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TMS320F28332ZHHA

Texas Instruments

TMS320F28332ZHHA by Texas Instruments

TMS320F28332ZHHA by Texas Instruments is a 32-bit DSP with 100 MHz clock frequency, 20-bit address bus width, and 32-bit external data bus width. Ideal for industrial applications requiring low power consumption and floating-point format processing.

Median Price

$9.580

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 455 parts In-Stock

1+ parts

-

100+ parts

$8.280

1k+ parts

$7.410

10k+ parts

$6.980

455

-

$8.280

$7.410

$6.980

DigiKey

USA . 455 parts In-Stock

1+ parts

-

100+ parts

$9.580

1k+ parts

-

10k+ parts

-

455

-

$9.580

-

-

Verical

USA . 426 parts In-Stock

1+ parts

-

100+ parts

$10.350

1k+ parts

$9.262

10k+ parts

$8.725

426

-

$10.350

$9.262

$8.725

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 941 parts In-Stock

1+ parts

$8.750

100+ parts

-

1k+ parts

-

10k+ parts

-

941

$8.750

-

-

-

Vyrian

USA . 7,406 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,406

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,669 parts In-Stock

1+ parts

$8.289

100+ parts

-

1k+ parts

-

10k+ parts

-

1,669

$8.289

-

-

-

Advanced Electronics

New Zealand . 45 parts In-Stock

1+ parts

$15.172

100+ parts

$13.807

1k+ parts

$12.441

10k+ parts

-

45

$15.172

$13.807

$12.441

-

Corohmni

South Africa . 166 parts In-Stock

1+ parts

$21.863

100+ parts

-

1k+ parts

-

10k+ parts

-

166

$21.863

-

-

-

Microchip USA

USA . 422 parts In-Stock

1+ parts

$26.820

100+ parts

$26.440

1k+ parts

$26.250

10k+ parts

$26.060

422

$26.820

$26.440

$26.250

$26.060

Parana Technologies

USA . 256 parts In-Stock

1+ parts

$30.126

100+ parts

-

1k+ parts

$67.372

10k+ parts

-

256

$30.126

-

$67.372

-

DigiPath Technology Company

USA . 1,036 parts In-Stock

1+ parts

$33.172

100+ parts

-

1k+ parts

-

10k+ parts

-

1,036

$33.172

-

-

-

ChromeModa Solutions

Germany . 1,344 parts In-Stock

1+ parts

$33.849

100+ parts

$27.756

1k+ parts

-

10k+ parts

-

1,344

$33.849

$27.756

-

-

IDEA Electronic Components Group

UK . 795 parts In-Stock

1+ parts

$33.849

100+ parts

$32.157

1k+ parts

$30.464

10k+ parts

-

795

$33.849

$32.157

$30.464

-

Overview

Experience unmatched performance and reliability with the TMS320F28332ZHHA by Texas Instruments, a leading manufacturer of cutting-edge technology. As a high-quality Digital Signal Processor, this product offers a wide range of applications in various industries. With its advanced features and innovative design, customers can expect superior value, efficiency, and functionality for their projects. Trust Texas Instruments to deliver top-notch solutions that meet your needs and exceed your expectations. Elevate your work with the TMS320F28332ZHHA today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good mechanical strength and thermal stability, making the product durable and reliable.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and cost.

Maximum Supply Voltage: 1.89 V

Having a maximum supply voltage of 1.89 V allows for low power consumption and efficient operation.

Address Bus Width: 20

A wider address bus width enables the processor to handle larger amounts of memory, improving performance.

Package Shape: SQUARE

Square packages are space-efficient and easy to handle during assembly, making the product suitable for compact designs.

Bit Size: 32

A 32-bit processor offers higher processing capabilities and improved performance compared to lower-bit processors.

Power Supplies (V): 1.9,3.3

Having multiple power supply options provides flexibility and compatibility with different systems and applications.

No. of Terminals: 179

A higher number of terminals allow for more connectivity options and features, enhancing the functionality of the product.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

This package style offers high density, low profile design, and fine pitch for optimized space utilization and performance.

Minimum Supply Voltage: 1.71 V

A low minimum supply voltage helps in reducing power consumption and improving efficiency during operation.

Maximum Operating Temperature: 85 °C

Being able to operate at high temperatures makes the product suitable for industrial applications where heat tolerance is crucial.

Minimum Operating Temperature: -40 °C

Capable of operating in extreme cold conditions, ensuring reliable performance in various environments.

Terminal Finish: TIN SILVER COPPER

This finish provides good conductivity and corrosion resistance, ensuring reliable connections for optimal performance.

Terminal Position: BOTTOM

Bottom terminal position facilitates easier PCB layout and assembly, making the product more user-friendly.

Maximum Seated Height: 1.4 mm

Low seated height helps in compact design and efficient thermal management for improved performance.

Width: 12 mm

A moderate width allows for space-efficient PCB layout and integration into various devices and systems.

Boundary Scan: YES

Boundary scan capability provides efficient debugging and testing during production, ensuring high quality and reliability.

External Data Bus Width: 32

A wider external data bus width allows for faster data transfer and processing, enhancing overall performance.

Maximum Clock Frequency: 100 MHz

High clock frequency enables faster processing and operation, making the product suitable for demanding tasks.

Maximum Time At Peak Reflow Temperature (s): 30

Having a specified reflow time ensures proper soldering and assembly, contributing to the reliability of the product.

Peak Reflow Temperature °C: 260

With a high peak reflow temperature, the product can withstand the soldering process without damage, ensuring robust assembly.

Internal Bus Architecture: MULTIPLE

Multiple internal bus architecture enhances data flow and processing capabilities, improving overall performance.

Length: 12 mm

A standard length facilitates easy integration and PCB layout, making the product versatile for various applications.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures reliable operation in harsh environments, making the product suitable for industrial applications.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Being a digital signal processor with additional peripheral ICs enhances the product's functionality and versatility for diverse applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, contributing to energy-efficient and reliable operation.

Terminal Form: BALL

Ball terminal form provides secure connections and efficient heat dissipation, ensuring stable performance during operation.

Nominal Supply Voltage: 1.8 V

Having a nominal supply voltage of 1.8 V allows for compatibility with various systems and devices, enhancing versatility.

Terminal Pitch: 0.8 mm

A small terminal pitch allows for high-density integration and compact design, making the product suitable for space-constrained applications.

Format: FLOATING POINT

Floating-point format enables precise calculations and processing of decimal numbers, enhancing accuracy and performance.

Moisture Sensitivity Level (MSL): 3

MSL level of 3 indicates moderate sensitivity to moisture, requiring standard handling and storage procedures to maintain product integrity.

Low Power Mode: YES

Having a low-power mode option allows for energy-efficient operation and extended battery life, making the product environmentally friendly.

Technical Specifications

Digital Signal Processors (DSPs) TMS320F28332ZHHA attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES AT 3.3V SUPPLY

Address Bus Width:

20

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

100 MHz

External Data Bus Width:

32

Format:

FLOATING POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B179

JESD-609 Code:

e1

Length:

12 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

179

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA179,14X14,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.9,3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.4 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.89 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

12 mm

Peripheral IC Type:

Trade Compliance

TMS320F28332ZHHA Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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