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TMS320DM6433ZDU6

Texas Instruments

TMS320DM6433ZDU6 by Texas Instruments

TMS320DM6433ZDU6 by Texas Instruments is a 32-bit DSP with integrated cache, 32-bit address bus width, and 27 MHz max clock frequency. Ideal for digital signal processing applications requiring low power mode and featuring 20480 RAM words and 1.2V nominal voltage.

Median Price

$23.410

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 794 parts In-Stock

1+ parts

-

100+ parts

$23.410

1k+ parts

-

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794

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$23.410

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Rochester

USA . 579 parts In-Stock

1+ parts

-

100+ parts

$20.260

1k+ parts

$18.130

10k+ parts

$17.060

579

-

$20.260

$18.130

$17.060

Verical

USA . 103 parts In-Stock

1+ parts

-

100+ parts

$25.325

1k+ parts

$22.663

10k+ parts

$21.325

103

-

$25.325

$22.663

$21.325

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 194 parts In-Stock

1+ parts

$21.384

100+ parts

-

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194

$21.384

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Vyrian

USA . 9,704 parts In-Stock

1+ parts

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9,704

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ACDS - Activité Composants Distribution Service

France . 330 parts In-Stock

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330

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Euro-Tech

UK . 59 parts In-Stock

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59

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 258 parts In-Stock

1+ parts

$20.259

100+ parts

-

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-

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258

$20.259

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-

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Component Stockers USA

USA . 1,583 parts In-Stock

1+ parts

$22.790

100+ parts

$21.430

1k+ parts

-

10k+ parts

-

1,583

$22.790

$21.430

-

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Corohmni

South Africa . 561 parts In-Stock

1+ parts

$27.679

100+ parts

-

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561

$27.679

-

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Parana Technologies

USA . 2,205 parts In-Stock

1+ parts

$28.508

100+ parts

$2,647.362

1k+ parts

$25.657

10k+ parts

-

2,205

$28.508

$2,647.362

$25.657

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DigiPath Technology Company

USA . 770 parts In-Stock

1+ parts

$31.390

100+ parts

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770

$31.390

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ChromeModa Solutions

Germany . 2,575 parts In-Stock

1+ parts

$32.031

100+ parts

$26.265

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2,575

$32.031

$26.265

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IDEA Electronic Components Group

UK . 82 parts In-Stock

1+ parts

$32.031

100+ parts

$30.429

1k+ parts

$28.828

10k+ parts

-

82

$32.031

$30.429

$28.828

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Microchip USA

USA . 299 parts In-Stock

1+ parts

$53.840

100+ parts

$52.910

1k+ parts

$52.440

10k+ parts

$51.970

299

$53.840

$52.910

$52.440

$51.970

Perfect Parts

USA . 739 parts In-Stock

1+ parts

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739

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Cyclops Electronics Ltd (Excess)

UK . 330 parts In-Stock

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330

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Glotronic Ltd.

UK . 264 parts In-Stock

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264

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Overview

Experience the power of cutting-edge technology with the TMS320DM6433ZDU6 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality Digital Signal Processors (DSPs) like this one, providing users with integrated cache, high-performance processing capabilities, and versatile applications. With a focus on efficiency and reliability, this product offers customers unmatched value, benefits, and advantages for a wide range of electronic devices, making it the perfect choice for those seeking superior performance and innovation in their projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a low cost and lightweight option for the product, making it easily manufacturable and transportable.

Integrated Cache: YES

Having an integrated cache helps in reducing memory latency and improving overall performance of the DSP.

Maximum Supply Voltage: 1.26 V

Operates at a low maximum supply voltage, making it energy-efficient and suitable for low power applications.

On Chip Data RAM Width: 8

Having a wider on-chip data RAM width allows for faster data processing and storage capabilities.

Address Bus Width: 32

With a wide address bus width, the DSP can access a larger memory space, enabling complex algorithms and computations.

Bit Size: 32

Operating with a 32-bit architecture allows for higher precision calculations and processing of data.

Maximum Operating Temperature: 90 °C

Capable of operating at high temperatures, making it suitable for industrial and automotive applications where temperature fluctuations may occur.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Being a digital signal processor, this product is optimized for handling digital signals efficiently, making it ideal for audio processing, telecommunications, and more.

Technology: CMOS

Utilizing CMOS technology ensures low power consumption and high reliability, making it suitable for battery-powered devices and other energy-efficient applications.

Technical Specifications

Digital Signal Processors (DSPs) TMS320DM6433ZDU6 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

32

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

27 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B376

JESD-609 Code:

e1

Length:

23 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

72

No. of Terminals:

376

No. of Timers:

5

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA376,22X22,40

Package Shape:

Package Style (Meter):

GRID ARRAY, HEAT SINK/SLUG

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,1.8,3.3

Qualification:

Not Qualified

RAM Words:

20480

ROM Programmability:

MROM

Maximum Seated Height:

2.48 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

23 mm

Peripheral IC Type:

Trade Compliance

TMS320DM6433ZDU6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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