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TMS320LC549GGUR-80

Texas Instruments

TMS320LC549GGUR-80 by Texas Instruments

TMS320LC549GGUR-80 by Texas Instruments is a 16-bit DSP with 65536 RAM words, operating at max 20 MHz clock frequency. Ideal for industrial applications requiring low power consumption and fixed-point format processing. Features include boundary scan, barrel shifter, and multiple internal bus architecture.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,534 parts In-Stock

1+ parts

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5,534

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Digiode

USA . 2,386 parts In-Stock

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2,386

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 209 parts In-Stock

1+ parts

$16.000

100+ parts

-

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209

$16.000

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AZTECH Wire

Italy . 664 parts In-Stock

1+ parts

$16.246

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664

$16.246

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Corohmni

South Africa . 736 parts In-Stock

1+ parts

$50.580

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736

$50.580

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Parana Technologies

USA . 311 parts In-Stock

1+ parts

$53.870

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311

$53.870

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DigiPath Technology Company

USA . 2,232 parts In-Stock

1+ parts

$59.317

100+ parts

$54.572

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2,232

$59.317

$54.572

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IDEA Electronic Components Group

UK . 1,528 parts In-Stock

1+ parts

$60.528

100+ parts

$57.502

1k+ parts

$54.475

10k+ parts

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1,528

$60.528

$57.502

$54.475

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ChromeModa Solutions

Germany . 1,431 parts In-Stock

1+ parts

$60.528

100+ parts

$49.633

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1,431

$60.528

$49.633

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Corphita

USA . 1,729 parts In-Stock

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1,729

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Microchip USA

USA . 436 parts In-Stock

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436

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Overview

Unlock the power of advanced digital signal processing with the TMS320LC549GGUR-80 by Texas Instruments. Designed for industrial-grade applications, this DSP offers unparalleled performance and reliability. With a low profile and fine pitch package style, the TMS320LC549GGUR-80 is perfect for space-constrained designs. Whether you're working on audio processing, telecommunications, or motor control systems, this DSP provides the speed and precision you need to bring your projects to life. Trust Texas Instruments to deliver cutting-edge technology that exceeds your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product suitable for a variety of applications while keeping it cost-effective.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto circuit boards, saving time and simplifying the manufacturing process.

Maximum Supply Voltage: 3.6 V

With a high maximum supply voltage, this DSP can handle a wide range of power input levels, providing flexibility in different usage scenarios.

Address Bus Width: 23

The wide address bus width allows for efficient data processing and management, enhancing the overall performance of the DSP.

Package Shape: SQUARE

The square package shape is space-efficient and easy to integrate into system designs, making it a practical choice for compact applications.

Bit Size: 16

The 16-bit architecture enables this DSP to handle complex calculations and data processing tasks effectively, making it suitable for demanding applications.

Power Supplies (V): 3.3

The standard 3.3V power supply support ensures compatibility with commonly used power sources, simplifying the system integration process.

No. of Terminals: 144

Having a higher number of terminals allows for more connectivity options and interfaces, making the DSP versatile and adaptable to different system configurations.

Package Style: GRID ARRAY, LOW PROFILE, FINE PITCH

This package style offers a compact form factor with a low profile and fine pitch, facilitating dense circuit board layouts and optimizing space usage.

Minimum Supply Voltage: 3 V

The low minimum supply voltage ensures efficient power consumption and operation under various voltage conditions, enhancing the product's reliability.

Maximum Operating Temperature: 100 °C

The high maximum operating temperature range allows for reliable performance in extensive temperature variations, making this DSP suitable for industrial environments.

Minimum Operating Temperature: -40 °C

The wide temperature range support ensures stable operation even in extreme cold conditions, offering durability and reliability in harsh environments.

Terminal Position: BOTTOM

The bottom terminal position simplifies the PCB layout and connection design, enabling easier assembly and maintenance of the DSP in the system.

Maximum Seated Height: 1.4 mm

The low maximum seated height reduces the overall profile of the product, making it suitable for slim and compact device designs without sacrificing performance.

RAM Words: 65536

With a large RAM capacity, this DSP can efficiently process and store data, enabling high-speed operations and supporting complex algorithms and applications.

Width: 12 mm

The compact width dimension makes this DSP suitable for space-constrained applications, allowing for versatile integration into various electronic devices.

Boundary Scan: YES

The boundary scan feature simplifies testing and debugging processes during manufacturing and maintenance, enhancing the product's reliability and ease of use.

External Data Bus Width: 16

The 16-bit external data bus width facilitates faster data transfer rates and efficient communication with external peripherals, enhancing overall system performance.

Maximum Clock Frequency: 20 MHz

The high maximum clock frequency allows for fast data processing and real-time operations, making this DSP suitable for high-speed applications.

Internal Bus Architecture: MULTIPLE

The multiple internal bus architecture enhances data flow and processing efficiency within the DSP, enabling parallel operations and faster computation speeds.

Length: 12 mm

With a compact length dimension, this DSP can be easily integrated into limited space designs, providing flexibility in system layout and configuration.

Temperature Grade: INDUSTRIAL

The industrial-grade temperature rating ensures reliable performance in harsh industrial environments, making this DSP suitable for rugged applications.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Support for various peripheral IC types broadens the compatibility and functionality of the DSP, enabling versatile connectivity and integration options.

Technology: CMOS

CMOS technology offers low power consumption and high integration capabilities, enhancing the efficiency and performance of the DSP while minimizing energy usage.

Terminal Form: BALL

The ball terminal form enables reliable connections and secure soldering onto the PCB, ensuring stable performance and durability in various operating conditions.

Nominal Supply Voltage: 3.3 V

The consistent nominal supply voltage simplifies power management and system design, ensuring stable operation and compatibility with common power sources.

Terminal Pitch: 0.8 mm

The tight terminal pitch allows for compact terminal arrangements on the PCB, optimizing space usage and facilitating efficient signal routing for enhanced system performance.

Format: FIXED POINT

The fixed-point format offers fast and efficient arithmetic operations, suitable for applications requiring precise calculations and high-speed processing capabilities.

Low Power Mode: YES

The low power mode feature reduces energy consumption during idle or low-demand periods, enhancing the product's energy efficiency and extending battery life in portable devices.

Barrel Shifter: YES

The presence of a barrel shifter allows for efficient bit manipulation and data processing operations, improving performance and versatility in handling complex algorithms.

Technical Specifications

Digital Signal Processors (DSPs) TMS320LC549GGUR-80 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

23

Barrel Shifter:

YES

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

20 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B144

Length:

12 mm

Low Power Mode:

YES

No. of Terminals:

144

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA144,13X13,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Words:

65536

Maximum Seated Height:

1.4 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

12 mm

Peripheral IC Type:

Trade Compliance

TMS320LC549GGUR-80 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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