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TMS320LC31PQL

Texas Instruments

TMS320LC31PQL by Texas Instruments

TMS320LC31PQL by Texas Instruments is a 32-bit DSP with 2048 RAM words, operating at 33 MHz. It has a low power mode and barrel shifter, suitable for digital signal processing applications requiring high-speed data processing in various industries.

Median Price

$69.154

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 460 parts In-Stock

1+ parts

-

100+ parts

$61.470

1k+ parts

$55.000

10k+ parts

$51.770

460

-

$61.470

$55.000

$51.770

DigiKey

USA . 460 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

460

-

-

-

-

Verical

USA . 368 parts In-Stock

1+ parts

-

100+ parts

$76.838

1k+ parts

$68.750

10k+ parts

$64.713

368

-

$76.838

$68.750

$64.713

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,104 parts In-Stock

1+ parts

$64.894

100+ parts

-

1k+ parts

-

10k+ parts

-

4,104

$64.894

-

-

-

DigiKey Marketplace

USA . 460 parts In-Stock

1+ parts

$71.040

100+ parts

-

1k+ parts

-

10k+ parts

-

460

$71.040

-

-

-

Vyrian

USA . 3,884 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,884

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 556 parts In-Stock

1+ parts

$22.778

100+ parts

-

1k+ parts

$23.443

10k+ parts

-

556

$22.778

-

$23.443

-

ChromeModa Solutions

Germany . 2,787 parts In-Stock

1+ parts

$25.593

100+ parts

$20.986

1k+ parts

-

10k+ parts

-

2,787

$25.593

$20.986

-

-

IDEA Electronic Components Group

UK . 915 parts In-Stock

1+ parts

$25.593

100+ parts

$24.313

1k+ parts

$23.034

10k+ parts

-

915

$25.593

$24.313

$23.034

-

Ampacity Inc.

Singapore . 228 parts In-Stock

1+ parts

$58.060

100+ parts

-

1k+ parts

-

10k+ parts

-

228

$58.060

-

-

-

Corphita

USA . 437 parts In-Stock

1+ parts

$61.479

100+ parts

-

1k+ parts

-

10k+ parts

-

437

$61.479

-

-

-

Corohmni

South Africa . 31 parts In-Stock

1+ parts

$78.694

100+ parts

-

1k+ parts

-

10k+ parts

-

31

$78.694

-

-

-

Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,000

-

-

-

-

DigiPath Technology Company

USA . 1,641 parts In-Stock

1+ parts

-

100+ parts

$23.075

1k+ parts

-

10k+ parts

-

1,641

-

$23.075

-

-

Overview

Unlock the power of cutting-edge technology with the TMS320LC31PQL Digital Signal Processor by Texas Instruments. This high-quality product offers customers unparalleled performance and reliability, making it the perfect choice for a wide range of applications. From digital audio processing to telecommunications, this DSP delivers exceptional value, benefits, and advantages that will take your projects to the next level. Experience innovation like never before with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the components inside the DSP, ensuring a longer lifespan for the product.

Surface Mount: YES

Surface mount technology allows for easier and more efficient assembly, making the product more cost-effective to manufacture.

Maximum Supply Voltage: 3.47 V

This high maximum supply voltage allows for flexibility in power supply options, making the product compatible with a wide range of systems and applications.

Address Bus Width: 24

A wider address bus allows for more memory addressing capability, enabling the DSP to handle larger and more complex data processing tasks.

Package Shape: SQUARE

The square package shape allows for efficient use of space on circuit boards, maximizing the performance and functionality of the product in a compact form factor.

Bit Size: 32

A 32-bit architecture allows for faster and more efficient processing of data, making the product suitable for high-performance applications.

Power Supplies (V): 3.3

The consistent power supply at 3.3V provides stability for the DSP's operation, ensuring reliable performance in various conditions and environments.

No. of Terminals: 132

With a high number of terminals, this DSP can support a wide range of input and output connections, enhancing its versatility for different applications.

Package Style (Meter): FLATPACK

The flatpack package style offers a low-profile design, making it suitable for space-constrained applications where height is a concern.

Minimum Supply Voltage: 3.13 V

The low minimum supply voltage ensures that the DSP can operate efficiently even at lower power levels, helping to conserve energy and reduce operating costs.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this DSP can withstand heat and operate reliably in harsh environmental conditions without overheating.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature indicates that the DSP can function effectively even in cold temperatures, making it suitable for a variety of operating environments.

Terminal Position: QUAD

The quad terminal position allows for easier and more secure connections to external devices and circuitry, enhancing the reliability and performance of the product.

Maximum Seated Height: 4.57 mm

The maximum seated height of 4.57mm ensures that the DSP can be easily integrated into compact electronic devices without taking up too much space.

RAM Words: 2048

With a large RAM capacity of 2048 words, this DSP can store and retrieve data quickly, enabling faster and more efficient processing tasks.

Width: 24.13 mm

The compact width of 24.13mm allows for easy integration of the DSP into various electronic systems, making it a versatile choice for a wide range of applications.

External Data Bus Width: 32

A wider external data bus width of 32 bits enables the DSP to transfer data faster between external devices, enhancing overall system performance.

Maximum Clock Frequency: 33 MHz

With a high maximum clock frequency of 33MHz, this DSP can process data quickly and efficiently, making it suitable for real-time signal processing applications.

Internal Bus Architecture: MULTIPLE

A multiple internal bus architecture allows for parallel data processing, improving the overall speed and efficiency of the DSP for complex computing tasks.

Length: 24.13 mm

The compact length of 24.13mm enables easy installation and integration of the DSP into various electronic systems, making it a convenient choice for space-constrained applications.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

The peripheral IC type indicates that this DSP can be used for a variety of applications beyond standard signal processing, providing versatility and flexibility for different use cases.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this DSP energy-efficient and reliable for long-term operation.

Terminal Form: GULL WING

The gull wing terminal form provides a secure and reliable connection to external devices, reducing the risk of signal interference and ensuring consistent performance.

Maximum Supply Current: 250 mA

With a maximum supply current of 250mA, this DSP can operate efficiently without drawing excessive power, making it suitable for battery-powered or energy-conscious applications.

Nominal Supply Voltage: 3.3 V

The consistent nominal supply voltage of 3.3V ensures stable and reliable operation of the DSP, making it a dependable choice for critical applications.

Terminal Pitch: 0.635 mm

The small terminal pitch of 0.635mm allows for dense packaging of the DSP on circuit boards, maximizing the component density and performance of the product.

Format: FLOATING POINT

The floating-point format allows for precise and accurate numerical calculations, making this DSP well-suited for applications that require high computational accuracy.

Low Power Mode: YES

The low power mode feature enables the DSP to conserve energy during idle or low-load periods, contributing to overall energy efficiency and prolonging battery life.

Barrel Shifter: YES

The barrel shifter feature enhances the DSP's ability to perform arithmetic and logical operations efficiently, improving overall processing speed and performance.

Technical Specifications

Digital Signal Processors (DSPs) TMS320LC31PQL attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

24

Barrel Shifter:

YES

Bit Size:

32

Boundary Scan:

NO

Maximum Clock Frequency:

33 MHz

External Data Bus Width:

32

Format:

FLOATING POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PQFP-G132

Length:

24.13 mm

Low Power Mode:

YES

No. of Terminals:

132

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

SPQFP132,1.1SQ

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Words:

2048

Maximum Seated Height:

4.57 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

250 mA

Maximum Supply Voltage:

3.47 V

Minimum Supply Voltage:

3.13 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

24.13 mm

Peripheral IC Type:

Trade Compliance

TMS320LC31PQL Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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