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TMS320C6748EZCE3

Texas Instruments

TMS320C6748EZCE3 by Texas Instruments

TMS320C6748EZCE3 by Texas Instruments is a DSP with 16-bit external data bus, 30 MHz clock frequency, and 1.05 V max supply voltage. Ideal for digital signal processing applications due to its low power mode, fixed point format, and CMOS technology.

Median Price

$15.704

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,570 parts In-Stock

1+ parts

$15.704

100+ parts

$13.717

1k+ parts

$9.460

10k+ parts

-

1,570

$15.704

$13.717

$9.460

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,167 parts In-Stock

1+ parts

$14.919

100+ parts

-

1k+ parts

-

10k+ parts

-

3,167

$14.919

-

-

-

Vyrian

USA . 4,333 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,333

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,328 parts In-Stock

1+ parts

$14.134

100+ parts

-

1k+ parts

-

10k+ parts

-

4,328

$14.134

-

-

-

Corohmni

South Africa . 5,061 parts In-Stock

1+ parts

$16.450

100+ parts

-

1k+ parts

-

10k+ parts

-

5,061

$16.450

-

-

-

Advanced Electronics

New Zealand . 92 parts In-Stock

1+ parts

$18.509

100+ parts

$16.843

1k+ parts

$15.177

10k+ parts

-

92

$18.509

$16.843

$15.177

-

AZTECH Wire

Italy . 1,050 parts In-Stock

1+ parts

$19.080

100+ parts

-

1k+ parts

-

10k+ parts

-

1,050

$19.080

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-

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Parana Technologies

USA . 1,066 parts In-Stock

1+ parts

$66.373

100+ parts

-

1k+ parts

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10k+ parts

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1,066

$66.373

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DigiPath Technology Company

USA . 1,016 parts In-Stock

1+ parts

$73.084

100+ parts

$67.238

1k+ parts

-

10k+ parts

-

1,016

$73.084

$67.238

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ChromeModa Solutions

Germany . 2,504 parts In-Stock

1+ parts

$74.576

100+ parts

$61.152

1k+ parts

-

10k+ parts

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2,504

$74.576

$61.152

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IDEA Electronic Components Group

UK . 2,329 parts In-Stock

1+ parts

$74.576

100+ parts

$70.847

1k+ parts

$67.118

10k+ parts

-

2,329

$74.576

$70.847

$67.118

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,000

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Overview

Unleash the power of cutting-edge technology with the TMS320C6748EZCE3 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments brings you a high-quality Digital Signal Processor that opens up a world of possibilities in various applications. Offering unparalleled value and benefits, this DSP ensures optimal performance and efficiency, making it an indispensable tool for your projects. Trust Texas Instruments to deliver top-notch solutions that exceed your expectations and propel your innovations to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package body material provides good insulation, protection, and durability for the DSP, making it suitable for a variety of environments.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and cost in production.

Maximum Supply Voltage: 1.05 V

Operating at a low maximum supply voltage of 1.05 V helps in reducing power consumption and heat dissipation, making the DSP energy efficient.

Address Bus Width: 14

With a wide address bus width of 14, the DSP can efficiently handle large amounts of data and complex operations.

Package Shape: SQUARE

Square package shape ensures that the DSP can be easily integrated into various PCB layouts, optimizing space utilization.

No. of Terminals: 361

Having a high number of terminals enables versatile connectivity options and allows for enhanced interaction with external components.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The grid array, low profile, and fine pitch package style offers high reliability, compact size, and efficient signal routing for the DSP.

Minimum Supply Voltage: 0.95 V

The low minimum supply voltage requirement of 0.95 V further contributes to the energy efficiency and power optimization of the DSP.

Maximum Operating Temperature: 90 °C

With a high maximum operating temperature of 90°C, the DSP can reliably operate in demanding thermal conditions without performance degradation.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature of 0°C ensures that the DSP can function effectively in a wide range of temperature environments.

Terminal Finish: TIN SILVER COPPER

The Tin Silver Copper terminal finish provides excellent conductivity, corrosion resistance, and solderability for reliable connections.

Terminal Position: BOTTOM

Having terminals positioned at the bottom facilitates easy and secure PCB mounting, enhancing the overall stability of the DSP.

Maximum Seated Height: 1.3 mm

The low maximum seated height of 1.3 mm allows for a slim profile and compact design, ideal for space-constrained applications.

Width: 13 mm

The compact width of 13 mm makes the DSP suitable for integration in small form factor devices and systems.

Boundary Scan: YES

Boundary scan capability enables efficient testing and debugging of the DSP during production, ensuring high quality and reliability.

External Data Bus Width: 16

The wide external data bus width of 16 allows for fast data transfer and parallel processing, enhancing the performance of the DSP.

Maximum Clock Frequency: 30 MHz

Operating at a maximum clock frequency of 30 MHz enables high-speed processing and real-time performance for the DSP.

Maximum Time At Peak Reflow Temperature (s): 30

The short maximum time at peak reflow temperature of 30 seconds ensures proper soldering and reliability during the manufacturing process.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, the DSP can withstand the soldering process without any thermal damage.

Internal Bus Architecture: MULTIPLE

Having multiple internal bus architectures allows for efficient data flow, processing of multiple instructions simultaneously, and improved overall performance.

Length: 13 mm

The short length of 13 mm contributes to the compact and space-saving design of the DSP, suitable for portable and embedded applications.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Being a digital signal processor with versatile peripheral IC types, the DSP can support a wide range of applications and functionalities.

Technology: CMOS

Using CMOS technology offers low power consumption, high integration capabilities, and fast operation speed, making the DSP efficient and reliable.

Terminal Form: BALL

The ball terminal form ensures secure connections, efficient heat dissipation, and reliable electrical contact for the DSP.

Nominal Supply Voltage: 1 V

Operating at a nominal supply voltage of 1 V provides a balance between power efficiency and performance for the DSP.

Terminal Pitch: 0.65 mm

The small terminal pitch of 0.65 mm allows for high-density mounting, fine-pitch connections, and efficient signal routing on the PCB.

Format: FIXED POINT

Using fixed-point format simplifies arithmetic operations, improves computational efficiency, and enhances overall processing speed for the DSP.

Moisture Sensitivity Level (MSL): 3

Having a moisture sensitivity level of 3 indicates that the DSP can withstand moderate exposure to moisture during handling and assembly.

Low Power Mode: YES

The low power mode feature allows the DSP to operate in a power-efficient state, conserving energy and extending battery life in portable devices.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6748EZCE3 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

1.2V ,1.1V AND 1.3 VOLT NOMINAL FREQUENCY ALSO AVAILABLE

Address Bus Width:

14

Barrel Shifter:

NO

Boundary Scan:

YES

Maximum Clock Frequency:

30 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B361

JESD-609 Code:

e1

Length:

13 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

361

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.3 mm

Maximum Supply Voltage:

1.05 V

Minimum Supply Voltage:

.95 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

13 mm

Peripheral IC Type:

Trade Compliance

TMS320C6748EZCE3 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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