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TMS320DM648CUTA8

Texas Instruments

TMS320DM648CUTA8 by Texas Instruments

TMS320DM648CUTA8 by Texas Instruments is a 32-bit DSP with 800 MHz clock frequency, 64 DMA channels, and 1.2V nominal voltage. Ideal for industrial applications requiring high-speed data processing and low power consumption. Features integrated cache, multiple internal bus architecture, and boundary scan capability for efficient system design.

Median Price

$87.524

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,100 parts In-Stock

1+ parts

$87.524

100+ parts

$77.799

1k+ parts

$57.205

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1,100

$87.524

$77.799

$57.205

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Distributors (In-Stock)

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Digiode

USA . 4,324 parts In-Stock

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$83.148

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Vyrian

USA . 8,288 parts In-Stock

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Chip Stock

USA . 3,058 parts In-Stock

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Holdelec - ElecDif-Pro

France . 2 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 477 parts In-Stock

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$8.660

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477

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Corohmni

South Africa . 666 parts In-Stock

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$20.984

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Parana Technologies

USA . 1,794 parts In-Stock

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$71.656

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Ampacity Inc.

Singapore . 859 parts In-Stock

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$74.400

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Corphita

USA . 4,478 parts In-Stock

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$78.772

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DigiPath Technology Company

USA . 1,636 parts In-Stock

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$78.902

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$72.590

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IDEA Electronic Components Group

UK . 2,182 parts In-Stock

1+ parts

$80.512

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$76.486

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$72.461

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2,182

$80.512

$76.486

$72.461

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ChromeModa Solutions

Germany . 779 parts In-Stock

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$80.512

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$66.020

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Perfect Parts

USA . 94 parts In-Stock

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Overview

Experience the power of cutting-edge technology with the TMS320DM648CUTA8 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality Digital Signal Processors that provide unmatched performance and reliability. With applications ranging from industrial automation to audio processing, this DSP offers customers value and benefits like never before. Unlock the potential of your projects with the TMS320DM648CUTA8 and discover a world of possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and ensures protection for the internal components of the DSP.

Integrated Cache: YES

Improves processing speed by storing frequently accessed data for quick retrieval.

Maximum Supply Voltage: 1.26 V

Supports a wide range of supply voltages for flexibility in different applications.

Address Bus Width: 14

Allows for efficient memory addressing and data transfer within the DSP.

Bit Size: 32

Enables the DSP to process data in 32-bit chunks for high performance.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high speed operation.

Maximum Clock Frequency: 800 MHz

Provides high clock frequency for fast execution of DSP algorithms.

Temperature Grade: INDUSTRIAL

Suitable for industrial applications with wide temperature range support.

Technical Specifications

Digital Signal Processors (DSPs) TMS320DM648CUTA8 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

14

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

800 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B520

JESD-609 Code:

e1

Length:

19 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of DMA Channels:

64

No. of Terminals:

520

No. of Timers:

8

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA529,23X23,32

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

245

Power Supplies (V):

1.2,1.8,3.3

Qualification:

Not Qualified

RAM Words:

8192

ROM Programmability:

MROM

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

19 mm

Peripheral IC Type:

Trade Compliance

TMS320DM648CUTA8 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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