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TMS320DM8168SCYG2

Texas Instruments

TMS320DM8168SCYG2 by Texas Instruments

TMS320DM8168SCYG2 by Texas Instruments is a 32-bit DSP with integrated cache, 15-bit address bus width, and 32-bit external data bus width. Ideal for digital signal processing applications due to its multiple internal bus architecture, low power mode, and 72 DMA channels.

Median Price

$148.368

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,404 parts In-Stock

1+ parts

$128.485

100+ parts

$124.620

1k+ parts

$96.605

10k+ parts

-

1,404

$128.485

$124.620

$96.605

-

DigiKey

USA . 44 parts In-Stock

1+ parts

$168.250

100+ parts

$133.374

1k+ parts

-

10k+ parts

-

44

$168.250

$133.374

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,068 parts In-Stock

1+ parts

$111.920

100+ parts

-

1k+ parts

-

10k+ parts

-

1,068

$111.920

-

-

-

Vyrian

USA . 4,967 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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4,967

-

-

-

-

Cyclops Electronics Ltd

UK . 440 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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440

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 636 parts In-Stock

1+ parts

$22.280

100+ parts

-

1k+ parts

$22.953

10k+ parts

-

636

$22.280

-

$22.953

-

DigiPath Technology Company

USA . 1,251 parts In-Stock

1+ parts

$24.533

100+ parts

-

1k+ parts

-

10k+ parts

-

1,251

$24.533

-

-

-

ChromeModa Solutions

Germany . 4,215 parts In-Stock

1+ parts

$25.034

100+ parts

$20.528

1k+ parts

-

10k+ parts

-

4,215

$25.034

$20.528

-

-

IDEA Electronic Components Group

UK . 1,346 parts In-Stock

1+ parts

$25.034

100+ parts

$23.782

1k+ parts

$22.531

10k+ parts

-

1,346

$25.034

$23.782

$22.531

-

Corohmni

South Africa . 743 parts In-Stock

1+ parts

$66.820

100+ parts

-

1k+ parts

-

10k+ parts

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743

$66.820

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-

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Corphita

USA . 3,298 parts In-Stock

1+ parts

$106.029

100+ parts

-

1k+ parts

-

10k+ parts

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3,298

$106.029

-

-

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Microchip USA

USA . 1,458 parts In-Stock

1+ parts

$153.780

100+ parts

$149.680

1k+ parts

$147.630

10k+ parts

$145.580

1,458

$153.780

$149.680

$147.630

$145.580

Lixinc

USA . 19,682 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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19,682

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-

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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4,000

-

-

-

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GreenTree Electronics

Israel . 440 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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440

-

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Overview

Upgrade your digital signal processing capabilities with the TMS320DM8168SCYG2 by Texas Instruments. Known for their top-notch quality and reliability, Texas Instruments delivers excellence in the field of DSPs. This powerful processor is perfect for a wide range of applications, offering unmatched value and benefits to customers. From multimedia systems to industrial automation, this product provides the performance and efficiency you need for your next project. Experience the advantage of cutting-edge technology with the TMS320DM8168SCYG2.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material provides durability and protection for the DSP, making it resistant to external damage.

Integrated Cache: YES

Having an integrated cache enhances the processing speed and efficiency of the DSP, allowing for quick data retrieval and execution.

Maximum Supply Voltage: 1.05 V

The high maximum supply voltage ensures stable performance of the DSP under varying conditions, increasing its reliability.

Address Bus Width: 15

With a wide address bus width of 15, the DSP can handle large amounts of memory addresses, enabling it to process complex algorithms efficiently.

Package Shape: SQUARE

The square package shape allows for easy integration and placement of the DSP into electronic devices, optimizing space usage.

Bit Size: 32

A 32-bit size allows the DSP to process data quickly and accurately, making it suitable for demanding computational tasks.

No. of Terminals: 1031

The high number of terminals provides ample connectivity options, enabling the DSP to interface with a wide range of external devices.

Terminal Position: BOTTOM

Having terminals at the bottom simplifies the PCB layout and allows for efficient heat dissipation, improving overall system performance.

Width: 25 mm

The compact width of 25 mm makes the DSP suitable for space-constrained applications, offering flexibility in design and installation.

Boundary Scan: YES

The boundary scan feature facilitates debugging and testing of the DSP, ensuring robust functionality and easy maintenance.

Technical Specifications

Digital Signal Processors (DSPs) TMS320DM8168SCYG2 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

15

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

External Data Bus Width:

32

Format:

FLOATING POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B1031

JESD-609 Code:

e1

Length:

25 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of DMA Channels:

72

No. of Terminals:

No. of Timers:

8

Maximum Operating Temperature:

95 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA1031,37X37,25

Package Shape:

Package Style (Meter):

GRID ARRAY, HEAT SINK/SLUG

Peak Reflow Temperature (C):

245

Power Supplies (V):

1

Qualification:

Not Qualified

RAM Words:

16384

Maximum Seated Height:

3.31 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.05 V

Minimum Supply Voltage:

.95 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

25 mm

Peripheral IC Type:

Trade Compliance

TMS320DM8168SCYG2 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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