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TMS320DM640AZNZ4

Texas Instruments

TMS320DM640AZNZ4 by Texas Instruments

TMS320DM640AZNZ4 by Texas Instruments is a 32-bit DSP with integrated cache, 23-bit address bus width, and 32-bit external data bus width. It is used in digital signal processing applications requiring high clock frequency up to 75 MHz and low power mode for efficient performance.

Median Price

$40.330

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

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Chip1Stop

Japan . 40 parts In-Stock

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$16.100

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$16.100

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Arrow

USA . 40 parts In-Stock

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$40.330

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$40.330

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Verical

USA . 40 parts In-Stock

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$40.330

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$40.330

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Texas Instruments

USA . 1,627 parts In-Stock

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$44.629

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$39.670

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$29.169

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1,627

$44.629

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$29.169

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Distributors (In-Stock)

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Digiode

USA . 1,701 parts In-Stock

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$14.658

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Vyrian

USA . 5,968 parts In-Stock

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TME

Poland . 120 parts In-Stock

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$49.657

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ComSIT Distribution GmbH

Germany . 25 parts In-Stock

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ComSIT USA

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Distributors (Availability)

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Corphita

USA . 1,229 parts In-Stock

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$13.887

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AZTECH Wire

Italy . 304 parts In-Stock

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$22.200

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Corohmni

South Africa . 2,379 parts In-Stock

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$54.297

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Parana Technologies

USA . 1,143 parts In-Stock

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$67.466

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DigiPath Technology Company

USA . 239 parts In-Stock

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$74.288

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IDEA Electronic Components Group

UK . 983 parts In-Stock

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$75.804

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$72.014

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$68.224

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983

$75.804

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ChromeModa Solutions

Germany . 146 parts In-Stock

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$75.804

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$62.159

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Microchip USA

USA . 267 parts In-Stock

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$137.080

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$135.890

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$135.890

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$134.700

267

$137.080

$135.890

$135.890

$134.700

QUARKTWIN TECHNOLOGY LTD

USA . 28,161 parts In-Stock

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Overview

Experience the power of cutting-edge technology with the TMS320DM640AZNZ4 from Texas Instruments. As a leader in digital signal processors, Texas Instruments delivers top-quality products that are trusted by professionals worldwide. This DSP offers unparalleled performance and reliability, making it ideal for a wide range of applications. Whether you're working on audio processing, telecommunications, or industrial automation, this versatile processor has you covered. With integrated cache, multiple DMA channels, and low power mode, the TMS320DM640AZNZ4 provides exceptional value and efficiency to meet your needs. Unlock the potential of your projects with this innovative solution from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the internal components of the DSP, making it suitable for various environmental conditions.

Integrated Cache: YES

Having an integrated cache improves the processing speed and efficiency of the DSP, making it ideal for handling complex signal processing tasks.

Surface Mount: YES

The surface mount feature makes it easier to integrate the DSP onto circuit boards, saving space and enabling a more streamlined design.

Maximum Supply Voltage: 1.26 V

The low maximum supply voltage helps in minimizing power consumption and heat generation, contributing to energy efficiency.

Address Bus Width: 23

A wider address bus width allows for larger memory addressing capabilities, enabling the DSP to handle more data and execute complex algorithms.

Bit Size: 32

A 32-bit architecture provides enhanced processing power and precision, making the DSP suitable for demanding signal processing applications.

Power Supplies (V): 1.4, 3.3

Support for multiple power supply voltages offers flexibility in designing and powering the DSP-based systems, allowing for optimization based on specific requirements.

No. of Terminals: 548

The large number of terminals provides ample connectivity options, enabling seamless integration with other components and peripherals in the system.

Package Style (Meter): GRID ARRAY

The grid array package style offers a compact and efficient footprint, facilitating dense packing of DSPs for high-performance applications.

Minimum Supply Voltage: 1.14 V

The low minimum supply voltage ensures stable operation even under low-power conditions, enhancing the efficiency and reliability of the DSP.

Maximum Operating Temperature: 90 °C

The high maximum operating temperature range allows the DSP to function reliably in harsh environments or under heavy workloads, ensuring consistent performance.

Technical Specifications

Digital Signal Processors (DSPs) TMS320DM640AZNZ4 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

23

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

75 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B548

JESD-609 Code:

e1

Length:

27 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of DMA Channels:

64

No. of External Interrupts:

4

No. of Terminals:

548

No. of Timers:

3

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA548,26X26,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.4,3.3

Qualification:

Not Qualified

RAM Words:

16384

Maximum Seated Height:

2.8 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

27 mm

Peripheral IC Type:

Trade Compliance

TMS320DM640AZNZ4 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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