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TMS320DM8165SCYG4

Texas Instruments

TMS320DM8165SCYG4 by Texas Instruments

TMS320DM8165SCYG4 by Texas Instruments is a 32-bit DSP with integrated cache, 15-bit address bus width, and 32-bit external data bus width. It is used in digital signal processing applications requiring high performance and low power consumption.

Median Price

$106.585

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 620 parts In-Stock

1+ parts

$106.585

100+ parts

$103.379

1k+ parts

$80.139

10k+ parts

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620

$106.585

$103.379

$80.139

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Distributors (In-Stock)

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Digiode

USA . 2,413 parts In-Stock

1+ parts

$101.256

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2,413

$101.256

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Vyrian

USA . 2,124 parts In-Stock

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2,124

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Distributors (Availability)

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AZTECH Wire

Italy . 43 parts In-Stock

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$15.730

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43

$15.730

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Parana Technologies

USA . 2,050 parts In-Stock

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$36.008

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$36.008

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DigiPath Technology Company

USA . 1,933 parts In-Stock

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$39.649

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1,933

$39.649

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ChromeModa Solutions

Germany . 6,702 parts In-Stock

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$40.458

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$33.176

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6,702

$40.458

$33.176

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IDEA Electronic Components Group

UK . 1,205 parts In-Stock

1+ parts

$40.458

100+ parts

$38.435

1k+ parts

$36.412

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1,205

$40.458

$38.435

$36.412

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Corohmni

South Africa . 515 parts In-Stock

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$45.828

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515

$45.828

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Corphita

USA . 926 parts In-Stock

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$95.926

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926

$95.926

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QUARKTWIN TECHNOLOGY LTD

USA . 10,149 parts In-Stock

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Microchip USA

USA . 1,040 parts In-Stock

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Component Stockers USA

USA . 425 parts In-Stock

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425

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GreenTree Electronics

Israel . 6 parts In-Stock

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Overview

Experience top-notch performance and reliability with the TMS320DM8165SCYG4 by Texas Instruments, a leading manufacturer in the industry. This Digital Signal Processor (DSP) is packed with integrated cache and advanced features, making it ideal for a wide range of applications. From audio processing to image recognition, this product offers exceptional value, benefits, and advantages to customers seeking cutting-edge solutions. Trust Texas Instruments for superior quality and innovation in the world of DSPs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable devices.

Integrated Cache: YES

Having an integrated cache helps in faster data processing and improves overall efficiency of the DSP.

Maximum Supply Voltage: 1.05 V

Operating at a maximum supply voltage of 1.05V ensures energy efficiency and reduces power consumption.

Address Bus Width: 15

Having a wide address bus width of 15 allows for efficient memory access and data retrieval.

Package Shape: SQUARE

The square package shape helps in easy mounting and integration into circuit boards, saving space.

Bit Size: 32

With a bit size of 32, the DSP can handle complex mathematical operations and signal processing tasks effectively.

No. of Terminals: 1031

Having a large number of terminals allows for connectivity with multiple external devices and peripherals.

RAM Words: 16384

The ample RAM words ensure sufficient memory for storing data and executing multiple tasks simultaneously.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, MIXED

Being a mixed digital signal processor allows for versatile use in various applications requiring signal processing capabilities.

Technology: CMOS

Using CMOS technology enables efficient power consumption and high-speed performance of the DSP.

Technical Specifications

Digital Signal Processors (DSPs) TMS320DM8165SCYG4 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

15

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

External Data Bus Width:

32

Format:

FLOATING POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B1031

JESD-609 Code:

e1

Length:

25 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of DMA Channels:

72

No. of Terminals:

No. of Timers:

8

Maximum Operating Temperature:

95 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA1031,37X37,25

Package Shape:

Package Style (Meter):

GRID ARRAY, HEAT SINK/SLUG

Peak Reflow Temperature (C):

245

Power Supplies (V):

1

Qualification:

Not Qualified

RAM Words:

16384

Maximum Seated Height:

3.31 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.05 V

Minimum Supply Voltage:

.95 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

25 mm

Peripheral IC Type:

Trade Compliance

TMS320DM8165SCYG4 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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