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TMS320F240PQG4

Texas Instruments

TMS320F240PQG4 by Texas Instruments

TMS320F240PQG4 by Texas Instruments is a 16-bit DSP with 544 RAM words, operating at max 40 MHz clock frequency. Ideal for digital signal processing applications due to its low power mode, barrel shifter feature, and boundary scan capability.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 4,434 parts In-Stock

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4,434

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Chip Stock

USA . 3,140 parts In-Stock

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3,140

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Vyrian

USA . 2,570 parts In-Stock

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2,570

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Distributors (Availability)

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AZTECH Wire

Italy . 329 parts In-Stock

1+ parts

$9.657

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329

$9.657

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One Stop Electronics

USA . 1,391 parts In-Stock

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$18.000

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1,391

$18.000

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Parana Technologies

USA . 924 parts In-Stock

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$30.495

100+ parts

$2,831.920

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$27.445

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924

$30.495

$2,831.920

$27.445

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DigiPath Technology Company

USA . 1,858 parts In-Stock

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$33.579

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$30.892

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1,858

$33.579

$30.892

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ChromeModa Solutions

Germany . 3,097 parts In-Stock

1+ parts

$34.264

100+ parts

$28.096

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3,097

$34.264

$28.096

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IDEA Electronic Components Group

UK . 61 parts In-Stock

1+ parts

$34.264

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$32.551

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$30.838

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61

$34.264

$32.551

$30.838

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Corohmni

South Africa . 5,095 parts In-Stock

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$86.471

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5,095

$86.471

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Corphita

USA . 3,535 parts In-Stock

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3,535

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Microchip USA

USA . 245 parts In-Stock

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Overview

Enhance your digital signal processing projects with the TMS320F240PQG4 by Texas Instruments. This high-quality DSP offers unparalleled value and benefits, providing a seamless experience for customers in various applications. With advanced technology and reliable performance, this product brings innovation to the forefront, making it a top choice for professionals seeking efficiency and precision. Experience the advantages of Texas Instruments' expertise in digital signal processors with the TMS320F240PQG4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides durability and protection for the internal components of the DSP, making it suitable for long-term use.

Surface Mount: YES

Being surface mountable allows for easy assembly onto circuit boards, simplifying the manufacturing process and saving space in the design.

Maximum Supply Voltage: 5.5 V

With a maximum supply voltage of 5.5 V, this DSP can handle a wide range of power sources, increasing its versatility in different applications.

Address Bus Width: 16

The 16-bit address bus width enables the DSP to access a larger memory space and process more data efficiently, enhancing its performance capabilities.

Package Shape: SQUARE

The square package shape helps in easy mounting and alignment of the DSP onto the circuit board, ensuring a secure and precise connection.

Bit Size: 16

The 16-bit size allows the DSP to process data with higher precision and accuracy, making it suitable for applications requiring complex calculations.

Power Supplies (V): 5

Operating at a standard voltage of 5 V makes it compatible with most electronic devices and systems, ensuring seamless integration.

No. of Terminals: 132

The 132 terminals provide ample connectivity options for interfacing with external components, allowing for versatile usage in various systems.

Package Style (Meter): FLATPACK, BUMPER

The flatpack, bumper style package offers a compact and robust design, protecting the DSP from external damage and optimizing space usage.

Minimum Supply Voltage: 4.5 V

Having a minimum supply voltage of 4.5 V ensures reliable operation even in less stable power supply conditions, enhancing the overall reliability of the DSP.

Maximum Operating Temperature: 70 °C

Operating efficiently at up to 70°C allows the DSP to function in harsh environments or high-temperature conditions without compromising performance.

Minimum Operating Temperature: 0 °C

Capable of operating at 0°C ensures the DSP can be used in a wide range of temperature settings, making it suitable for diverse applications.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish provides excellent conductivity and corrosion resistance, ensuring a reliable connection between the DSP and external components.

Terminal Position: QUAD

The quad terminal position offers stable mounting and secure attachment to the circuit board, reducing the risk of signal interference and improving overall performance.

Maximum Seated Height: 4.57 mm

With a maximum seated height of 4.57 mm, the DSP can fit into compact spaces without compromising its functionality or performance.

RAM Words: 544

Having 544 RAM words allows the DSP to store and retrieve data quickly, improving processing speed and overall efficiency in data-intensive applications.

Width: 24.13 mm

The 24.13 mm width makes the DSP compatible with standard PCB layouts, ensuring easy integration into existing electronic designs.

Boundary Scan: YES

Featuring boundary scan capability allows for efficient testing and debugging of the DSP during the manufacturing process, ensuring quality control and reliability.

External Data Bus Width: 16

A wider 16-bit external data bus enables the DSP to handle larger data transfers and communicate effectively with external devices, enhancing its functionality.

Maximum Clock Frequency: 40 MHz

Operating at a maximum clock frequency of 40 MHz ensures high-speed processing and responsiveness, making the DSP suitable for real-time applications.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum time of 30 seconds at peak reflow temperature, the DSP can undergo reflow soldering processes without risking damage to its components.

Peak Reflow Temperature °C: 260

Capable of withstanding peak reflow temperatures of 260°C ensures the DSP's reliability and durability during soldering and assembly processes.

Internal Bus Architecture: MULTIPLE

Having multiple internal bus architectures enhances data flow and communication within the DSP, optimizing performance and efficiency in processing tasks.

Length: 24.13 mm

The 24.13 mm length offers a compact form factor for the DSP, making it suitable for space-constrained applications without compromising functionality.

Temperature Grade: COMMERCIAL

Designed for commercial-grade operating temperatures, the DSP is suitable for a wide range of consumer electronics and industrial applications.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Being classified as a digital signal processor with additional peripheral capabilities expands the DSP's functionality and versatility for various applications.

Technology: CMOS

Utilizing CMOS technology offers low power consumption and high noise immunity, making the DSP energy-efficient and reliable for long-term operation.

Terminal Form: GULL WING

The gull wing terminal form provides mechanical stability and secure soldering connections, ensuring reliable transmission of signals and data.

Nominal Supply Voltage: 5 V

Operating at a nominal supply voltage of 5 V ensures compatibility with standard power sources, simplifying integration and reducing the need for additional voltage regulation.

Terminal Pitch: 0.635 mm

Having a terminal pitch of 0.635 mm allows for precise alignment and soldering of the DSP onto the circuit board, ensuring a reliable electrical connection.

Format: FIXED POINT

Featuring a fixed-point format enables the DSP to perform arithmetic operations with high precision and efficiency, making it suitable for a wide range of computational tasks.

Moisture Sensitivity Level (MSL): 4

With an MSL of 4, the DSP is designed to withstand moderate moisture exposure during storage and handling, ensuring long-term reliability in various environments.

Low Power Mode: YES

Featuring a low power mode allows the DSP to conserve energy and extend battery life, making it ideal for portable devices and applications requiring energy efficiency.

Barrel Shifter: YES

The inclusion of a barrel shifter enhances the DSP's ability to perform complex shift operations efficiently, improving processing speed and overall performance.

Technical Specifications

Digital Signal Processors (DSPs) TMS320F240PQG4 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

16

Barrel Shifter:

YES

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

40 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PQFP-G132

JESD-609 Code:

e4

Length:

24.13 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

132

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SPQFP132,1.1SQ

Package Shape:

Package Style (Meter):

FLATPACK, BUMPER

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Words:

544

Maximum Seated Height:

4.57 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

24.13 mm

Peripheral IC Type:

Trade Compliance

TMS320F240PQG4 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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