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TMS320F28334ZJZQ

Texas Instruments

TMS320F28334ZJZQ by Texas Instruments

TMS320F28334ZJZQ by Texas Instruments is a 32-bit DSP with 150 MHz clock frequency, 176 terminals, and 68 RAM words. Ideal for automotive applications due to AEC-Q100 screening level, it features low power mode and flash ROM programmability for efficient signal processing tasks.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,477 parts In-Stock

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Digiode

USA . 1,418 parts In-Stock

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1,418

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Distributors (Availability)

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One Stop Electronics

USA . 1,570 parts In-Stock

1+ parts

$1.000

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1,570

$1.000

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AZTECH Wire

Italy . 689 parts In-Stock

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$5.133

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689

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Parana Technologies

USA . 1,924 parts In-Stock

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$59.214

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DigiPath Technology Company

USA . 1,939 parts In-Stock

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$65.202

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$59.986

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1,939

$65.202

$59.986

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ChromeModa Solutions

Germany . 3,224 parts In-Stock

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$66.533

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$54.557

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3,224

$66.533

$54.557

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IDEA Electronic Components Group

UK . 867 parts In-Stock

1+ parts

$66.533

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$63.206

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$59.880

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867

$66.533

$63.206

$59.880

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Corohmni

South Africa . 5,250 parts In-Stock

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$86.558

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Corphita

USA . 4,310 parts In-Stock

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Overview

The Texas Instruments TMS320F28334ZJZQ Digital Signal Processor is a high-quality product that offers unparalleled performance and reliability. With Texas Instruments' renowned reputation for excellence in technology, this DSP is perfect for a wide range of applications. From automotive to industrial, the TMS320F28334ZJZQ provides value and benefits that customers will appreciate. Experience the advantages of this cutting-edge product and see how it can elevate your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material makes the package durable and resistant to physical damage.

Maximum Supply Voltage: 1.995 V

Higher maximum supply voltage allows for flexibility in power supply options.

Address Bus Width: 20

Wider address bus width enables efficient memory addressing and data handling.

Bit Size: 32

32-bit architecture provides high processing power and data handling capabilities.

Maximum Operating Temperature: 125 °C

High maximum operating temperature allows for reliable performance in extreme conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity.

Maximum Clock Frequency: 150 MHz

High maximum clock frequency enables fast data processing and high performance.

Technical Specifications

Digital Signal Processors (DSPs) TMS320F28334ZJZQ attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES AT 3.3V SUPPLY

Address Bus Width:

20

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

150 MHz

External Data Bus Width:

32

Format:

FLOATING POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B176

JESD-609 Code:

e1

Length:

15 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

6

No. of External Interrupts:

8

No. of Terminals:

176

No. of Timers:

19

On Chip Data RAM Width:

16

On Chip Program ROM Width:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA176,14X14,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.9,3.3

Qualification:

Not Qualified

RAM Words:

68

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

2.05 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

315 mA

Maximum Supply Voltage:

1.995 V

Minimum Supply Voltage:

1.805 V

Nominal Supply Voltage:

1.9 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

15 mm

Peripheral IC Type:

Trade Compliance

TMS320F28334ZJZQ Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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