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TMS320LBC57PGE57

Texas Instruments

TMS320LBC57PGE57 by Texas Instruments

TMS320LBC57PGE57 by Texas Instruments is a 16-bit DSP with 512 RAM words, operating at 57.14 MHz clock frequency. It features low power mode and barrel shifter, suitable for digital signal processing applications requiring high-speed data processing in commercial temperature environments. The package style is flatpack with a low profile and fine pitch design, making it ideal for space-constrained applications.

Median Price

$73.800

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 160 parts In-Stock

1+ parts

-

100+ parts

$65.600

1k+ parts

$58.690

10k+ parts

$55.240

160

-

$65.600

$58.690

$55.240

DigiKey

USA . 160 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

160

-

-

-

-

Verical

USA . 160 parts In-Stock

1+ parts

-

100+ parts

$82.000

1k+ parts

$73.362

10k+ parts

$69.050

160

-

$82.000

$73.362

$69.050

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,884 parts In-Stock

1+ parts

$69.246

100+ parts

-

1k+ parts

-

10k+ parts

-

4,884

$69.246

-

-

-

DigiKey Marketplace

USA . 160 parts In-Stock

1+ parts

$75.810

100+ parts

-

1k+ parts

-

10k+ parts

-

160

$75.810

-

-

-

Vyrian

USA . 4,732 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,732

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 41 parts In-Stock

1+ parts

$15.349

100+ parts

-

1k+ parts

-

10k+ parts

-

41

$15.349

-

-

-

Parana Technologies

USA . 2,153 parts In-Stock

1+ parts

$47.982

100+ parts

-

1k+ parts

-

10k+ parts

-

2,153

$47.982

-

-

-

Advanced Electronics

New Zealand . 1,000 parts In-Stock

1+ parts

$51.465

100+ parts

$46.833

1k+ parts

$42.201

10k+ parts

-

1,000

$51.465

$46.833

$42.201

-

DigiPath Technology Company

USA . 200 parts In-Stock

1+ parts

$52.834

100+ parts

-

1k+ parts

-

10k+ parts

-

200

$52.834

-

-

-

ChromeModa Solutions

Germany . 5,055 parts In-Stock

1+ parts

$53.912

100+ parts

$44.208

1k+ parts

-

10k+ parts

-

5,055

$53.912

$44.208

-

-

IDEA Electronic Components Group

UK . 1,825 parts In-Stock

1+ parts

$53.912

100+ parts

$51.216

1k+ parts

$48.521

10k+ parts

-

1,825

$53.912

$51.216

$48.521

-

Corphita

USA . 2,775 parts In-Stock

1+ parts

$65.601

100+ parts

-

1k+ parts

-

10k+ parts

-

2,775

$65.601

-

-

-

Microchip USA

USA . 174 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

174

-

-

-

-

Overview

Experience unparalleled performance and efficiency with the TMS320LBC57PGE57 by Texas Instruments. As a leading manufacturer of Digital Signal Processors (DSPs), Texas Instruments delivers cutting-edge technology to meet your application needs. This compact and powerful processor offers high-quality signal processing capabilities, making it ideal for a wide range of applications. From telecommunications to industrial automation, the TMS320LBC57PGE57 provides unmatched value, benefits, and advantages to customers looking to elevate their projects to the next level. Trust in Texas Instruments to deliver superior quality and performance with the TMS320LBC57PGE57.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the DSP.

Surface Mount: YES

Enables easy and secure mounting on PCBs, saving space and improving reliability.

Maximum Supply Voltage: 3.47 V

Allows for a higher supply voltage, providing flexibility in power requirements.

Address Bus Width: 16

Enables the DSP to efficiently access memory locations for processing data.

Package Shape: SQUARE

Facilitates easier integration into circuit designs and PCB layouts.

Bit Size: 16

Offers a good balance between processing power and data precision.

Power Supplies (V): 3.3

Operates efficiently at a common voltage level, suitable for various applications.

No. of Terminals: 144

Provides ample connectivity options for interfacing with other devices.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Enables a compact and space-saving design, ideal for portable and embedded systems.

Minimum Supply Voltage: 3.13 V

Ensures reliable operation even at lower voltage levels.

Maximum Operating Temperature: 70 °C

Allows for operation in a wide range of environmental conditions.

Minimum Operating Temperature: 0 °C

Ensures the DSP can function in colder temperatures without issues.

Terminal Position: QUAD

Provides a secure and stable connection in the circuit.

Maximum Seated Height: 1.6 mm

Enables a low-profile design, suitable for compact electronic devices.

RAM Words: 512

Offers sufficient memory for storing and processing data efficiently.

Width: 20 mm

Compact size makes it suitable for small form factor applications.

Boundary Scan: YES

Facilitates debugging and testing of the DSP during development and production.

External Data Bus Width: 16

Allows for high-speed data transfer between the DSP and external devices.

Maximum Clock Frequency: 57.14 MHz

Provides high processing speed for real-time signal processing applications.

Internal Bus Architecture: MULTIPLE

Optimizes data flow within the DSP for efficient processing of signals.

Length: 20 mm

Compact size contributes to space-saving in circuit board layouts.

Temperature Grade: COMMERCIAL

Meets industry standards for operating in commercial environments.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Designed specifically for signal processing tasks, ensuring high performance.

Technology: CMOS

Utilizes low power consumption and high integration suitable for portable devices.

Terminal Form: GULL WING

Facilitates easy soldering onto PCBs, ensuring a strong and reliable connection.

Nominal Supply Voltage: 3.3 V

Operates efficiently at a standard voltage level common in many electronic systems.

Terminal Pitch: 0.5 mm

Provides a compact layout for terminals, saving space on the PCB.

Format: FIXED POINT

Facilitates efficient and fast data processing in fixed-point arithmetic operations.

Low Power Mode: YES

Enables power-saving operation for extended battery life in portable devices.

Barrel Shifter: YES

Allows for efficient shifting and rotating of data, enhancing processing capabilities.

Technical Specifications

Digital Signal Processors (DSPs) TMS320LBC57PGE57 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

6K WORDS DATA/PROG RAM

Address Bus Width:

16

Barrel Shifter:

YES

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

57.14 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PQFP-G144

Length:

20 mm

Low Power Mode:

YES

No. of Terminals:

144

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP144,.87SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Words:

512

Maximum Seated Height:

1.6 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

3.47 V

Minimum Supply Voltage:

3.13 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

20 mm

Peripheral IC Type:

Trade Compliance

TMS320LBC57PGE57 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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