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TMS320DM642AGNZ7

Texas Instruments

TMS320DM642AGNZ7 by Texas Instruments

TMS320DM642AGNZ7 by Texas Instruments is a 32-bit DSP with 23-bit address bus, 64-bit external data bus, and 75.19 MHz clock frequency. Ideal for digital signal processing applications requiring high-speed performance in a compact package.

Median Price

$106.015

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 361 parts In-Stock

1+ parts

$106.015

100+ parts

$94.236

1k+ parts

$69.291

10k+ parts

-

361

$106.015

$94.236

$69.291

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Mouser Electronics

USA . 5 parts In-Stock

1+ parts

$123.120

100+ parts

$99.310

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-

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5

$123.120

$99.310

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Rochester

USA . 71 parts In-Stock

1+ parts

-

100+ parts

$99.600

1k+ parts

$89.110

10k+ parts

$83.870

71

-

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$89.110

$83.870

DigiKey

USA . 71 parts In-Stock

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Verical

USA . 31 parts In-Stock

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-

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$124.500

1k+ parts

$111.388

10k+ parts

$104.838

31

-

$124.500

$111.388

$104.838

Avnet

USA . 4 parts In-Stock

1+ parts

-

100+ parts

$98.033

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$90.243

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4

-

$98.033

$90.243

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,335 parts In-Stock

1+ parts

$91.428

100+ parts

-

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4,335

$91.428

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Vyrian

USA . 7,293 parts In-Stock

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7,293

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LIBRA Elektronik GmbH

Germany . 9 parts In-Stock

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9

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,186 parts In-Stock

1+ parts

$32.884

100+ parts

-

1k+ parts

$114.110

10k+ parts

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1,186

$32.884

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$114.110

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DigiPath Technology Company

USA . 1,910 parts In-Stock

1+ parts

$36.209

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1,910

$36.209

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ChromeModa Solutions

Germany . 1,583 parts In-Stock

1+ parts

$36.948

100+ parts

$30.297

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1,583

$36.948

$30.297

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IDEA Electronic Components Group

UK . 256 parts In-Stock

1+ parts

$36.948

100+ parts

$35.101

1k+ parts

$33.253

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256

$36.948

$35.101

$33.253

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Corohmni

South Africa . 31 parts In-Stock

1+ parts

$80.721

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31

$80.721

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Ampacity Inc.

Singapore . 172 parts In-Stock

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$81.800

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Corphita

USA . 2,684 parts In-Stock

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$86.616

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2,684

$86.616

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Microchip USA

USA . 431 parts In-Stock

1+ parts

$211.400

100+ parts

$208.580

1k+ parts

$208.580

10k+ parts

$205.760

431

$211.400

$208.580

$208.580

$205.760

Authorized Procurement Solutions

USA . 1,000 parts In-Stock

1+ parts

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1,000

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Overview

Experience unparalleled performance and reliability with the TMS320DM642AGNZ7 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-of-the-line digital signal processors that are perfect for a wide range of applications. Whether you're in need of high-speed data processing or efficient power management, this product offers unmatched value, benefits, and advantages to customers. Trust in Texas Instruments to provide cutting-edge technology that exceeds your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the DSP, making it suitable for various environments.

Integrated Cache: YES

Having an integrated cache improves the performance of the DSP by reducing memory access times and increasing processing speeds.

Maximum Supply Voltage: 1.44 V

A higher maximum supply voltage allows for more flexibility in power requirements and potential performance enhancements.

Bit Size: 32

The 32-bit size allows for efficient processing of data and complex algorithms, making the DSP suitable for demanding tasks.

RAM Words: 16384

With a large RAM capacity, the DSP can handle a significant amount of data and run multiple applications simultaneously.

Maximum Clock Frequency: 75.19 MHz

A high maximum clock frequency ensures fast data processing and high performance, making the DSP ideal for time-sensitive applications.

Technology: CMOS

CMOS technology provides low power consumption, enhanced reliability, and high speed, making the DSP energy-efficient and reliable.

Technical Specifications

Digital Signal Processors (DSPs) TMS320DM642AGNZ7 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

23

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

75.19 MHz

External Data Bus Width:

64

Format:

FIXED POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B548

JESD-609 Code:

e0

Length:

27 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of DMA Channels:

64

No. of External Interrupts:

4

No. of Terminals:

548

No. of Timers:

3

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA548,26X26,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

220

Power Supplies (V):

1.4,3.3

Qualification:

Not Qualified

RAM Words:

16384

Maximum Seated Height:

2.8 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.44 V

Minimum Supply Voltage:

1.36 V

Nominal Supply Voltage:

1.4 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

27 mm

Peripheral IC Type:

Trade Compliance

TMS320DM642AGNZ7 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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