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TMS320DM6435ZWTL

Texas Instruments

TMS320DM6435ZWTL by Texas Instruments

TMS320DM6435ZWTL by Texas Instruments is a 32-bit DSP with integrated cache and 20480 RAM words. It operates at 1.14-1.26V, suitable for digital signal processing applications requiring low power consumption and high performance in a compact package with 361 terminals.

Median Price

$39.898

Lifecycle Status

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13

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1k+

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Texas Instruments

USA . 636 parts In-Stock

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$36.396

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$32.352

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$23.788

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636

$36.396

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$23.788

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Mouser Electronics

USA . 2 parts In-Stock

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$54.790

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$39.560

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$54.790

$39.560

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Rochester

USA . 44 parts In-Stock

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$34.720

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$31.070

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$29.240

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$29.240

DigiKey

USA . 44 parts In-Stock

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Verical

USA . 44 parts In-Stock

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$43.400

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$38.837

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$36.550

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$38.837

$36.550

Distributors (In-Stock)

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Nova Conductors

Japan . 50 parts In-Stock

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$29.760

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$29.760

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Bristol Electronics

USA . 56 parts In-Stock

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$31.171

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$27.574

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Digiode

USA . 3,084 parts In-Stock

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$31.388

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Vyrian

USA . 5,173 parts In-Stock

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Cyclops Electronics Ltd

UK . 2,058 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 56 parts In-Stock

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Dan-Mar Components

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DigiKey Marketplace

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Distributors (Availability)

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AZTECH Wire

Italy . 220 parts In-Stock

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$11.952

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$11.952

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iBuyXS LLC

. 2,481 parts In-Stock

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$21.250

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Ampacity Inc.

Singapore . 154 parts In-Stock

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$28.080

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Corphita

USA . 4,575 parts In-Stock

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Continental Prestige Electronics

USA . 5,113 parts In-Stock

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$29.165

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Corohmni

South Africa . 1,965 parts In-Stock

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$33.694

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Parana Technologies

USA . 1,040 parts In-Stock

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Semicontronic

India . 137 parts In-Stock

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$59.592

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$59.286

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$61.120

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ChromeModa Solutions

Germany . 2,503 parts In-Stock

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$67.120

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$55.038

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IDEA Electronic Components Group

UK . 1,389 parts In-Stock

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$67.120

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$63.764

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$60.408

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Argo Parts USA

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Authorized Procurement Solutions

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BidChips

USA . 2,481 parts In-Stock

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Perfect Parts

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DigiPath Technology Company

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Netroflash

USA . 100 parts In-Stock

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$29.165

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$28.272

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$27.677

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$27.677

Overview

Unleash the power of cutting-edge technology with the TMS320DM6435ZWTL by Texas Instruments. As a leader in the digital signal processors (DSPs) category, Texas Instruments delivers unmatched quality and reliability. This versatile product is perfect for a wide range of applications, offering customers enhanced performance and efficiency. With integrated cache and low power mode, the TMS320DM6435ZWTL ensures optimal functionality while maintaining energy efficiency. Experience seamless operation and top-notch performance with this innovative DSP from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Lightweight and durable material that protects the internal components of the DSP, making it suitable for use in various environments.

Integrated Cache: YES

Having an integrated cache improves data processing speed and efficiency, enhancing the overall performance of the DSP.

Maximum Supply Voltage: 1.26 V

Operating within a specified voltage range ensures the stability and reliability of the DSP during operation.

Address Bus Width: 13

A wider address bus allows for efficient memory addressing and data retrieval, increasing the processing capabilities of the DSP.

Bit Size: 32

A 32-bit architecture provides higher computational precision and processing power, making the DSP suitable for complex signal processing tasks.

Minimum Operating Temperature: 0 °C

Being able to operate at low temperatures ensures the DSP's functionality in various environmental conditions.

No. of DMA Channels: 72

Having a high number of DMA channels allows for efficient data transfer and communication between different peripherals, improving overall system performance.

Technical Specifications

Digital Signal Processors (DSPs) TMS320DM6435ZWTL attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

13

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B361

JESD-609 Code:

e1

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

72

No. of Terminals:

361

No. of Timers:

5

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA361,19X19,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,1.8,3.3

Qualification:

Not Qualified

RAM Words:

20480

ROM Programmability:

MROM

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Peripheral IC Type:

Trade Compliance

TMS320DM6435ZWTL Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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