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TMS320F28332ZJZA

Texas Instruments

TMS320F28332ZJZA by Texas Instruments

TMS320F28332ZJZA by Texas Instruments is a 32-bit DSP with 20-bit address bus, 32-bit data bus, and max clock freq of 100 MHz. Ideal for industrial applications requiring high-speed signal processing in a compact package. Operates b/w -40 to 85°C with low power mode option.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,177 parts In-Stock

1+ parts

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4,177

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Digiode

USA . 2,011 parts In-Stock

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2,011

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 521 parts In-Stock

1+ parts

$3.000

100+ parts

-

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521

$3.000

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AZTECH Wire

Italy . 668 parts In-Stock

1+ parts

$16.859

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668

$16.859

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Parana Technologies

USA . 1,886 parts In-Stock

1+ parts

$67.647

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1,886

$67.647

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Corohmni

South Africa . 574 parts In-Stock

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$72.199

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574

$72.199

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DigiPath Technology Company

USA . 1,237 parts In-Stock

1+ parts

$74.488

100+ parts

$68.529

1k+ parts

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1,237

$74.488

$68.529

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ChromeModa Solutions

Germany . 6,957 parts In-Stock

1+ parts

$76.008

100+ parts

$62.327

1k+ parts

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6,957

$76.008

$62.327

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IDEA Electronic Components Group

UK . 2,052 parts In-Stock

1+ parts

$76.008

100+ parts

$72.208

1k+ parts

$68.407

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2,052

$76.008

$72.208

$68.407

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Corphita

USA . 2,492 parts In-Stock

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2,492

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Overview

Unlock the power of advanced digital signal processing with the TMS320F28332ZJZA by Texas Instruments. With a reputation for excellence in semiconductor technology, Texas Instruments delivers a top-of-the-line product that offers unparalleled performance and reliability. Ideal for applications in industries such as automotive, industrial automation, and telecommunications, this DSP provides customers with a competitive edge through its high-speed processing capabilities and low power consumption. Trust Texas Instruments to provide you with the quality and innovation you need to take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the package lightweight and durable, ideal for portable and rugged applications.

Surface Mount: YES

Surface mount technology enables easy and efficient PCB assembly, saving time and cost in manufacturing.

Maximum Supply Voltage: 1.89 V

Operating at a maximum supply voltage of 1.89V provides power efficiency and helps in reducing heat dissipation.

Address Bus Width: 20

A wider address bus width allows for more memory addressability, enabling faster data processing and better performance.

Package Shape: SQUARE

Square package shape facilitates easier PCB layout and component placement, optimizing space utilization.

Bit Size: 32

32-bit architecture offers higher processing capability and precision, suitable for demanding signal processing tasks.

Power Supplies (V): 1.9,3.3

Support for multiple power supply voltages allows flexibility in system design and compatibility with various power sources.

No. of Terminals: 176

A higher number of terminals provide connectivity options for interfacing with external components and peripherals.

Package Style (Meter): GRID ARRAY

Grid array package style ensures reliable solder joints and mechanical stability, enhancing product durability.

Minimum Supply Voltage: 1.71 V

Having a low minimum supply voltage allows for operation in low-power modes, extending battery life in portable devices.

Maximum Operating Temperature: 85 °C

High maximum operating temperature tolerance ensures reliable performance in harsh environmental conditions, suitable for industrial applications.

Minimum Operating Temperature: -40 °C

Wide temperature range capability enables operation in extreme cold conditions, making it versatile for various temperature environments.

Terminal Finish: TIN SILVER COPPER

Triple terminal finish enhances solderability, conductivity, and corrosion resistance, ensuring long-term reliability of connections.

Terminal Position: BOTTOM

Bottom terminal position simplifies PCB layout and routing, making it easier for assembly and maintenance.

Maximum Seated Height: 2.05 mm

Low profile maximum seated height enables compact designs and slim form factors, suitable for space-constrained applications.

RAM Words: 26624

Large RAM capacity allows for efficient data storage and retrieval during signal processing operations, enhancing overall system performance.

Width: 15 mm

Compact width dimension facilitates integration into small electronic devices, providing flexibility in system design and layout.

Boundary Scan: YES

Boundary scan capability simplifies testing and debugging processes, improving product quality and reliability during manufacturing.

External Data Bus Width: 32

Wide external data bus width enables high-speed data transfer between the processor and external memory devices, enhancing system efficiency.

Maximum Clock Frequency: 100 MHz

High clock frequency capability allows for faster processing speeds and real-time data handling, crucial for signal processing applications.

Maximum Time At Peak Reflow Temperature (s): 30

Efficient reflow process with a short time at peak temperature ensures proper soldering and component reliability during manufacturing.

Peak Reflow Temperature °C: 260

Peak reflow temperature tolerance of 260°C ensures stable solder joints and component connections, meeting industry standards for soldering processes.

Internal Bus Architecture: MULTIPLE

Multiple internal bus architecture enhances data throughput and parallel processing capabilities, optimizing overall system performance.

Length: 15 mm

Compact length dimension allows for flexible placement within electronic devices, optimizing board space and layout efficiency.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures reliable operation in harsh environments, making it suitable for industrial automation and control applications.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Versatile peripheral IC type supports various signal processing functions and interfaces, making it ideal for diverse application requirements.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and fast switching speeds, enhancing energy efficiency and performance.

Terminal Form: BALL

Ball terminal form provides reliable connections and easy reworkability, ensuring robust electrical connections during assembly and maintenance.

Nominal Supply Voltage: 1.8 V

Stable nominal supply voltage of 1.8V ensures consistent power delivery and operation of the processor, supporting reliable performance.

Terminal Pitch: 1 mm

Fine terminal pitch of 1mm allows for high-density mounting on PCBs, enabling compact and space-efficient designs in electronic devices.

Format: FLOATING POINT

Floating-point format enables precise mathematical calculations and complex signal processing operations, essential for high-accuracy applications.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level of 3 indicates moderate sensitivity to moisture exposure during storage and handling, requiring standard precautions for handling and storage.

Low Power Mode: YES

Incorporation of low power mode allows for energy-efficient operation and extended battery life, making it suitable for battery-powered devices and portable applications.

Technical Specifications

Digital Signal Processors (DSPs) TMS320F28332ZJZA attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES AT 3.3V SUPPLY

Address Bus Width:

20

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

100 MHz

External Data Bus Width:

32

Format:

FLOATING POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B176

JESD-609 Code:

e1

Length:

15 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

176

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA176,14X14,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.9,3.3

Qualification:

Not Qualified

RAM Words:

26624

Maximum Seated Height:

2.05 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.89 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

15 mm

Peripheral IC Type:

Trade Compliance

TMS320F28332ZJZA Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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