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TMS320LC543PZ1-40

Texas Instruments

TMS320LC543PZ1-40 by Texas Instruments

TMS320LC543PZ1-40 by Texas Instruments is a 16-bit DSP with 10K RAM words, 20 MHz clock frequency, and 3.3V supply voltage. Ideal for industrial applications requiring low power consumption and fixed-point format processing. Features include boundary scan, multiple internal bus architecture, and on-chip data RAM width of 16 bits.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

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Vyrian

USA . 6,684 parts In-Stock

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ComSIT Distribution GmbH

Germany . 1,815 parts In-Stock

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Digiode

USA . 1,714 parts In-Stock

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Corel Iberica Componentes, S.L.

Spain . 194 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 15 parts In-Stock

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Holdelec - ElecDif-Pro

France . 15 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 880 parts In-Stock

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$6.056

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One Stop Electronics

USA . 1,056 parts In-Stock

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$8.000

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Ampacity Inc.

Singapore . 1,536 parts In-Stock

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$13.000

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Parana Technologies

USA . 1,304 parts In-Stock

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$77.932

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DigiPath Technology Company

USA . 1,084 parts In-Stock

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$34.572

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ChromeModa Solutions

Germany . 2,310 parts In-Stock

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$35.278

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IDEA Electronic Components Group

UK . 998 parts In-Stock

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$31.750

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Corohmni

South Africa . 5,008 parts In-Stock

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Microchip USA

USA . 1,298 parts In-Stock

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$86.220

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$84.720

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$83.970

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Corphita

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Assy Fe

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Overview

Experience the power and efficiency of the TMS320LC543PZ1-40 by Texas Instruments, a top-quality Digital Signal Processor designed for cutting-edge applications. With a maximum clock frequency of 20 MHz and low power mode capability, this processor is perfect for industrial-grade projects requiring high performance and reliability. Texas Instruments' reputation for innovation and excellence ensures that you are getting a product that meets the highest standards in the industry. Upgrade your project with the TMS320LC543PZ1-40 and unlock a world of possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the DSP, ensuring a longer lifespan for the product.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation of the DSP onto circuit boards, saving time and reducing assembly costs.

Maximum Supply Voltage: 3.6 V

With a high maximum supply voltage, this DSP can handle a wide range of input voltages, making it versatile for different applications.

On Chip Data RAM Width: 16

Having a wider data RAM width allows for faster and more efficient data processing, improving overall performance of the DSP.

Address Bus Width: 23

A larger address bus width allows the DSP to access a greater range of memory locations, enabling more complex algorithms to be implemented.

Bit Size: 16

A 16-bit architecture provides a good balance between performance and efficiency, making this DSP suitable for a variety of signal processing tasks.

Power Supplies (V): 3.3

Operating at a standard power supply voltage of 3.3V ensures compatibility with common power sources and simplifies integration into existing systems.

No. of Terminals: 100

Having a large number of terminals allows for flexible connectivity options and supports the integration of multiple peripherals into the DSP system.

Minimum Operating Temperature: -40 °C

The ability to operate at low temperatures makes this DSP suitable for use in a wide range of environments, including industrial and automotive applications.

Maximum Operating Temperature: 100 °C

High maximum operating temperature ensures reliable performance even in harsh conditions, making this DSP a reliable choice for demanding applications.

Technical Specifications

Digital Signal Processors (DSPs) TMS320LC543PZ1-40 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

23

Barrel Shifter:

YES

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

20 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of DMA Channels:

0

No. of External Interrupts:

5

No. of Serial I/Os:

0

No. of Terminals:

100

No. of Timers:

1

On Chip Data RAM Width:

16

On Chip Program ROM Width:

16

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Words:

10K

ROM Programmability:

MROM

Maximum Seated Height:

1.6 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Trade Compliance

TMS320LC543PZ1-40 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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