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TMS320TCI6482BCTZ

Texas Instruments

TMS320TCI6482BCTZ by Texas Instruments

TMS320TCI6482BCTZ by Texas Instruments is a 32-bit DSP with 8192 RAM words. It operates b/w 0-90°C, has 697 terminals in a grid array package style, and uses CMOS technology. Ideal for digital signal processing applications requiring high-speed computation and precision.

Median Price

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Lifecycle Status

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3

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1k+

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Vyrian

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Cyclops Electronics Ltd

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One Stop Electronics

USA . 337 parts In-Stock

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AZTECH Wire

Italy . 653 parts In-Stock

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Corohmni

South Africa . 2,190 parts In-Stock

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Parana Technologies

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DigiPath Technology Company

USA . 1,006 parts In-Stock

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ChromeModa Solutions

Germany . 3,889 parts In-Stock

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IDEA Electronic Components Group

UK . 2,133 parts In-Stock

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Microchip USA

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Overview

Enhance your digital signal processing capabilities with the TMS320TCI6482BCTZ by Texas Instruments. Known for their high-quality products, Texas Instruments delivers top-notch performance in the DSP category. This product offers unmatched value and benefits to customers, making it a must-have for applications requiring precision and efficiency. Upgrade your technology with the TMS320TCI6482BCTZ and experience the advantages of cutting-edge innovation in signal processing.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and cost-effective.

Surface Mount: YES

Surface mount technology makes it easier to integrate the DSP into electronic circuits efficiently.

Package Shape: SQUARE

The square package shape allows for efficient use of space on circuit boards.

Bit Size: 32

A 32-bit size allows for high computational power and precision in signal processing tasks.

Power Supplies (V): 1.25,1.5/1.8,1.8,3.3

Multiple power supply options provide flexibility in different operating environments.

No. of Terminals: 697

With a large number of terminals, the DSP can interface with a variety of external devices for data exchange.

Package Style (Meter): GRID ARRAY, FINE PITCH

The grid array and fine pitch package style enables high-density mounting and efficient heat dissipation.

Maximum Operating Temperature: 90 °C

The high maximum operating temperature ensures reliability in demanding conditions.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature allows the DSP to operate in a wide range of environments.

Terminal Finish: TIN SILVER COPPER

The terminal finish provides excellent conductivity and corrosion resistance for reliable connections.

RAM Words: 8192

With a large RAM capacity, the DSP can efficiently store and access data during processing.

Maximum Time At Peak Reflow Temperature (s): 30

The short time at peak reflow temperature ensures the integrity of the DSP during soldering processes.

Peak Reflow Temperature °C: 245

The high peak reflow temperature enables secure soldering of the DSP to circuit boards.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity for efficient signal processing.

Terminal Form: BALL

The ball terminal form provides reliable connections and ease of soldering during installation.

Terminal Pitch: 0.8 mm

The small terminal pitch allows for compact design and efficient routing of connections.

Format: FIXED POINT

Fixed-point format enables fast and efficient mathematical computation in signal processing algorithms.

Moisture Sensitivity Level (MSL): 4

MSL 4 indicates that the DSP has a moderate moisture sensitivity level, suitable for standard storage and handling procedures.

Technical Specifications

Digital Signal Processors (DSPs) TMS320TCI6482BCTZ attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Bit Size:

32

Format:

FIXED POINT

JESD-30 Code:

S-PBGA-B697

JESD-609 Code:

e1

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

697

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA697,29X29,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

245

Power Supplies (V):

1.25,1.5/1.8,1.8,3.3

Qualification:

Not Qualified

RAM Words:

8192

Sub-Category:

Digital Signal Processors

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

TMS320TCI6482BCTZ Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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