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TMS320DM642GNZ500

Texas Instruments

TMS320DM642GNZ500 by Texas Instruments

TMS320DM642GNZ500 by Texas Instruments is a 32-bit DSP with 23-bit address bus, 64-bit external data bus, and max clock frequency of 75.19 MHz. Ideal for digital signal processing applications requiring low power mode and fixed-point format in a compact grid array package.

Median Price

$30.162

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 277 parts In-Stock

1+ parts

-

100+ parts

$26.810

1k+ parts

$23.990

10k+ parts

$22.580

277

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$26.810

$23.990

$22.580

DigiKey

USA . 277 parts In-Stock

1+ parts

-

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277

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Verical

USA . 277 parts In-Stock

1+ parts

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100+ parts

$33.513

1k+ parts

$29.988

10k+ parts

$28.225

277

-

$33.513

$29.988

$28.225

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,118 parts In-Stock

1+ parts

$28.300

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3,118

$28.300

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Vyrian

USA . 3,262 parts In-Stock

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3,262

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Connector Distribution Corp

USA . 40 parts In-Stock

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40

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Right Parts Inc.

USA . 40 parts In-Stock

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40

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,446 parts In-Stock

1+ parts

$26.811

100+ parts

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4,446

$26.811

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Parana Technologies

USA . 1,788 parts In-Stock

1+ parts

$68.953

100+ parts

-

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1,788

$68.953

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ChromeModa Solutions

Germany . 1,118 parts In-Stock

1+ parts

$77.475

100+ parts

$63.530

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1,118

$77.475

$63.530

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IDEA Electronic Components Group

UK . 1,082 parts In-Stock

1+ parts

$77.475

100+ parts

$73.601

1k+ parts

$69.728

10k+ parts

-

1,082

$77.475

$73.601

$69.728

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Corohmni

South Africa . 546 parts In-Stock

1+ parts

$80.323

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546

$80.323

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DigiPath Technology Company

USA . 1,752 parts In-Stock

1+ parts

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100+ parts

$69.851

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1,752

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$69.851

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Overview

Experience unparalleled performance and efficiency with the TMS320DM642GNZ500 by Texas Instruments. As a leader in digital signal processors, Texas Instruments delivers cutting-edge technology that transforms the way you process and manage data. Whether you're in telecommunications, industrial automation, or multimedia applications, this DSP offers exceptional value and benefits. Maximize your productivity and capabilities with the TMS320DM642GNZ500, and stay ahead of the competition with its reliable performance and innovative features. Elevate your projects to new heights with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product easy to handle and long-lasting.

Maximum Clock Frequency: 75.19 MHz

The high clock frequency allows for fast processing speed and efficient performance.

RAM Words: 16384

With a large RAM capacity, the product can handle complex tasks and store a significant amount of data.

Bit Size: 32

The 32-bit architecture allows for processing of data in larger chunks, improving efficiency and speed.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, making the product energy-efficient and reliable.

Technical Specifications

Digital Signal Processors (DSPs) TMS320DM642GNZ500 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

23

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

75.19 MHz

External Data Bus Width:

64

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B548

JESD-609 Code:

e0

Length:

27 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

548

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA548,26X26,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Words:

16384

Maximum Seated Height:

2.8 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Width:

27 mm

Peripheral IC Type:

Trade Compliance

TMS320DM642GNZ500 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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