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TMS320DM641GDK600

Texas Instruments

TMS320DM641GDK600 by Texas Instruments

TMS320DM641GDK600 by Texas Instruments is a 32-bit DSP with 23-bit address bus, 32-bit external data bus, and max clock frequency of 75 MHz. Ideal for digital signal processing applications requiring low power mode and fixed-point format in a compact grid array package.

Median Price

$53.741

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 250 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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250

-

-

-

-

Rochester

USA . 190 parts In-Stock

1+ parts

-

100+ parts

$47.770

1k+ parts

$42.740

10k+ parts

$40.220

190

-

$47.770

$42.740

$40.220

Verical

USA . 155 parts In-Stock

1+ parts

-

100+ parts

$59.712

1k+ parts

$53.425

10k+ parts

$50.275

155

-

$59.712

$53.425

$50.275

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,369 parts In-Stock

1+ parts

$50.416

100+ parts

-

1k+ parts

-

10k+ parts

-

2,369

$50.416

-

-

-

Vyrian

USA . 6,242 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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6,242

-

-

-

-

Goldney Electronics S.L.

Spain . 3 parts In-Stock

1+ parts

-

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-

1k+ parts

-

10k+ parts

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3

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,493 parts In-Stock

1+ parts

$47.763

100+ parts

-

1k+ parts

-

10k+ parts

-

3,493

$47.763

-

-

-

Corohmni

South Africa . 539 parts In-Stock

1+ parts

$54.120

100+ parts

-

1k+ parts

-

10k+ parts

-

539

$54.120

-

-

-

Parana Technologies

USA . 1,981 parts In-Stock

1+ parts

$54.636

100+ parts

-

1k+ parts

-

10k+ parts

-

1,981

$54.636

-

-

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DigiPath Technology Company

USA . 445 parts In-Stock

1+ parts

$60.161

100+ parts

-

1k+ parts

-

10k+ parts

-

445

$60.161

-

-

-

ChromeModa Solutions

Germany . 2,965 parts In-Stock

1+ parts

$61.389

100+ parts

$50.339

1k+ parts

-

10k+ parts

-

2,965

$61.389

$50.339

-

-

IDEA Electronic Components Group

UK . 326 parts In-Stock

1+ parts

$61.389

100+ parts

$58.320

1k+ parts

$55.250

10k+ parts

-

326

$61.389

$58.320

$55.250

-

Microchip USA

USA . 266 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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266

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Overview

Unlock the power of cutting-edge technology with the TMS320DM641GDK600 by Texas Instruments. As a leader in digital signal processors, Texas Instruments delivers unmatched quality and reliability. This DSP is perfect for a variety of applications, offering customers value and benefits like never before. Experience seamless performance and efficiency with the TMS320DM641GDK600, revolutionizing the way you approach your projects. Elevate your work to new heights with this innovative solution from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good thermal insulation and protection for the internal components, making the product durable and reliable.

Surface Mount: YES

Enables easy and efficient soldering onto circuit boards, saving time and simplifying the manufacturing process.

Maximum Supply Voltage: 1.44 V

Allows for a wide range of operating conditions, providing flexibility in different power supply setups.

Address Bus Width: 23

Offers a large address space, allowing for more complex and high-performance signal processing tasks.

Package Shape: SQUARE

Helps optimize space utilization on circuit boards, making the product suitable for compact designs.

Bit Size: 32

Provides high computational precision and accuracy, making the product suitable for demanding processing applications.

Power Supplies (V): 1.4,3.3

Supports multiple power supply options, enabling compatibility with various system configurations.

No. of Terminals: 548

Offers a wide range of connectivity options, facilitating integration with other components and peripherals.

Package Style (Meter): GRID ARRAY, FINE PITCH

Enhances signal integrity and reduces crosstalk, ensuring reliable performance in high-frequency applications.

Minimum Supply Voltage: 1.36 V

Allows for efficient operation at lower power levels, promoting energy efficiency and extending battery life.

Terminal Finish: TIN LEAD

Provides good solderability and corrosion resistance, ensuring long-term reliability and durability.

Terminal Position: BOTTOM

Facilitates easier and more secure mounting on circuit boards, improving overall product robustness and stability.

Maximum Seated Height: 2.8 mm

Enables a low-profile design, making the product suitable for space-constrained applications.

RAM Words: 16384

Offers a large memory capacity for storing and processing data, enhancing the product's performance in data-intensive tasks.

Width: 23 mm

Optimizes board space utilization and layout flexibility, allowing for efficient system integration.

Boundary Scan: YES

Facilitates testing and debugging during production and improves fault detection capabilities, ensuring product quality.

External Data Bus Width: 32

Enables high-speed data transfer and processing, enhancing overall system performance and throughput.

Maximum Clock Frequency: 75 MHz

Provides fast processing speeds, making the product suitable for real-time signal processing applications.

Internal Bus Architecture: MULTIPLE

Facilitates efficient data exchange between different processing units, improving overall system performance and responsiveness.

Length: 23 mm

Helps maintain a compact form factor, allowing for integration into space-constrained designs.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Supports a wide range of peripheral devices and interfaces, making the product versatile and adaptable to different application requirements.

Technology: CMOS

Offers low power consumption and high noise immunity, enhancing energy efficiency and system reliability.

Terminal Form: BALL

Facilitates reliable electrical connections and soldering processes, ensuring long-term product performance and durability.

Nominal Supply Voltage: 1.4 V

Provides stable and consistent power supply operation, ensuring reliable and uninterrupted performance.

Terminal Pitch: 0.8 mm

Enables high-density mounting and interconnection, contributing to compact and efficient circuit board designs.

Format: FIXED POINT

Offers predictable and deterministic processing performance, making the product suitable for real-time signal processing applications.

Moisture Sensitivity Level (MSL): 4

Indicates a moderate level of sensitivity to moisture, requiring standard handling and storage precautions for optimal product reliability.

Low Power Mode: YES

Allows for energy-efficient operation, extending battery life and reducing overall power consumption.

Technical Specifications

Digital Signal Processors (DSPs) TMS320DM641GDK600 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

23

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

75 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B548

JESD-609 Code:

e0

Length:

23 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

548

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA548,26X26,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Power Supplies (V):

1.4,3.3

Qualification:

Not Qualified

RAM Words:

16384

Maximum Seated Height:

2.8 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.44 V

Minimum Supply Voltage:

1.36 V

Nominal Supply Voltage:

1.4 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

23 mm

Peripheral IC Type:

Trade Compliance

TMS320DM641GDK600 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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