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TMS320F2801NMFA

Texas Instruments

TMS320F2801NMFA by Texas Instruments

TMS320F2801NMFA by Texas Instruments is a 32-bit DSP with 100 terminals, operating at max 100 MHz. Ideal for industrial applications due to its low power mode, FLASH ROM programmability, and multiple internal bus architecture. It features 3 timers, ADC channels, and PWM channels for versatile digital signal processing tasks.

Median Price

$14.898

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,774 parts In-Stock

1+ parts

$10.887

100+ parts

$8.876

1k+ parts

$5.917

10k+ parts

-

1,774

$10.887

$8.876

$5.917

-

Mouser Electronics

USA . 36 parts In-Stock

1+ parts

$18.910

100+ parts

$10.610

1k+ parts

$10.600

10k+ parts

-

36

$18.910

$10.610

$10.600

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,477 parts In-Stock

1+ parts

$10.343

100+ parts

-

1k+ parts

-

10k+ parts

-

4,477

$10.343

-

-

-

Vyrian

USA . 3,888 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,888

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,019 parts In-Stock

1+ parts

$9.798

100+ parts

-

1k+ parts

-

10k+ parts

-

1,019

$9.798

-

-

-

Parana Technologies

USA . 1,477 parts In-Stock

1+ parts

$15.686

100+ parts

-

1k+ parts

$16.056

10k+ parts

-

1,477

$15.686

-

$16.056

-

ChromeModa Solutions

Germany . 3,620 parts In-Stock

1+ parts

$17.625

100+ parts

$14.452

1k+ parts

-

10k+ parts

-

3,620

$17.625

$14.452

-

-

IDEA Electronic Components Group

UK . 249 parts In-Stock

1+ parts

$17.625

100+ parts

$16.744

1k+ parts

$15.862

10k+ parts

-

249

$17.625

$16.744

$15.862

-

Microchip USA

USA . 1,690 parts In-Stock

1+ parts

$27.280

100+ parts

$26.890

1k+ parts

$26.690

10k+ parts

$26.500

1,690

$27.280

$26.890

$26.690

$26.500

Corohmni

South Africa . 1,872 parts In-Stock

1+ parts

$82.740

100+ parts

-

1k+ parts

-

10k+ parts

-

1,872

$82.740

-

-

-

Authorized Procurement Solutions

USA . 10,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

10,000

-

-

-

-

DigiPath Technology Company

USA . 379 parts In-Stock

1+ parts

-

100+ parts

$15.891

1k+ parts

-

10k+ parts

-

379

-

$15.891

-

-

Overview

Unlock the power of cutting-edge technology with the Texas Instruments TMS320F2801NMFA Digital Signal Processor. Designed to deliver exceptional performance and reliability, this state-of-the-art device is perfect for a wide range of applications. From industrial automation to consumer electronics, the TMS320F2801NMFA offers unparalleled value, efficiency, and versatility. Trust in the quality and expertise of Texas Instruments to take your projects to the next level. Experience the difference with the TMS320F2801NMFA today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection to the DSP, making it suitable for various applications.

Maximum Supply Voltage: 1.89 V

Higher maximum supply voltage allows for flexibility in power input options for the DSP.

Bit Size: 32

32-bit architecture enables efficient processing and handling of complex data in real-time applications.

Maximum Operating Temperature: 85 °C

Wide operating temperature range ensures the DSP can perform reliably in different environmental conditions.

ADC Channels: YES

Analog-to-digital converter channels allow for seamless integration with analog sensors and signals for data processing.

Maximum Clock Frequency: 100 MHz

High clock frequency enables fast processing speeds and responsiveness in applications requiring real-time data handling.

ROM Programmability: FLASH

Flash ROM programmability provides flexibility for firmware updates and customization of the DSP's functionality.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the DSP energy-efficient and reliable.

PWM Channels: YES

Pulse-width modulation channels enable precise control over analog outputs, essential for applications such as motor control.

Low Power Mode: YES

Low power mode conserves energy and prolongs battery life in portable and energy-efficient devices utilizing the DSP.

Technical Specifications

Digital Signal Processors (DSPs) TMS320F2801NMFA attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

CPU Family:

C28X

Maximum Clock Frequency:

100 MHz

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B100

JESD-609 Code:

e1

Length:

10 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of External Interrupts:

3

No. of Terminals:

100

No. of Timers:

3

On Chip Data RAM Width:

16

On Chip Program ROM Width:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA100,10X10,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

12288

RAM Words:

6144

ROM Programmability:

FLASH

Maximum Seated Height:

1.4 mm

Maximum Supply Current:

230 mA

Maximum Supply Voltage:

1.89 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Trade Compliance

TMS320F2801NMFA Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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