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TMS320DM8165SCYG2

Texas Instruments

TMS320DM8165SCYG2 by Texas Instruments

TMS320DM8165SCYG2 by Texas Instruments is a 32-bit DSP with integrated cache, 32-bit external data bus width, and 72 DMA channels. It is used in commercial applications requiring high-performance digital signal processing capabilities. The package style is grid array with a heat sink/slug for efficient thermal management.

Median Price

$84.833

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 2,524 parts In-Stock

1+ parts

$84.833

100+ parts

$82.281

1k+ parts

$63.784

10k+ parts

-

2,524

$84.833

$82.281

$63.784

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,208 parts In-Stock

1+ parts

$80.591

100+ parts

-

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-

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3,208

$80.591

-

-

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Vyrian

USA . 4,790 parts In-Stock

1+ parts

-

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-

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-

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4,790

-

-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 340 parts In-Stock

1+ parts

$15.640

100+ parts

-

1k+ parts

-

10k+ parts

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340

$15.640

-

-

-

Parana Technologies

USA . 627 parts In-Stock

1+ parts

$57.124

100+ parts

$5,304.808

1k+ parts

$51.411

10k+ parts

-

627

$57.124

$5,304.808

$51.411

-

DigiPath Technology Company

USA . 342 parts In-Stock

1+ parts

$62.900

100+ parts

-

1k+ parts

-

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342

$62.900

-

-

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ChromeModa Solutions

Germany . 5,113 parts In-Stock

1+ parts

$64.184

100+ parts

$52.631

1k+ parts

-

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-

5,113

$64.184

$52.631

-

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IDEA Electronic Components Group

UK . 61 parts In-Stock

1+ parts

$64.184

100+ parts

$60.975

1k+ parts

$57.766

10k+ parts

-

61

$64.184

$60.975

$57.766

-

Corphita

USA . 4,634 parts In-Stock

1+ parts

$76.350

100+ parts

-

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-

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4,634

$76.350

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Corohmni

South Africa . 459 parts In-Stock

1+ parts

$86.323

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459

$86.323

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Microchip USA

USA . 1,723 parts In-Stock

1+ parts

$220.275

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1,723

$220.275

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A-Z Elektronik GmbH

Germany . 5,895 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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5,895

-

-

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GreenTree Electronics

Israel . 1,980 parts In-Stock

1+ parts

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1,980

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Kepictronics

USA . 41 parts In-Stock

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41

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Perfect Parts

USA . 6 parts In-Stock

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6

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Overview

Unleash the power of cutting-edge technology with the TMS320DM8165SCYG2 by Texas Instruments. As a leader in the industry, Texas Instruments delivers top-notch quality in digital signal processors. This DSP is versatile and ideal for a wide range of applications, offering unmatched performance and reliability. With integrated cache, low power mode, and multiple timers, this product provides exceptional value and benefits to customers looking for high-quality solutions. Upgrade your projects with the TMS320DM8165SCYG2 and experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY materials make the product lightweight and durable, ensuring longevity and portability.

Integrated Cache: YES

The integrated cache allows for faster access to frequently used data, improving overall performance.

Surface Mount: YES

Surface mount technology simplifies the assembly process and reduces overall size, making the product suitable for compact designs.

Maximum Supply Voltage: 1.05 V

The low maximum supply voltage makes the product energy-efficient and reduces power consumption.

Address Bus Width: 15

A wider address bus allows for better memory addressing capabilities, enhancing the product's processing speed and efficiency.

Package Shape: SQUARE

The square package shape provides efficient use of space and easy integration into various applications.

Bit Size: 32

A 32-bit architecture allows for processing larger chunks of data at a time, improving overall performance and speed.

No. of Terminals: 1031

A higher number of terminals allow for more connectivity options and functionality, making the product versatile and adaptable.

Package Style (Meter): GRID ARRAY, HEAT SINK/SLUG

The grid array package style with a heat sink ensures efficient heat dissipation and overall product reliability in demanding conditions.

Minimum Supply Voltage: 0.95 V

The low minimum supply voltage further enhances the product's energy efficiency and power-saving capabilities.

Maximum Operating Temperature: 95 °C

With a high maximum operating temperature, the product can withstand heat-intensive environments and maintain optimal performance.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures the product can function in a wide range of temperature conditions, increasing its usability.

Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)

The use of high-quality terminal finishes like tin, silver, and copper ensures reliable electrical connections and corrosion resistance.

Terminal Position: BOTTOM

The bottom terminal position simplifies installation and maintenance, making the product user-friendly and convenient.

Maximum Seated Height: 3.31 mm

The low maximum seated height allows for a compact design and easy integration into space-constrained applications.

RAM Words: 16384

With a large RAM capacity, the product can handle a high volume of data processing, improving overall performance and multitasking capabilities.

Width: 25 mm

The compact width of the product makes it suitable for small form factor designs and applications where space is limited.

Boundary Scan: YES

Boundary scan capability allows for easy testing and debugging of the product during manufacturing and maintenance processes.

External Data Bus Width: 32

A wide external data bus width enables faster data transfer between the processor and external devices, enhancing overall performance.

Peak Reflow Temperature °C: 245

The high peak reflow temperature ensures proper soldering and assembly of the product, improving long-term reliability.

Internal Bus Architecture: MULTIPLE

Multiple internal bus architectures allow for efficient data flow within the processor, enhancing performance and multitasking capabilities.

Length: 25 mm

The compact length of the product makes it suitable for space-constrained applications and contributes to a streamlined design.

Temperature Grade: COMMERCIAL

The commercial temperature grade ensures the product's reliability and compatibility with standard operating conditions in commercial applications.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, MIXED

The mixed peripheral IC type allows for versatile connectivity options and integration with a wide range of devices, enhancing the product's functionality.

No. of Timers: 8

The inclusion of 8 timers provides timing and scheduling capabilities, enhancing the product's versatility for applications that require precise timing control.

Technology: CMOS

CMOS technology offers low power consumption and high speed, making the product energy-efficient and suitable for battery-powered applications.

Terminal Form: BALL

The ball terminal form simplifies soldering and ensures reliable electrical connections, enhancing the product's durability and ease of use.

Nominal Supply Voltage: 1 V

The 1V nominal supply voltage provides a stable power source for the product, ensuring consistent performance and reliability.

No. of DMA Channels: 72

The high number of DMA channels allows for efficient data transfer and processing, improving overall system performance and responsiveness.

Terminal Pitch: 0.65 mm

The compact terminal pitch enables high-density mounting and reduces overall footprint, making the product suitable for miniaturized designs.

Format: FLOATING POINT

The floating-point format offers enhanced precision for complex mathematical calculations, making the product ideal for applications that require high computational accuracy.

Moisture Sensitivity Level (MSL): 4

The MSL 4 rating indicates the product's resistance to moisture damage, ensuring reliability in humid environments and during handling.

Low Power Mode: YES

The low power mode feature allows the product to conserve energy during idle or low-demand periods, extending battery life and reducing overall power consumption.

Technical Specifications

Digital Signal Processors (DSPs) TMS320DM8165SCYG2 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

15

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

External Data Bus Width:

32

Format:

FLOATING POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B1031

JESD-609 Code:

e1

Length:

25 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of DMA Channels:

72

No. of Terminals:

No. of Timers:

8

Maximum Operating Temperature:

95 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA1031,37X37,25

Package Shape:

Package Style (Meter):

GRID ARRAY, HEAT SINK/SLUG

Peak Reflow Temperature (C):

245

Power Supplies (V):

1

Qualification:

Not Qualified

RAM Words:

16384

Maximum Seated Height:

3.31 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.05 V

Minimum Supply Voltage:

.95 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

25 mm

Peripheral IC Type:

Trade Compliance

TMS320DM8165SCYG2 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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