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TMS320VC5402PGER10

Texas Instruments

TMS320VC5402PGER10 by Texas Instruments

TMS320VC5402PGER10 by Texas Instruments is a 16-bit DSP with 20mm width, operating at max. 20MHz clock frequency. It features 16384 RAM words and supports boundary scan. Ideal for industrial applications requiring low power consumption and fixed-point format processing.

Median Price

$9.148

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 5,140 parts In-Stock

1+ parts

$9.148

100+ parts

$7.991

1k+ parts

$5.511

10k+ parts

-

5,140

$9.148

$7.991

$5.511

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 693 parts In-Stock

1+ parts

$8.691

100+ parts

-

1k+ parts

-

10k+ parts

-

693

$8.691

-

-

-

Nova Conductors

Japan . 900 parts In-Stock

1+ parts

$9.589

100+ parts

-

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-

10k+ parts

-

900

$9.589

-

-

-

Vyrian

USA . 4,976 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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4,976

-

-

-

-

Bristol Electronics

USA . 106 parts In-Stock

1+ parts

-

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-

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106

-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 4,796 parts In-Stock

1+ parts

$7.780

100+ parts

-

1k+ parts

-

10k+ parts

-

4,796

$7.780

-

-

-

Corphita

USA . 2,745 parts In-Stock

1+ parts

$8.233

100+ parts

-

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-

10k+ parts

-

2,745

$8.233

-

-

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AZTECH Wire

Italy . 968 parts In-Stock

1+ parts

$8.350

100+ parts

-

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-

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968

$8.350

-

-

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Continental Prestige Electronics

USA . 227 parts In-Stock

1+ parts

$9.589

100+ parts

-

1k+ parts

-

10k+ parts

$9.397

227

$9.589

-

-

$9.397

iBuyXS LLC

. 106 parts In-Stock

1+ parts

$18.000

100+ parts

-

1k+ parts

-

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106

$18.000

-

-

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Corohmni

South Africa . 293 parts In-Stock

1+ parts

$28.504

100+ parts

-

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-

10k+ parts

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293

$28.504

-

-

-

Parana Technologies

USA . 144 parts In-Stock

1+ parts

$76.503

100+ parts

$7,104.429

1k+ parts

$68.852

10k+ parts

-

144

$76.503

$7,104.429

$68.852

-

DigiPath Technology Company

USA . 1,194 parts In-Stock

1+ parts

$84.239

100+ parts

$77.500

1k+ parts

-

10k+ parts

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1,194

$84.239

$77.500

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-

ChromeModa Solutions

Germany . 3,686 parts In-Stock

1+ parts

$85.958

100+ parts

$70.486

1k+ parts

-

10k+ parts

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3,686

$85.958

$70.486

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IDEA Electronic Components Group

UK . 1,508 parts In-Stock

1+ parts

$85.958

100+ parts

$81.660

1k+ parts

$77.362

10k+ parts

-

1,508

$85.958

$81.660

$77.362

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QUARKTWIN TECHNOLOGY LTD

USA . 13,930 parts In-Stock

1+ parts

-

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13,930

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Argo Parts USA

USA . 3,220 parts In-Stock

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3,220

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Infinite Electronics LLP (Excess)

. 113 parts In-Stock

1+ parts

-

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113

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BidChips

USA . 106 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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106

-

-

-

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Netroflash

USA . 100 parts In-Stock

1+ parts

-

100+ parts

$9.397

1k+ parts

$9.110

10k+ parts

$8.918

100

-

$9.397

$9.110

$8.918

Overview

Unlock the power of digital signal processing with the TMS320VC5402PGER10 by Texas Instruments. Designed for high performance and reliability, this DSP offers unmatched quality and precision in a compact package. With applications ranging from audio processing to telecommunications, this versatile product provides customers with the value and benefits they need to stay ahead of the competition. Trust in Texas Instruments for cutting-edge technology that delivers results.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good mechanical protection and insulation for the components within the package.

Maximum Supply Voltage: 1.98 V

Allows for a higher supply voltage, which can improve performance and reliability.

RAM Words: 16384

Large amount of on-chip RAM allows for efficient data processing and storage.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the DSP energy-efficient and reliable.

Maximum Clock Frequency: 20 MHz

High clock frequency enables fast processing of data and improves overall performance.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Specifically designed as a digital signal processor to efficiently handle signal processing tasks.

Low Power Mode: YES

Ability to operate in a low power mode helps in saving energy and extending battery life in portable devices.

Technical Specifications

Digital Signal Processors (DSPs) TMS320VC5402PGER10 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES AT 3.3V SUPPLY

Address Bus Width:

20

Barrel Shifter:

YES

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

20 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e4

Length:

20 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of DMA Channels:

6

No. of External Interrupts:

4

No. of Terminals:

144

No. of Timers:

2

On Chip Data RAM Width:

16

On Chip Program ROM Width:

16

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP144,.87SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

RAM Words:

16384

ROM Programmability:

MROM

Maximum Seated Height:

1.6 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.98 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

20 mm

Peripheral IC Type:

Trade Compliance

TMS320VC5402PGER10 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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