.349

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50

$27.447

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$26.349

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Continental Prestige Electronics

USA . 4,729 parts In-Stock

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$28.007

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$27.447

4,729

$28.007

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$27.447

Ampacity Inc.

Singapore . 70 parts In-Stock

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$45.560

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Corohmni

South Africa . 73 parts In-Stock

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$73.560

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iodParts Technologies Inc.

India . 30,000 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 29,999 parts In-Stock

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Lixinc

USA . 1,961 parts In-Stock

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Perfect Parts

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Argo Parts USA

USA . 973 parts In-Stock

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A-Z Elektronik GmbH

Germany . 722 parts In-Stock

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Metaverse IC Inc.

Canada . 578 parts In-Stock

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GreenTree Electronics

Israel . 410 parts In-Stock

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DigiPath Technology Company

USA . 249 parts In-Stock

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$24.442

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249

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$24.442

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Overview

Unlock the full potential of your digital signal processing projects with the TMS320VC5410APGE16 by Texas Instruments. Known for their high-quality products, Texas Instruments delivers cutting-edge technology in the form of this DSP, perfect for a wide range of applications. With its advanced features and flexible design, this DSP offers unmatched value, benefits, and advantages to customers looking to enhance their audio, video, and communication systems. Choose Texas Instruments for superior performance and reliability in all your DSP needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protection for the internal components of the DSP, ensuring long-term reliability.

Surface Mount: YES

Surface mount technology allows for easy and compact assembly of the DSP onto PCBs, saving space and simplifying the manufacturing process.

Maximum Supply Voltage: 1.65 V

Operates efficiently with a low maximum supply voltage, reducing power consumption and heat dissipation.

On Chip Data RAM Width: 16

Wide on-chip data RAM width allows for faster processing and storage of data, enabling high-performance signal processing capabilities.

Address Bus Width: 23

Wide address bus width enables access to a large memory space, accommodating complex algorithms and extensive data processing tasks.

No. of External Interrupts: 4

Multiple external interrupts allow for efficient handling of external events or signals, improving responsiveness and real-time processing capabilities.

Maximum Clock Frequency: 20 MHz

High maximum clock frequency enables fast execution of instructions and real-time signal processing, suitable for time-sensitive applications.

Technical Specifications

Digital Signal Processors (DSPs) TMS320VC5410APGE16 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

23

Barrel Shifter:

YES

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

20 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e4

Length:

20 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of DMA Channels:

6

No. of External Interrupts:

4

No. of Terminals:

144

No. of Timers:

1

On Chip Data RAM Width:

16

On Chip Program ROM Width:

16

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP144,.87SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.6,3/3.3

Qualification:

Not Qualified

RAM Words:

65536

ROM Programmability:

MROM

Maximum Seated Height:

1.6 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.65 V

Minimum Supply Voltage:

1.55 V

Nominal Supply Voltage:

1.6 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

20 mm

Peripheral IC Type:

Trade Compliance

TMS320VC5410APGE16 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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