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TMS320F2806GGMS

Texas Instruments

TMS320F2806GGMS by Texas Instruments

TMS320F2806GGMS by Texas Instruments is a 32-bit DSP with 100 terminals, operating at max 100 MHz. Ideal for automotive applications, it features low power mode, 1.71-1.89 V supply voltage range, and peak reflow temp of 220°C.

Median Price

$11.780

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 168 parts In-Stock

1+ parts

-

100+ parts

$10.200

1k+ parts

$9.130

10k+ parts

$8.590

168

-

$10.200

$9.130

$8.590

DigiKey

USA . 168 parts In-Stock

1+ parts

-

100+ parts

$11.780

1k+ parts

-

10k+ parts

-

168

-

$11.780

-

-

Verical

USA . 168 parts In-Stock

1+ parts

-

100+ parts

$12.750

1k+ parts

$11.412

10k+ parts

$10.738

168

-

$12.750

$11.412

$10.738

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,176 parts In-Stock

1+ parts

$10.764

100+ parts

-

1k+ parts

-

10k+ parts

-

1,176

$10.764

-

-

-

Vyrian

USA . 3,756 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,756

-

-

-

-

DigiKey Marketplace

USA . 168 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

168

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,068 parts In-Stock

1+ parts

$10.197

100+ parts

-

1k+ parts

-

10k+ parts

-

3,068

$10.197

-

-

-

Parana Technologies

USA . 1,900 parts In-Stock

1+ parts

$62.914

100+ parts

-

1k+ parts

-

10k+ parts

-

1,900

$62.914

-

-

-

DigiPath Technology Company

USA . 720 parts In-Stock

1+ parts

$69.276

100+ parts

$63.734

1k+ parts

-

10k+ parts

-

720

$69.276

$63.734

-

-

ChromeModa Solutions

Germany . 4,945 parts In-Stock

1+ parts

$70.690

100+ parts

$57.966

1k+ parts

-

10k+ parts

-

4,945

$70.690

$57.966

-

-

IDEA Electronic Components Group

UK . 1,353 parts In-Stock

1+ parts

$70.690

100+ parts

$67.156

1k+ parts

$63.621

10k+ parts

-

1,353

$70.690

$67.156

$63.621

-

Corohmni

South Africa . 267 parts In-Stock

1+ parts

$72.609

100+ parts

-

1k+ parts

-

10k+ parts

-

267

$72.609

-

-

-

Authorized Procurement Solutions

USA . 4,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,000

-

-

-

-

Microchip USA

USA . 131 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

131

-

-

-

-

Overview

Experience the power of Texas Instruments with the TMS320F2806GGMS Digital Signal Processor. With a 32-bit architecture and a maximum clock frequency of 100 MHz, this versatile DSP offers high performance for automotive applications. The low power mode ensures energy efficiency, while the fine pitch package design optimizes space utilization. Trust in Texas Instruments' reputation for quality and innovation, and unlock the full potential of your designs with the TMS320F2806GGMS.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material makes the package lightweight and durable, ideal for portable devices.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and cost in production.

Maximum Supply Voltage: 1.89 V

The high maximum supply voltage provides flexibility in power supply options for different applications.

Package Shape: SQUARE

The square shape allows for efficient use of space on the PCB, maximizing component layout flexibility.

Bit Size: 32

A 32-bit architecture enables high-speed processing and precision in digital signal manipulation.

Power Supplies (V): 1.8,3.3

Multiple power supply options accommodate various voltage requirements, enhancing compatibility with different systems.

No. of Terminals: 100

Having a high number of terminals allows for versatile connectivity and integration with other components.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The grid array, low profile, and fine pitch package style enhances signal integrity, reduces noise, and enables high-speed data transfer.

Minimum Supply Voltage: 1.71 V

The low minimum supply voltage ensures efficient power consumption and prolongs battery life in portable devices.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, the DSP can withstand demanding environmental conditions, making it suitable for industrial and automotive applications.

Minimum Operating Temperature: -40 °C

The wide temperature range ensures reliable performance in extreme cold conditions, making it suitable for a variety of applications.

Terminal Finish: TIN LEAD

The tin lead finish provides good solderability and conductivity, ensuring secure electrical connections during assembly.

Terminal Position: BOTTOM

Bottom terminal positioning simplifies board layout and routing, facilitating easier design and assembly.

Maximum Seated Height: 1.4 mm

The low seated height allows for compact designs and enables slim form factors in end products.

RAM Words: 10240

The large RAM capacity supports complex algorithms and data processing tasks, enhancing the DSP's performance capabilities.

Width: 10 mm

The compact width enables space-saving integration on the PCB, ideal for applications with limited board real estate.

Boundary Scan: YES

Boundary scan capability simplifies testing and debugging processes, leading to quicker product development and improved reliability.

Maximum Clock Frequency: 100 MHz

A high maximum clock frequency allows for fast data processing and real-time responsiveness, critical for signal processing applications.

Maximum Time At Peak Reflow Temperature (s): 20

The short reflow time at peak temperature minimizes thermal stress on components during assembly, ensuring long-term reliability.

Peak Reflow Temperature °C: 220

The high peak reflow temperature enables lead-free soldering processes, meeting RoHS compliance requirements.

Internal Bus Architecture: MULTIPLE

Multiple internal buses facilitate efficient data transfer between different processing units, optimizing overall system performance.

Length: 10 mm

The compact length contributes to a smaller PCB footprint, saving space and enabling more compact device designs.

Temperature Grade: AUTOMOTIVE

The automotive temperature grade ensures reliable operation in harsh automotive environments, making it suitable for automotive electronics.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

The inclusion of other peripheral IC types adds additional functionality and versatility to the overall system design.

Technology: CMOS

CMOS technology offers low power consumption, high speed, and reliability, making it well-suited for digital signal processing applications.

Terminal Form: BALL

The ball terminal form simplifies assembly and rework processes, ensuring reliable connections and ease of installation.

Nominal Supply Voltage: 1.8 V

The stable nominal supply voltage ensures consistent performance and reliable operation over a wide range of operating conditions.

Terminal Pitch: 0.8 mm

The small terminal pitch allows for high-density mounting on the PCB, maximizing component density and saving board space.

Format: FIXED POINT

The fixed-point format offers efficient computation and accurate processing of integer-based data, essential for many DSP applications.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates a moderate level of moisture sensitivity, requiring standard handling procedures during storage and assembly to prevent damage.

Low Power Mode: YES

The low power mode option allows for energy-efficient operation, prolonging battery life and reducing overall power consumption.

Technical Specifications

Digital Signal Processors (DSPs) TMS320F2806GGMS attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

0

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

100 MHz

External Data Bus Width:

0

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B100

JESD-609 Code:

e0

Length:

10 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

100

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA100,10X10,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

220

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

RAM Words:

10240

Maximum Seated Height:

1.4 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.89 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

20

Width:

10 mm

Peripheral IC Type:

Trade Compliance

TMS320F2806GGMS Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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