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TMS320C6748BZWT4

Texas Instruments

TMS320C6748BZWT4 by Texas Instruments

TMS320C6748BZWT4 by Texas Instruments is a 32-bit DSP with 64-bit external data bus, operating at max 50 MHz. It features 8192 RAM words and operates b/w 0-90°C. Ideal for digital signal processing applications requiring low power consumption and high performance in a compact form factor.

Median Price

$22.490

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 20,593 parts In-Stock

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$22.490

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$22.040

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$21.590

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Distributors (In-Stock)

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Vyrian

USA . 8,661 parts In-Stock

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Chip Stock

USA . 3,500 parts In-Stock

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Digiode

USA . 453 parts In-Stock

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Euro-Tech

UK . 11 parts In-Stock

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

USA . 1 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 347 parts In-Stock

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$5.417

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One Stop Electronics

USA . 987 parts In-Stock

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$23.000

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Corohmni

South Africa . 1,076 parts In-Stock

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$48.323

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Parana Technologies

USA . 2,191 parts In-Stock

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$49.179

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DigiPath Technology Company

USA . 1,309 parts In-Stock

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ChromeModa Solutions

Germany . 2,375 parts In-Stock

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$55.257

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$45.311

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$55.257

$45.311

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IDEA Electronic Components Group

UK . 1,754 parts In-Stock

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$55.257

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$52.494

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$49.731

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$49.731

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QUARKTWIN TECHNOLOGY LTD

USA . 8,778 parts In-Stock

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Corphita

USA . 3,248 parts In-Stock

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Formix International (Excess)

India . 128 parts In-Stock

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Microchip USA

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Infinite Electronics LLP (Excess)

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Overview

Unleash the power of cutting-edge technology with the TMS320C6748BZWT4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality Digital Signal Processors for a wide range of applications. With its advanced features and superior performance, this DSP offers unparalleled value and benefits to customers. Experience lightning-fast processing speeds and seamless integration with the TMS320C6748BZWT4, setting new standards in innovation and efficiency. Elevate your projects to new heights with this state-of-the-art solution from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body makes the DSP lightweight and durable, suitable for portable and rugged applications.

Surface Mount: YES

The surface mount capability allows for easy and efficient integration of the DSP onto circuit boards, saving space and enabling automated assembly.

Maximum Supply Voltage: 1.32 V

The high maximum supply voltage of 1.32V provides flexibility in power supply options and compatibility with various voltage levels in different applications.

Address Bus Width: 24

With a wide address bus width of 24, the DSP can handle large amounts of data and memory addresses efficiently, enhancing performance in data processing tasks.

Package Shape: SQUARE

The square package shape offers uniformity and ease of mounting, ensuring proper alignment and secure placement on the circuit board.

Bit Size: 32

The 32-bit architecture of the DSP allows for high-speed computation and processing of data, making it suitable for complex signal processing tasks.

Power Supplies (V): 1.2, 1.8, 3.3

The multiple power supply options (1.2V, 1.8V, 3.3V) provide flexibility in power management and compatibility with different voltage requirements in various applications.

No. of Terminals: 361

The high number of terminals (361) enables efficient connectivity with other components and peripherals, enhancing the versatility and functionality of the DSP.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The combination of grid array, low profile, and fine pitch package styles optimizes space utilization, enhances thermal management, and facilitates high-density mounting on PCBs.

Minimum Supply Voltage: 1.14 V

The low minimum supply voltage of 1.14V ensures energy efficiency and reliable operation even in low-power scenarios, making the DSP suitable for battery-powered devices.

Maximum Operating Temperature: 90 °C

The high maximum operating temperature of 90°C allows the DSP to perform effectively in harsh environmental conditions without compromising its reliability or longevity.

Minimum Operating Temperature: 0 °C

The minimum operating temperature of 0°C ensures the DSP can function reliably in a wide range of temperature environments, suitable for both indoor and outdoor applications.

Terminal Finish: TIN SILVER COPPER

The terminal finish of tin, silver, and copper provides excellent conductivity, corrosion resistance, and solderability, ensuring reliable electrical connections for the DSP.

Terminal Position: BOTTOM

The bottom terminal position simplifies the PCB layout and assembly process, facilitating easier connection and integration of the DSP into the overall system design.

Maximum Seated Height: 1.4 mm

The low maximum seated height of 1.4mm enables a compact form factor and efficient heat dissipation, making the DSP suitable for space-constrained and high-performance applications.

RAM Words: 8192

The large RAM capacity of 8192 words allows for efficient storage and retrieval of temporary data during processing, enabling smooth and uninterrupted operation of the DSP.

Width: 16 mm

The compact width of 16mm facilitates flexibility in board layout and space-saving designs, making the DSP suitable for applications with limited space constraints.

Boundary Scan: YES

The boundary scan capability enables easy testing and debugging of the DSP during production and maintenance, ensuring high quality and reliability in the final product.

External Data Bus Width: 64

The wide external data bus width of 64 bits allows for efficient data transfer between the DSP and external peripherals, enhancing overall system performance and data processing speed.

Maximum Clock Frequency: 50 MHz

The high maximum clock frequency of 50 MHz enables fast processing and real-time operation of the DSP, making it suitable for time-critical signal processing applications.

Maximum Time At Peak Reflow Temperature (s): 30

The specified maximum time at peak reflow temperature of 30 seconds ensures proper soldering and thermal management during assembly, preventing damage to the DSP.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C allows for reliable and secure soldering of the DSP onto the PCB, ensuring long-term stability and performance under thermal stress.

Internal Bus Architecture: MULTIPLE

The multiple internal bus architecture enhances data flow and communication within the DSP, optimizing performance and efficiency in handling complex signal processing tasks.

Length: 16 mm

The compact length of 16mm contributes to a space-efficient design and ease of integration into various electronic devices, expanding the versatility and applicability of the DSP.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

The inclusion of a digital signal processor and other peripheral IC types expands the functionality and capabilities of the DSP, enabling a wide range of signal processing applications.

Technology: CMOS

The CMOS technology used in the DSP offers low power consumption, high noise immunity, and fast switching speeds, making it suitable for energy-efficient and high-performance applications.

Terminal Form: BALL

The ball terminal form enhances solder joint reliability, provides good electrical contact, and simplifies the mounting process, ensuring secure and robust connections for the DSP.

Nominal Supply Voltage: 1.2 V

The specified nominal supply voltage of 1.2V ensures compatibility with standard power sources and optimal performance of the DSP, making it a reliable choice for various applications.

Terminal Pitch: 0.8 mm

The small terminal pitch of 0.8mm allows for fine-pitch mounting and efficient routing of signals, contributing to a compact design and high-density integration of the DSP.

Format: FLOATING POINT

The floating-point format used in the DSP enables high-precision mathematical calculations and accurate representation of real-world data, essential for demanding signal processing tasks.

Moisture Sensitivity Level (MSL): 3

The moisture sensitivity level of 3 indicates the level of protection required during storage and handling to prevent moisture-related damage, ensuring the reliability and longevity of the DSP.

Low Power Mode: YES

The low power mode capability allows the DSP to operate at reduced power consumption levels, prolonging battery life and enhancing energy efficiency in portable and battery-powered devices.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6748BZWT4 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

24

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

50 MHz

External Data Bus Width:

64

Format:

FLOATING POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B361

JESD-609 Code:

e1

Length:

16 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

361

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA361,19X19,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,1.8,3.3

Qualification:

Not Qualified

RAM Words:

8192

Maximum Seated Height:

1.4 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

16 mm

Peripheral IC Type:

Trade Compliance

TMS320C6748BZWT4 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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