Loading...

TMS320DM642AGDK7

Texas Instruments

TMS320DM642AGDK7 by Texas Instruments

TMS320DM642AGDK7 by Texas Instruments is a 32-bit DSP with 23-bit address bus, 64-bit external data bus, and 16384 RAM words. It operates at up to 75.19 MHz clock frequency, suitable for industrial applications requiring high-speed signal processing. With integrated cache and low power mode, it offers efficient performance in digital signal processing tasks.

Median Price

$106.015

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,186 parts In-Stock

1+ parts

$106.015

100+ parts

$94.236

1k+ parts

$69.291

10k+ parts

-

1,186

$106.015

$94.236

$69.291

-

Mouser Electronics

USA . 30 parts In-Stock

1+ parts

$108.450

100+ parts

$98.120

1k+ parts

$94.230

10k+ parts

$92.560

30

$108.450

$98.120

$94.230

$92.560

DigiKey

USA . 449 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

449

-

-

-

-

Rochester

USA . 340 parts In-Stock

1+ parts

-

100+ parts

$86.390

1k+ parts

$77.300

10k+ parts

$72.750

340

-

$86.390

$77.300

$72.750

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$85.125

100+ parts

-

1k+ parts

-

10k+ parts

-

10

$85.125

-

-

-

Digiode

USA . 762 parts In-Stock

1+ parts

$91.428

100+ parts

-

1k+ parts

-

10k+ parts

-

762

$91.428

-

-

-

Q Components

USA . 1,110 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,110

-

-

-

-

Vyrian

USA . 74 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

74

-

-

-

-

Bristol Electronics

USA . 30 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

30

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,394 parts In-Stock

1+ parts

$35.956

100+ parts

-

1k+ parts

-

10k+ parts

-

1,394

$35.956

-

-

-

IDEA Electronic Components Group

UK . 2,112 parts In-Stock

1+ parts

$40.400

100+ parts

$38.380

1k+ parts

$36.360

10k+ parts

-

2,112

$40.400

$38.380

$36.360

-

ChromeModa Solutions

Germany . 1,302 parts In-Stock

1+ parts

$40.400

100+ parts

$33.128

1k+ parts

-

10k+ parts

-

1,302

$40.400

$33.128

-

-

Corohmni

South Africa . 2,118 parts In-Stock

1+ parts

$45.289

100+ parts

-

1k+ parts

-

10k+ parts

-

2,118

$45.289

-

-

-

Ampacity Inc.

Singapore . 58 parts In-Stock

1+ parts

$81.800

100+ parts

-

1k+ parts

-

10k+ parts

-

58

$81.800

-

-

-

Netroflash

USA . 1,000 parts In-Stock

1+ parts

$85.125

100+ parts

-

1k+ parts

-

10k+ parts

-

1,000

$85.125

-

-

-

Corphita

USA . 58 parts In-Stock

1+ parts

$86.616

100+ parts

-

1k+ parts

-

10k+ parts

-

58

$86.616

-

-

-

Microchip USA

USA . 461 parts In-Stock

1+ parts

$149.340

100+ parts

$147.350

1k+ parts

$147.350

10k+ parts

$145.360

461

$149.340

$147.350

$147.350

$145.360

Lixinc

USA . 10,227 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

10,227

-

-

-

-

DigiPath Technology Company

USA . 1,025 parts In-Stock

1+ parts

-

100+ parts

$36.425

1k+ parts

-

10k+ parts

-

1,025

-

$36.425

-

-

Cyclops Electronics Ltd (Excess)

UK . 198 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

198

-

-

-

-

Overview

Experience the power of cutting-edge technology with the Texas Instruments TMS320DM642AGDK7 Digital Signal Processor. Designed with top-quality materials and advanced features, this DSP offers unparalleled performance in a wide range of applications. Whether you are working on audio processing, image recognition, or telecommunications, this versatile product delivers exceptional value and benefits to customers. Trust in Texas Instruments for reliable solutions that push the boundaries of innovation. Elevate your projects with the TMS320DM642AGDK7 and achieve outstanding results every time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides a good balance between strength and cost, making the product durable and affordable.

Integrated Cache: YES

Having integrated cache helps improve the performance of the processor by reducing the time it takes to access frequently used data.

Maximum Supply Voltage: 1.44 V

Operating within a maximum supply voltage of 1.44 V ensures the reliability and efficient power usage of the product.

Address Bus Width: 23

With a wider address bus width of 23, the processor can handle larger amounts of memory and data, which is essential for complex signal processing tasks.

Package Shape: SQUARE

The square package shape allows for efficient use of space in circuit board designs, making it suitable for compact electronic devices.

Bit Size: 32

A 32-bit processor can perform calculations and process data more quickly and accurately compared to lower bit processors.

Power Supplies (V): 1.4,3.3

Support for multiple power supply voltages (1.4V and 3.3V) offers flexibility in design and compatibility with various power sources.

No. of Terminals: 548

Having a high number of terminals allows for a greater number of input and output connections, enabling connectivity with multiple devices and components.

Package Style (Meter): GRID ARRAY, FINE PITCH

The grid array and fine pitch package style enables high-density mounting of the processor on the circuit board, saving space and improving signal integrity.

Minimum Supply Voltage: 1.36 V

Operating within a minimum supply voltage of 1.36 V ensures the stability and performance of the processor even under low power conditions.

Maximum Operating Temperature: 105 °C

With a high maximum operating temperature of 105 °C, the processor can withstand demanding environmental conditions without sacrificing performance.

No. of External Interrupts: 4

Having 4 external interrupts allows the processor to respond quickly to external events, making it suitable for real-time signal processing applications.

Minimum Operating Temperature: -40 °C

With a low minimum operating temperature of -40 °C, the processor can operate in extreme cold conditions, making it versatile for various environments.

Terminal Finish: Tin/Lead (Sn/Pb)

Tin/lead terminal finish provides good solderability and ensures reliable connections with the circuit board.

Terminal Position: BOTTOM

Bottom terminal position makes it easier to mount and solder the processor onto the circuit board, facilitating assembly and maintenance.

Maximum Seated Height: 2.8 mm

With a maximum seated height of 2.8 mm, the processor can be easily accommodated in slim electronic devices, enhancing design flexibility.

RAM Words: 16384

With 16384 RAM words, the processor can efficiently store and manipulate data during signal processing operations, ensuring smooth and uninterrupted performance.

Width: 23 mm

Having a width of 23 mm allows for compact and space-efficient placement of the processor on the circuit board.

Boundary Scan: YES

Boundary scan capability enables efficient testing and debugging of the processor during production and maintenance, improving overall reliability.

External Data Bus Width: 64

A wider external data bus width of 64 allows for faster data transfer rates and smoother operation of the processor in signal processing tasks.

Maximum Clock Frequency: 75.19 MHz

Operating at a high maximum clock frequency of 75.19 MHz, the processor can handle complex signal processing tasks with speed and efficiency.

Peak Reflow Temperature °C: 220

With a peak reflow temperature of 220 C, the processor can withstand the high temperatures encountered during soldering and assembly processes.

Internal Bus Architecture: MULTIPLE

Multiple internal bus architecture allows for efficient data flow within the processor, enhancing performance and responsiveness in signal processing operations.

Length: 23 mm

Having a length of 23 mm ensures uniformity in dimensions and facilitates easy integration of the processor into various electronic devices.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures the processor can operate reliably in harsh industrial environments where temperature variations are common.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Being a digital signal processor and other peripheral IC type, the processor is versatile and can handle a wide range of signal processing applications effectively.

No. of Timers: 3

Having 3 timers allows the processor to manage time-sensitive tasks and operations efficiently, making it ideal for applications that require precise timing control.

Technology: CMOS

Using CMOS technology ensures low power consumption and high-speed operation of the processor, making it energy-efficient and reliable.

Terminal Form: BALL

Ball terminal form provides secure connections and efficient heat dissipation, contributing to the overall performance and reliability of the processor.

Nominal Supply Voltage: 1.4 V

Operating at a nominal supply voltage of 1.4 V ensures optimal performance and efficiency of the processor in various signal processing applications.

No. of DMA Channels: 64

Having 64 DMA channels enables efficient data transfer and processing without involving the main processor, enhancing overall system performance.

Terminal Pitch: 0.8 mm

With a terminal pitch of 0.8 mm, the processor allows for precise and reliable soldering connections, ensuring stable operation in electronic devices.

Format: FIXED POINT

Operating with fixed-point format facilitates faster and more efficient mathematical operations, making the processor suitable for real-time signal processing tasks.

Moisture Sensitivity Level (MSL): 4

Having a moisture sensitivity level of 4 indicates that the processor can withstand exposure to moderate moisture levels without affecting its performance or reliability.

Low Power Mode: YES

Support for low power mode enables energy-saving operation of the processor when processing tasks with lower power requirements, reducing overall power consumption.

Technical Specifications

Digital Signal Processors (DSPs) TMS320DM642AGDK7 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

23

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

75.19 MHz

External Data Bus Width:

64

Format:

FIXED POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B548

JESD-609 Code:

e0

Length:

23 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of DMA Channels:

64

No. of External Interrupts:

4

No. of Terminals:

548

No. of Timers:

3

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA548,26X26,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

220

Power Supplies (V):

1.4,3.3

Qualification:

Not Qualified

RAM Words:

16384

Maximum Seated Height:

2.8 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.44 V

Minimum Supply Voltage:

1.36 V

Nominal Supply Voltage:

1.4 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

23 mm

Peripheral IC Type:

Trade Compliance

TMS320DM642AGDK7 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 20