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TMS320LF2401AVFAR

Texas Instruments

TMS320LF2401AVFAR by Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 32; Package Code: LQFP; Package Shape: SQUARE;

Median Price

$14.734

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 2,500 parts In-Stock

1+ parts

$10.359

100+ parts

$8.445

1k+ parts

$5.630

10k+ parts

-

2,500

$10.359

$8.445

$5.630

-

Mouser Electronics

USA . 455 parts In-Stock

1+ parts

$19.110

100+ parts

$12.260

1k+ parts

$10.020

10k+ parts

-

455

$19.110

$12.260

$10.020

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,245 parts In-Stock

1+ parts

$9.841

100+ parts

-

1k+ parts

-

10k+ parts

-

1,245

$9.841

-

-

-

Vyrian

USA . 7,170 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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7,170

-

-

-

-

Chip Stock

USA . 3,400 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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3,400

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,657 parts In-Stock

1+ parts

$9.323

100+ parts

-

1k+ parts

-

10k+ parts

-

3,657

$9.323

-

-

-

Microchip USA

USA . 2,849 parts In-Stock

1+ parts

$22.070

100+ parts

$21.750

1k+ parts

$21.600

10k+ parts

$21.440

2,849

$22.070

$21.750

$21.600

$21.440

Corohmni

South Africa . 573 parts In-Stock

1+ parts

$27.943

100+ parts

-

1k+ parts

-

10k+ parts

-

573

$27.943

-

-

-

Parana Technologies

USA . 758 parts In-Stock

1+ parts

$29.883

100+ parts

-

1k+ parts

$64.352

10k+ parts

-

758

$29.883

-

$64.352

-

DigiPath Technology Company

USA . 600 parts In-Stock

1+ parts

$32.904

100+ parts

-

1k+ parts

-

10k+ parts

-

600

$32.904

-

-

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ChromeModa Solutions

Germany . 2,698 parts In-Stock

1+ parts

$33.576

100+ parts

$27.532

1k+ parts

-

10k+ parts

-

2,698

$33.576

$27.532

-

-

IDEA Electronic Components Group

UK . 2,038 parts In-Stock

1+ parts

$33.576

100+ parts

$31.897

1k+ parts

$30.218

10k+ parts

-

2,038

$33.576

$31.897

$30.218

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Perfect Parts

USA . 5,600 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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5,600

-

-

-

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Authorized Procurement Solutions

USA . 4,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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4,500

-

-

-

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Futuretech Components

Singapore . 4,495 parts In-Stock

1+ parts

-

100+ parts

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4,495

-

-

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A-Z Elektronik GmbH

Germany . 4,495 parts In-Stock

1+ parts

-

100+ parts

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4,495

-

-

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Lixinc

USA . 1,826 parts In-Stock

1+ parts

-

100+ parts

-

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-

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1,826

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-

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-

Technical Specifications

Digital Signal Processors (DSPs) TMS320LF2401AVFAR attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Barrel Shifter:

YES

Boundary Scan:

YES

Maximum Clock Frequency:

20 MHz

External Data Bus Width:

0

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PQFP-G32

JESD-609 Code:

e4

Length:

7 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.6 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Trade Compliance

TMS320LF2401AVFAR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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