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TMS320DM8167SCYG2

Texas Instruments

TMS320DM8167SCYG2 by Texas Instruments

TMS320DM8167SCYG2 by Texas Instruments is a 32-bit DSP with integrated cache and 32-bit external data bus width. It features 72 DMA channels and operates in low power mode, making it ideal for applications requiring high-performance signal processing in commercial-grade environments.

Median Price

$109.705

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

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Texas Instruments

USA . 7,186 parts In-Stock

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$109.705

100+ parts

$106.406

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$82.485

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7,186

$109.705

$106.406

$82.485

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Distributors (In-Stock)

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Bristol Electronics

USA . 42 parts In-Stock

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$98.892

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$81.092

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42

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Digiode

USA . 3,475 parts In-Stock

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$104.220

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Vyrian

USA . 6,622 parts In-Stock

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Cyclops Electronics Ltd

UK . 1,234 parts In-Stock

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Nova Conductors

Japan . 300 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 42 parts In-Stock

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Dan-Mar Components

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Distributors (Availability)

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Advanced Electronics

New Zealand . 270 parts In-Stock

1+ parts

$13.110

100+ parts

$11.930

1k+ parts

$10.750

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270

$13.110

$11.930

$10.750

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AZTECH Wire

Italy . 1,114 parts In-Stock

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$15.450

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Parana Technologies

USA . 363 parts In-Stock

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$69.044

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$69.044

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Corohmni

South Africa . 1,041 parts In-Stock

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$69.494

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DigiPath Technology Company

USA . 618 parts In-Stock

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$76.025

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$69.943

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618

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ChromeModa Solutions

Germany . 2,698 parts In-Stock

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$77.577

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$63.613

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$77.577

$63.613

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IDEA Electronic Components Group

UK . 740 parts In-Stock

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$77.577

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$73.698

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$69.819

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740

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$69.819

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Ampacity Inc.

Singapore . 7,046 parts In-Stock

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$93.250

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Corphita

USA . 3,373 parts In-Stock

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$98.734

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Microchip USA

USA . 2,081 parts In-Stock

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$134.590

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$131.000

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$129.210

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$127.410

2,081

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$127.410

Lixinc

USA . 17,266 parts In-Stock

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iodParts Technologies Inc.

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Argo Parts USA

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Continental Prestige Electronics

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Authorized Procurement Solutions

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GreenTree Electronics

Israel . 1,056 parts In-Stock

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A-Z Elektronik GmbH

Germany . 276 parts In-Stock

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Kepictronics

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Bastille Electronics

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Overview

Experience unparalleled performance and efficiency with the TMS320DM8167SCYG2 by Texas Instruments. As a leading manufacturer in the industry of Digital Signal Processors, Texas Instruments delivers cutting-edge technology that exceeds expectations. This versatile product is perfect for applications requiring high-speed data processing and advanced signal control. With integrated cache and low power mode, the TMS320DM8167SCYG2 offers customers unmatched value and benefits. Upgrade your projects with this top-of-the-line DSP and unlock a world of possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protects the internal components of the DSP, ensuring a longer product lifespan.

Integrated Cache: YES

Having an integrated cache helps improve processing speed and efficiency, making this DSP suitable for demanding applications.

Surface Mount: YES

Surface mount technology allows for easy installation and compact design, ideal for space-constrained applications.

Maximum Supply Voltage: 1.05 V

The maximum supply voltage ensures safe operation and prevents damage to the DSP.

Address Bus Width: 15

A wider address bus allows for efficient data transfer and processing, enhancing the overall performance of the DSP.

Package Shape: SQUARE

The square package shape provides a compact footprint, making it easy to integrate this DSP into different systems.

Bit Size: 32

A 32-bit architecture allows for high-speed processing and complex calculations, making this DSP suitable for advanced applications.

No. of Terminals: 1031

The high number of terminals allows for versatile connectivity options, enabling the DSP to interface with various other components.

Package Style (Meter): GRID ARRAY, HEAT SINK/SLUG

The grid array package style with a heat sink/slug provides efficient heat dissipation, ensuring optimal performance even under heavy workloads.

Minimum Supply Voltage: 0.95 V

The minimum supply voltage allows for energy-efficient operation, reducing power consumption and heat generation.

Maximum Operating Temperature: 95 °C

The high maximum operating temperature range ensures reliable performance even in harsh environmental conditions.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature range ensures the DSP can operate in a wide range of temperature environments.

Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)

The terminal finish of tin/silver/copper provides excellent conductivity and corrosion resistance, ensuring reliable connections.

Terminal Position: BOTTOM

Having terminals at the bottom makes it easier to mount the DSP on a PCB and reduces the overall height profile of the device.

Maximum Seated Height: 3.31 mm

The low maximum seated height allows for a slim and compact design, making it suitable for space-constrained applications.

RAM Words: 16384

The large RAM capacity allows for efficient data storage and retrieval, supporting complex algorithms and calculations.

Technical Specifications

Digital Signal Processors (DSPs) TMS320DM8167SCYG2 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

15

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

External Data Bus Width:

32

Format:

FLOATING POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B1031

JESD-609 Code:

e1

Length:

25 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of DMA Channels:

72

No. of Terminals:

No. of Timers:

8

Maximum Operating Temperature:

95 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA1031,37X37,25

Package Shape:

Package Style (Meter):

GRID ARRAY, HEAT SINK/SLUG

Peak Reflow Temperature (C):

245

Power Supplies (V):

1

Qualification:

Not Qualified

RAM Words:

16384

Maximum Seated Height:

3.31 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.05 V

Minimum Supply Voltage:

.95 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

25 mm

Peripheral IC Type:

Trade Compliance

TMS320DM8167SCYG2 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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