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TMS320C6747CZKBD4

Texas Instruments

TMS320C6747CZKBD4 by Texas Instruments

TMS320C6747CZKBD4 by Texas Instruments is a 32-bit DSP with 13-bit address bus, 16-bit external data bus, and max clock frequency of 50 MHz. Ideal for digital signal processing applications requiring low power mode, it features a package style of grid array and operates b/w -40 to 70°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,145 parts In-Stock

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Digiode

USA . 525 parts In-Stock

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525

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Distributors (Availability)

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AZTECH Wire

Italy . 272 parts In-Stock

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$14.160

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272

$14.160

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One Stop Electronics

USA . 1,018 parts In-Stock

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$24.000

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1,018

$24.000

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Parana Technologies

USA . 270 parts In-Stock

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$49.489

100+ parts

$4,595.836

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$44.540

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270

$49.489

$4,595.836

$44.540

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DigiPath Technology Company

USA . 2,200 parts In-Stock

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$54.494

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$50.134

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2,200

$54.494

$50.134

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ChromeModa Solutions

Germany . 580 parts In-Stock

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$55.606

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$45.597

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580

$55.606

$45.597

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IDEA Electronic Components Group

UK . 67 parts In-Stock

1+ parts

$55.606

100+ parts

$52.826

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$50.045

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67

$55.606

$52.826

$50.045

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Corohmni

South Africa . 3,233 parts In-Stock

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$71.068

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Corphita

USA . 4,521 parts In-Stock

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4,521

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Microchip USA

USA . 429 parts In-Stock

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Overview

Unlock the power of cutting-edge technology with the TMS320C6747CZKBD4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality Digital Signal Processors (DSPs) that are versatile and reliable. Whether you're working on audio processing, telecommunications, or industrial control applications, this product offers unmatched value, exceptional performance, and advanced features to help you achieve your goals efficiently. Upgrade your projects with the TMS320C6747CZKBD4 and experience the difference that Texas Instruments brings to the table.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material is cost-effective, durable and provides good protection to the internal components of the DSP, making it a reliable choice for long-term use.

Bit Size: 32

With a bit size of 32, this DSP offers high precision and accuracy in processing digital signals, making it suitable for various applications requiring complex computations.

Maximum Clock Frequency: 50 MHz

The high maximum clock frequency of 50 MHz allows for fast processing speed, enabling real-time signal processing and reducing latency in data transmission.

Technology: CMOS

CMOS technology ensures low power consumption and high noise immunity, making the DSP efficient and reliable in demanding electronic systems.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Having a digital signal processor as a peripheral IC ensures dedicated processing capabilities for digital signal processing tasks, enhancing the overall performance and efficiency of the system.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6747CZKBD4 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

13

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

50 MHz

External Data Bus Width:

16

Format:

FLOATING POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B256

JESD-609 Code:

e1

Length:

17 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

256

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA256,16X16,40

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,1.8,3.3

Qualification:

Not Qualified

RAM Words:

8192

Maximum Seated Height:

2.05 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.35 V

Minimum Supply Voltage:

1.25 V

Nominal Supply Voltage:

1.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

17 mm

Peripheral IC Type:

Trade Compliance

TMS320C6747CZKBD4 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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