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TMS320TCI100BZLZA6

Texas Instruments

TMS320TCI100BZLZA6 by Texas Instruments

TMS320TCI100BZLZA6 by Texas Instruments is a 32-bit DSP with 262144 RAM words, 64-bit external data bus width, and operates at a max clock frequency of 75.19 MHz. Ideal for industrial applications requiring high-speed signal processing in a compact package with low power mode enabled.

Median Price

$11.260

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 164 parts In-Stock

1+ parts

-

100+ parts

$9.750

1k+ parts

$8.720

10k+ parts

$8.210

164

-

$9.750

$8.720

$8.210

DigiKey

USA . 164 parts In-Stock

1+ parts

-

100+ parts

$11.260

1k+ parts

-

10k+ parts

-

164

-

$11.260

-

-

Verical

USA . 91 parts In-Stock

1+ parts

-

100+ parts

$12.188

1k+ parts

$10.900

10k+ parts

$10.262

91

-

$12.188

$10.900

$10.262

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,183 parts In-Stock

1+ parts

$10.288

100+ parts

-

1k+ parts

-

10k+ parts

-

2,183

$10.288

-

-

-

Vyrian

USA . 2,163 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,163

-

-

-

-

DigiKey Marketplace

USA . 164 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

164

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,109 parts In-Stock

1+ parts

$9.747

100+ parts

-

1k+ parts

-

10k+ parts

-

3,109

$9.747

-

-

-

Microchip USA

USA . 415 parts In-Stock

1+ parts

$31.530

100+ parts

$31.080

1k+ parts

$30.850

10k+ parts

$30.630

415

$31.530

$31.080

$30.850

$30.630

Parana Technologies

USA . 2,088 parts In-Stock

1+ parts

$50.146

100+ parts

-

1k+ parts

-

10k+ parts

-

2,088

$50.146

-

-

-

IDEA Electronic Components Group

UK . 1,670 parts In-Stock

1+ parts

$56.344

100+ parts

$53.527

1k+ parts

$50.710

10k+ parts

-

1,670

$56.344

$53.527

$50.710

-

ChromeModa Solutions

Germany . 23 parts In-Stock

1+ parts

$56.344

100+ parts

$46.202

1k+ parts

-

10k+ parts

-

23

$56.344

$46.202

-

-

Corohmni

South Africa . 541 parts In-Stock

1+ parts

$68.218

100+ parts

-

1k+ parts

-

10k+ parts

-

541

$68.218

-

-

-

DigiPath Technology Company

USA . 542 parts In-Stock

1+ parts

-

100+ parts

$50.800

1k+ parts

-

10k+ parts

-

542

-

$50.800

-

-

Overview

Unlock the power of digital signal processing with the TMS320TCI100BZLZA6 by Texas Instruments. Known for their top-notch quality and innovation, Texas Instruments delivers cutting-edge solutions for a wide range of applications. This DSP is designed to provide optimal performance and efficiency, making it a valuable asset for customers looking to enhance their products. Whether you're working on communication systems, industrial automation, or consumer electronics, this versatile processor offers unmatched value, benefits, and advantages. Upgrade your projects with the TMS320TCI100BZLZA6 and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and cost-effective.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly of the product on circuit boards.

Maximum Supply Voltage: 1.16 V

The high maximum supply voltage allows for flexibility in powering the DSP.

Address Bus Width: 23

A wide address bus width enables the DSP to access a large memory space efficiently.

Package Shape: SQUARE

The square package shape helps in easy placement and fitting on a circuit board.

Bit Size: 32

The 32-bit size allows for efficient processing of data and instructions.

Power Supplies (V): 1.1,3.3

Multiple power supply options provide flexibility in operating the DSP in different environments.

No. of Terminals: 532

The high number of terminals allows for connectivity to a variety of external components and interfaces.

Package Style (Meter): GRID ARRAY, FINE PITCH

The grid array and fine pitch package style ensure a compact design and efficient signal transmission.

Minimum Supply Voltage: 1.05 V

The low minimum supply voltage helps in reducing power consumption and heat generation.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature allows the DSP to function reliably in industrial environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures the DSP can operate in a wide range of temperature conditions.

Terminal Finish: TIN SILVER COPPER

The terminal finish of tin silver copper provides good electrical conductivity and corrosion resistance.

Terminal Position: BOTTOM

The bottom terminal position allows for easy connection to the circuit board.

Maximum Seated Height: 3.3 mm

The low maximum seated height enables a compact and space-saving design.

RAM Words: 262144

The large number of RAM words allows for efficient storage and retrieval of data during processing.

Width: 23 mm

The compact width of 23mm enables easy integration into various electronic devices.

Boundary Scan: YES

The boundary scan feature helps in testing and debugging the DSP during manufacturing and maintenance.

External Data Bus Width: 64

A wide external data bus width of 64 bits facilitates high-speed data transfer between the DSP and external devices.

Maximum Clock Frequency: 75.19 MHz

The high maximum clock frequency allows for fast processing of data and instructions.

Maximum Time At Peak Reflow Temperature (s): 30

The short reflow time at peak temperature ensures efficient assembly and soldering of the DSP.

Peak Reflow Temperature °C: 260

The high peak reflow temperature enables reliable soldering of the DSP to the circuit board.

Internal Bus Architecture: MULTIPLE

The use of multiple internal bus architecture enhances data processing and communication within the DSP.

Length: 23 mm

The compact length of 23mm allows for easy placement in space-constrained electronic devices.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures the DSP can operate in harsh industrial environments.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

The peripheral IC type of digital signal processor and others enables versatile functionality and connectivity.

Technology: CMOS

The CMOS technology offers low power consumption and high noise immunity for efficient operation.

Terminal Form: BALL

The ball terminal form provides a reliable and secure connection to the circuit board.

Nominal Supply Voltage: 1.1 V

The nominal supply voltage of 1.1V ensures stable and efficient operation of the DSP.

Terminal Pitch: 0.8 mm

The small terminal pitch of 0.8mm allows for high-density packaging and space-saving design.

Format: FIXED POINT

The fixed-point format offers precise and efficient arithmetic operations for signal processing applications.

Moisture Sensitivity Level (MSL): 4

The MSL 4 rating indicates the level of protection against moisture, ensuring the reliability of the DSP in various environments.

Low Power Mode: YES

The low power mode feature helps in reducing power consumption during idle or low-load operation, enhancing energy efficiency.

Technical Specifications

Digital Signal Processors (DSPs) TMS320TCI100BZLZA6 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

23

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

75.19 MHz

External Data Bus Width:

64

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B532

JESD-609 Code:

e1

Length:

23 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

532

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA532,26X26,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.1,3.3

Qualification:

Not Qualified

RAM Words:

262144

Maximum Seated Height:

3.3 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.16 V

Minimum Supply Voltage:

1.05 V

Nominal Supply Voltage:

1.1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

23 mm

Peripheral IC Type:

Trade Compliance

TMS320TCI100BZLZA6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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