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TMS320DM6433ZWT5

Texas Instruments

TMS320DM6433ZWT5 by Texas Instruments

TMS320DM6433ZWT5 by Texas Instruments is a 32-bit DSP with integrated cache and 32-bit external data bus width. It operates at a max clock frequency of 27 MHz, making it suitable for digital signal processing applications requiring high-speed performance in a compact package. With low power mode and multiple internal bus architecture, it offers efficient power management and enhanced processing capabilities.

Median Price

$20.535

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 90 parts In-Stock

1+ parts

-

100+ parts

$22.020

1k+ parts

-

10k+ parts

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90

-

$22.020

-

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Rochester

USA . 5 parts In-Stock

1+ parts

-

100+ parts

$19.050

1k+ parts

$17.040

10k+ parts

$16.040

5

-

$19.050

$17.040

$16.040

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,149 parts In-Stock

1+ parts

$20.112

100+ parts

-

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-

10k+ parts

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3,149

$20.112

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Vyrian

USA . 2,579 parts In-Stock

1+ parts

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2,579

-

-

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DigiKey Marketplace

USA . 90 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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90

-

-

-

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ACDS - Activité Composants Distribution Service

France . 90 parts In-Stock

1+ parts

-

100+ parts

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90

-

-

-

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Bristol Electronics

USA . 90 parts In-Stock

1+ parts

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90

-

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Dan-Mar Components

USA . 90 parts In-Stock

1+ parts

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90

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 48 parts In-Stock

1+ parts

$17.990

100+ parts

-

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48

$17.990

-

-

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Corphita

USA . 3,151 parts In-Stock

1+ parts

$19.053

100+ parts

-

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3,151

$19.053

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-

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Parana Technologies

USA . 840 parts In-Stock

1+ parts

$36.656

100+ parts

-

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10k+ parts

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840

$36.656

-

-

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DigiPath Technology Company

USA . 570 parts In-Stock

1+ parts

$40.363

100+ parts

$37.134

1k+ parts

-

10k+ parts

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570

$40.363

$37.134

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ChromeModa Solutions

Germany . 2,762 parts In-Stock

1+ parts

$41.187

100+ parts

$33.773

1k+ parts

-

10k+ parts

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2,762

$41.187

$33.773

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IDEA Electronic Components Group

UK . 666 parts In-Stock

1+ parts

$41.187

100+ parts

$39.128

1k+ parts

$37.068

10k+ parts

-

666

$41.187

$39.128

$37.068

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Microchip USA

USA . 245 parts In-Stock

1+ parts

$50.650

100+ parts

$49.770

1k+ parts

$49.320

10k+ parts

$48.880

245

$50.650

$49.770

$49.320

$48.880

Corohmni

South Africa . 2,242 parts In-Stock

1+ parts

$59.564

100+ parts

-

1k+ parts

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10k+ parts

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2,242

$59.564

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Overview

Experience the power of cutting-edge technology with the TMS320DM6433ZWT5 by Texas Instruments, a leading manufacturer in the industry. This Digital Signal Processor (DSP) offers unparalleled performance and reliability, making it ideal for a wide range of applications. From audio processing to telecommunications, this versatile product delivers exceptional value and benefits to customers. With integrated cache, multiple timers, and low power mode, the TMS320DM6433ZWT5 ensures smooth operation and efficiency. Trust Texas Instruments for top-of-the-line solutions that exceed expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the DSP, ensuring long-lasting performance.

Integrated Cache: YES

Improves processing speed and efficiency by storing frequently accessed data for quick access.

Maximum Supply Voltage: 1.26 V

Allows for efficient power usage while ensuring optimal performance.

Address Bus Width: 32

Enables the DSP to access a large memory address space for complex calculations and data processing.

Bit Size: 32

Provides high precision and accuracy for processing digital signals.

Power Supplies (V): 1.2,1.8,3.3

Allows for flexibility in power requirements, making it compatible with various devices and power sources.

No. of Terminals: 361

Provides a high level of connectivity for interfacing with other components and peripherals.

Maximum Operating Temperature: 90 °C

Ensures reliable operation even in high-temperature environments.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Indicates that the DSP is designed specifically for signal processing applications, making it well-suited for tasks requiring real-time data processing.

Technology: CMOS

Uses CMOS technology which offers low power consumption and high noise immunity, enhancing the efficiency of the DSP.

Technical Specifications

Digital Signal Processors (DSPs) TMS320DM6433ZWT5 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

32

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

27 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B361

JESD-609 Code:

e1

Length:

16 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

72

No. of Terminals:

361

No. of Timers:

5

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA361,19X19,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,1.8,3.3

Qualification:

Not Qualified

RAM Words:

20480

ROM Programmability:

MROM

Maximum Seated Height:

1.4 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

16 mm

Peripheral IC Type:

Trade Compliance

TMS320DM6433ZWT5 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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