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TMS320DM641GNZ600

Texas Instruments

TMS320DM641GNZ600 by Texas Instruments

TMS320DM641GNZ600 by Texas Instruments is a 32-bit DSP with 23-bit address bus, 32-bit external data bus, and max clock frequency of 75 MHz. It is used in digital signal processing applications requiring low power mode and fixed-point format for efficient processing.

Median Price

$53.741

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 465 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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465

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-

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Rochester

USA . 335 parts In-Stock

1+ parts

-

100+ parts

$47.770

1k+ parts

$42.740

10k+ parts

$40.220

335

-

$47.770

$42.740

$40.220

Verical

USA . 224 parts In-Stock

1+ parts

-

100+ parts

$59.712

1k+ parts

$53.425

10k+ parts

$50.275

224

-

$59.712

$53.425

$50.275

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,792 parts In-Stock

1+ parts

$50.416

100+ parts

-

1k+ parts

-

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1,792

$50.416

-

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Vyrian

USA . 5,482 parts In-Stock

1+ parts

-

100+ parts

-

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10k+ parts

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5,482

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,547 parts In-Stock

1+ parts

$47.763

100+ parts

-

1k+ parts

-

10k+ parts

-

3,547

$47.763

-

-

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Corohmni

South Africa . 255 parts In-Stock

1+ parts

$62.291

100+ parts

-

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10k+ parts

-

255

$62.291

-

-

-

Parana Technologies

USA . 568 parts In-Stock

1+ parts

$76.399

100+ parts

-

1k+ parts

-

10k+ parts

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568

$76.399

-

-

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DigiPath Technology Company

USA . 955 parts In-Stock

1+ parts

$84.125

100+ parts

-

1k+ parts

-

10k+ parts

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955

$84.125

-

-

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ChromeModa Solutions

Germany . 1,428 parts In-Stock

1+ parts

$85.842

100+ parts

$70.390

1k+ parts

-

10k+ parts

-

1,428

$85.842

$70.390

-

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IDEA Electronic Components Group

UK . 844 parts In-Stock

1+ parts

$85.842

100+ parts

$81.550

1k+ parts

$77.258

10k+ parts

-

844

$85.842

$81.550

$77.258

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Microchip USA

USA . 313 parts In-Stock

1+ parts

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100+ parts

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313

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Overview

Experience the power of cutting-edge technology with the TMS320DM641GNZ600 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality Digital Signal Processors (DSPs) that set the standard for performance and reliability. Perfect for a wide range of applications, this DSP offers unmatched value, benefits, and advantages to customers. With features like high clock frequency, low power mode, and a wide data bus width, the TMS320DM641GNZ600 provides superior functionality and efficiency. Upgrade your system today with Texas Instruments and unlock endless possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good protection for the internal components of the DSP, ensuring durability and longevity.

Surface Mount: YES

Allows for easy installation on circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 1.44 V

Provides sufficient power for the DSP to operate efficiently without risking damage from overvoltage.

Address Bus Width: 23

Allows for efficient memory access and data handling capabilities.

Bit Size: 32

Enables high-performance processing capabilities for complex algorithms and calculations.

Power Supplies (V): 1.4,3.3

Offers flexibility in power options for different applications and scenarios.

No. of Terminals: 548

Provides a wide range of connectivity options for interfacing with other components and systems.

Package Style (Meter): GRID ARRAY

Provides a compact and efficient design for space-constrained applications.

Minimum Supply Voltage: 1.36 V

Ensures stable operation even under low power conditions.

Terminal Finish: TIN LEAD

Enhances solderability and conductivity for reliable connections.

Terminal Position: BOTTOM

Facilitates easy integration into circuit boards and system designs.

Maximum Seated Height: 2.8 mm

Allows for a low-profile design, suitable for compact devices and applications.

RAM Words: 16384

Provides ample memory capacity for storing and processing data efficiently.

Internal Bus Architecture: MULTIPLE

Enables high-speed data transfer and communication within the DSP.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Supports a wide range of peripherals for versatile connectivity and functionality.

Technology: CMOS

Offers low power consumption and high noise immunity for reliable operation.

Terminal Form: BALL

Ensures reliable connections and long-term durability.

Nominal Supply Voltage: 1.4 V

Ensures stable and consistent power delivery for optimal performance.

Terminal Pitch: 1 mm

Facilitates easy soldering and mounting on circuit boards.

Format: FIXED POINT

Provides efficient processing of integer-based calculations and algorithms.

Moisture Sensitivity Level (MSL): 4

Ensures reliability and performance under various environmental conditions.

Low Power Mode: YES

Enables energy-efficient operation, reducing power consumption and heat generation.

Technical Specifications

Digital Signal Processors (DSPs) TMS320DM641GNZ600 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

23

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

75 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B548

JESD-609 Code:

e0

Length:

27 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

548

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA548,26X26,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Power Supplies (V):

1.4,3.3

Qualification:

Not Qualified

RAM Words:

16384

Maximum Seated Height:

2.8 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.44 V

Minimum Supply Voltage:

1.36 V

Nominal Supply Voltage:

1.4 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Width:

27 mm

Peripheral IC Type:

Trade Compliance

TMS320DM641GNZ600 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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