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TMS320DM648CUTD7

Texas Instruments

TMS320DM648CUTD7 by Texas Instruments

TMS320DM648CUTD7 by Texas Instruments is a 32-bit DSP with 720MHz clock frequency, 64 DMA channels, and 8 timers. Ideal for industrial applications requiring high-speed processing and low power consumption. Features include integrated cache, multiple internal bus architecture, and boundary scan capability.

Median Price

$84.023

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 88 parts In-Stock

1+ parts

$84.023

100+ parts

$74.687

1k+ parts

$54.917

10k+ parts

-

88

$84.023

$74.687

$54.917

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,909 parts In-Stock

1+ parts

$79.822

100+ parts

-

1k+ parts

-

10k+ parts

-

2,909

$79.822

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-

-

Vyrian

USA . 2,278 parts In-Stock

1+ parts

-

100+ parts

-

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-

10k+ parts

-

2,278

-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,067 parts In-Stock

1+ parts

$17.437

100+ parts

-

1k+ parts

$17.639

10k+ parts

-

2,067

$17.437

-

$17.639

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AZTECH Wire

Italy . 565 parts In-Stock

1+ parts

$18.250

100+ parts

-

1k+ parts

-

10k+ parts

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565

$18.250

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-

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ChromeModa Solutions

Germany . 4,763 parts In-Stock

1+ parts

$19.592

100+ parts

$16.065

1k+ parts

-

10k+ parts

-

4,763

$19.592

$16.065

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IDEA Electronic Components Group

UK . 2,195 parts In-Stock

1+ parts

$19.592

100+ parts

$18.612

1k+ parts

$17.633

10k+ parts

-

2,195

$19.592

$18.612

$17.633

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Corohmni

South Africa . 3,028 parts In-Stock

1+ parts

$26.789

100+ parts

-

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-

10k+ parts

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3,028

$26.789

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Corphita

USA . 2,779 parts In-Stock

1+ parts

$75.621

100+ parts

-

1k+ parts

-

10k+ parts

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2,779

$75.621

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-

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Microchip USA

USA . 376 parts In-Stock

1+ parts

$169.670

100+ parts

$166.720

1k+ parts

$165.240

10k+ parts

$163.770

376

$169.670

$166.720

$165.240

$163.770

DigiPath Technology Company

USA . 780 parts In-Stock

1+ parts

-

100+ parts

$17.664

1k+ parts

-

10k+ parts

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780

-

$17.664

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Overview

Unlock the power of cutting-edge technology with the TMS320DM648CUTD7 by Texas Instruments. As a leader in digital signal processors, Texas Instruments delivers top-notch quality and reliability. This DSP offers unparalleled performance with integrated cache and a maximum clock frequency of 720 MHz, making it ideal for a wide range of applications. From industrial automation to telecommunications, this versatile product provides customers with the value, benefits, and advantages they need to stay ahead in today's competitive market. Choose Texas Instruments for superior innovation and make the most of every opportunity with the TMS320DM648CUTD7.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, making the product suitable for a wide range of environments.

Integrated Cache: YES

Improves processing speed and efficiency by storing frequently accessed data closer to the processor, reducing latency.

Maximum Supply Voltage: 1.26 V

Allows for safe operation within specified voltage limits while ensuring optimal performance.

On Chip Data RAM Width: 8

Allows for faster data processing and storage capabilities within the chip itself, reducing the need for external memory.

Address Bus Width: 14

Enables efficient communication with external devices and memory modules, enhancing overall system performance.

Bit Size: 32

Provides sufficient processing power for complex algorithms and computations, making the DSP suitable for a variety of applications.

Power Supplies (V): 1.2,1.8,3.3

Offers flexibility in power options, allowing the device to be used in a range of power scenarios while maintaining stable performance.

No. of Terminals: 520

Provides ample connectivity options for external devices and peripherals, enhancing the versatility of the product.

Package Style (Meter): GRID ARRAY

Facilitates easy installation and maintenance due to its grid pattern layout, making it suitable for mass production and integration.

Minimum Operating Temperature: -40 °C

Ensures reliable operation in harsh environments with low temperatures, making the product suitable for a wide range of applications.

Maximum Clock Frequency: 720 MHz

Allows for high-speed processing of data and instructions, enabling quick response times and efficient operation.

Technical Specifications

Digital Signal Processors (DSPs) TMS320DM648CUTD7 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

14

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

720 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B520

JESD-609 Code:

e1

Length:

19 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of DMA Channels:

64

No. of Terminals:

520

No. of Timers:

8

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA529,23X23,32

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

245

Power Supplies (V):

1.2,1.8,3.3

Qualification:

Not Qualified

RAM Words:

8192

ROM Programmability:

MROM

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

19 mm

Peripheral IC Type:

Trade Compliance

TMS320DM648CUTD7 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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