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TMS320DM643AGNZ5

Texas Instruments

TMS320DM643AGNZ5 by Texas Instruments

TMS320DM643AGNZ5 by Texas Instruments is a 32-bit DSP with integrated cache, 64-bit external data bus width, and max clock frequency of 100 MHz. It is used in digital signal processing applications requiring low power consumption and high-speed data processing capabilities.

Median Price

$70.710

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 840 parts In-Stock

1+ parts

$66.570

100+ parts

$59.174

1k+ parts

$43.510

10k+ parts

-

840

$66.570

$59.174

$43.510

-

Rochester

USA . 2,394 parts In-Stock

1+ parts

-

100+ parts

$70.710

1k+ parts

$63.270

10k+ parts

$59.540

2,394

-

$70.710

$63.270

$59.540

DigiKey

USA . 2,394 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,394

-

-

-

-

Verical

USA . 1,614 parts In-Stock

1+ parts

-

100+ parts

$88.388

1k+ parts

$79.088

10k+ parts

$74.425

1,614

-

$88.388

$79.088

$74.425

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey Marketplace

USA . 2,394 parts In-Stock

1+ parts

$57.140

100+ parts

-

1k+ parts

-

10k+ parts

-

2,394

$57.140

-

-

-

Digiode

USA . 4,482 parts In-Stock

1+ parts

$59.907

100+ parts

-

1k+ parts

-

10k+ parts

-

4,482

$59.907

-

-

-

Vyrian

USA . 7,856 parts In-Stock

1+ parts

-

100+ parts

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7,856

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-

-

-

Zilex Electronics Inc.

Canada . 159 parts In-Stock

1+ parts

-

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-

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159

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 883 parts In-Stock

1+ parts

$30.058

100+ parts

-

1k+ parts

-

10k+ parts

-

883

$30.058

-

-

-

Parana Technologies

USA . 703 parts In-Stock

1+ parts

$43.296

100+ parts

-

1k+ parts

-

10k+ parts

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703

$43.296

-

-

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DigiPath Technology Company

USA . 2,157 parts In-Stock

1+ parts

$47.674

100+ parts

$43.860

1k+ parts

-

10k+ parts

-

2,157

$47.674

$43.860

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-

ChromeModa Solutions

Germany . 1,960 parts In-Stock

1+ parts

$48.647

100+ parts

$39.891

1k+ parts

-

10k+ parts

-

1,960

$48.647

$39.891

-

-

IDEA Electronic Components Group

UK . 778 parts In-Stock

1+ parts

$48.647

100+ parts

$46.215

1k+ parts

$43.782

10k+ parts

-

778

$48.647

$46.215

$43.782

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Component Stockers USA

USA . 3,445 parts In-Stock

1+ parts

$56.710

100+ parts

$53.310

1k+ parts

$48.200

10k+ parts

-

3,445

$56.710

$53.310

$48.200

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Corphita

USA . 4,489 parts In-Stock

1+ parts

$56.754

100+ parts

-

1k+ parts

-

10k+ parts

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4,489

$56.754

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-

-

Microchip USA

USA . 151 parts In-Stock

1+ parts

$136.200

100+ parts

$135.010

1k+ parts

$135.010

10k+ parts

$133.830

151

$136.200

$135.010

$135.010

$133.830

Overview

Experience the cutting-edge performance of the TMS320DM643AGNZ5 by Texas Instruments, a top-tier manufacturer renowned for producing high-quality Digital Signal Processors (DSPs). This versatile product is ideal for a wide range of applications, offering integrated cache and low power mode for optimized efficiency. With an impressive array of features and benefits, including multiple DMA channels and boundary scan capability, this DSP provides exceptional value and performance for customers seeking top-of-the-line processing solutions. Unlock the potential of your projects with the TMS320DM643AGNZ5.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material ensures the product is robust and easy to handle.

Integrated Cache: YES

Having integrated cache helps in faster data access and processing, enhancing overall performance.

Maximum Supply Voltage: 1.26 V

Operates efficiently within a specified voltage range, ensuring stability and reliability.

Address Bus Width: 20

Wide address bus width allows for efficient memory access and data handling.

Bit Size: 32

32-bit architecture provides high processing capabilities and performance.

RAM Words: 16384

Large RAM capacity allows for storing and accessing a significant amount of data for processing.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Designed specifically for digital signal processing applications, making it a specialized and optimized choice for such tasks.

Technology: CMOS

CMOS technology ensures low power consumption and high-speed operation, making the product energy-efficient.

Technical Specifications

Digital Signal Processors (DSPs) TMS320DM643AGNZ5 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

20

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

100 MHz

External Data Bus Width:

64

Format:

FIXED POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B548

JESD-609 Code:

e0

Length:

27 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of DMA Channels:

64

No. of External Interrupts:

4

No. of Terminals:

548

No. of Timers:

3

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA548,26X26,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

220

Power Supplies (V):

1.4,3.3

Qualification:

Not Qualified

RAM Words:

16384

Maximum Seated Height:

2.8 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

20

Width:

27 mm

Peripheral IC Type:

Trade Compliance

TMS320DM643AGNZ5 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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