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TMS320C6747CZKB3

Texas Instruments

TMS320C6747CZKB3 by Texas Instruments

TMS320C6747CZKB3 by Texas Instruments is a 32-bit DSP with 13-bit address bus, 16-bit external data bus, and max clock frequency of 50 MHz. Ideal for digital signal processing applications requiring low power consumption and high-speed performance in commercial temperature grades.

Median Price

$14.390

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 90 parts In-Stock

1+ parts

$14.390

100+ parts

$14.100

1k+ parts

$13.810

10k+ parts

-

90

$14.390

$14.100

$13.810

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,725 parts In-Stock

1+ parts

-

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3,725

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Vyrian

USA . 2,793 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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2,793

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-

-

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Flip Electronics

USA . 68 parts In-Stock

1+ parts

-

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-

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68

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 539 parts In-Stock

1+ parts

$8.000

100+ parts

-

1k+ parts

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539

$8.000

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AZTECH Wire

Italy . 333 parts In-Stock

1+ parts

$8.704

100+ parts

-

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333

$8.704

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One Stop Electronics

USA . 704 parts In-Stock

1+ parts

$17.000

100+ parts

-

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704

$17.000

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Corohmni

South Africa . 3,241 parts In-Stock

1+ parts

$40.511

100+ parts

-

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3,241

$40.511

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Parana Technologies

USA . 2,250 parts In-Stock

1+ parts

$63.947

100+ parts

$5,938.485

1k+ parts

$57.553

10k+ parts

-

2,250

$63.947

$5,938.485

$57.553

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DigiPath Technology Company

USA . 1,340 parts In-Stock

1+ parts

$70.414

100+ parts

-

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1,340

$70.414

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ChromeModa Solutions

Germany . 787 parts In-Stock

1+ parts

$71.851

100+ parts

$58.918

1k+ parts

-

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787

$71.851

$58.918

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IDEA Electronic Components Group

UK . 95 parts In-Stock

1+ parts

$71.851

100+ parts

$68.258

1k+ parts

$64.666

10k+ parts

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95

$71.851

$68.258

$64.666

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Corphita

USA . 4,649 parts In-Stock

1+ parts

-

100+ parts

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4,649

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Microchip USA

USA . 220 parts In-Stock

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220

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Overview

Experience unparalleled performance and efficiency with the TMS320C6747CZKB3 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-of-the-line digital signal processors that are perfect for a wide range of applications. Whether you're looking to enhance audio quality, improve image processing, or optimize communication systems, this DSP offers unmatched value and benefits. With innovative features and reliable technology, the TMS320C6747CZKB3 is the ideal choice for customers seeking exceptional performance and versatility in their projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the DSP, ensuring reliable performance in various environments.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation, making the DSP suitable for mass production and compact designs.

Maximum Supply Voltage: 1.32 V

Operating within a specific supply voltage range ensures stable performance and prevents damage to the DSP.

Address Bus Width: 13

A wide address bus allows for efficient data processing and handling of larger memory capacities.

Package Shape: SQUARE

Square packages are space-efficient and easy to handle during assembly, making the DSP suitable for compact designs.

Bit Size: 32

A 32-bit architecture enables fast and efficient processing of data, enhancing the overall performance of the DSP.

Power Supplies (V): 1.2,1.8,3.3

Support for multiple power supply voltages allows for versatile integration with different systems and applications.

No. of Terminals: 256

Having a large number of terminals provides ample connectivity options and flexibility for interfacing with external components.

Package Style (Meter): GRID ARRAY, FINE PITCH

The grid array and fine pitch package style offers high density mounting and efficient thermal management for the DSP.

Minimum Supply Voltage: 1.14 V

The minimum supply voltage ensures that the DSP can operate reliably even under low power conditions.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature, the DSP can function in a wide range of environmental conditions without overheating.

Minimum Operating Temperature: 0 °C

The ability to operate at low temperatures makes the DSP suitable for use in various industrial and automotive applications.

Terminal Finish: TIN SILVER COPPER

The terminal finish provides excellent conductivity and corrosion resistance, ensuring long-term reliability of the DSP.

Terminal Position: BOTTOM

Bottom terminal placement simplifies the installation and connection process, making the DSP user-friendly and easy to integrate.

Maximum Seated Height: 2.05 mm

With a low seated height, the DSP can be installed in slim devices and compact spaces, maximizing design flexibility.

RAM Words: 8192

A large RAM capacity allows for storing and processing a significant amount of data efficiently, enhancing the performance of the DSP.

Width: 17 mm

The compact width of the DSP enables it to fit into tight spaces and slim devices, making it ideal for small form factor applications.

Boundary Scan: YES

Boundary scan capability simplifies testing and debugging processes, ensuring the reliability and quality of the DSP.

External Data Bus Width: 16

A wide external data bus allows for fast data transfer and processing, enhancing the overall performance of the DSP.

Maximum Clock Frequency: 50 MHz

A high clock frequency enables fast data processing and execution of instructions, optimizing the performance of the DSP.

Maximum Time At Peak Reflow Temperature (s): 30

The specified time at peak reflow temperature ensures proper soldering and assembly of the DSP, guaranteeing reliable connections.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance allows for robust soldering and assembly processes, ensuring the longevity of the DSP.

Internal Bus Architecture: MULTIPLE

Multiple internal bus architecture enhances data processing efficiency and allows for concurrent operations, improving overall performance.

Length: 17 mm

The compact length of the DSP enables it to fit into small enclosures and devices, making it versatile for various applications.

Temperature Grade: COMMERCIAL

The commercial temperature grade ensures reliable performance in standard operating conditions, making the DSP suitable for a wide range of applications.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Support for various peripheral IC types allows for versatile interfacing and integration with different systems and components.

Technology: CMOS

CMOS technology offers low power consumption and high speed performance, making the DSP energy-efficient and reliable.

Terminal Form: BALL

Ball terminal form ensures secure connections and reliable electrical conduction, enhancing the overall stability and performance of the DSP.

Nominal Supply Voltage: 1.2 V

A low nominal supply voltage contributes to energy efficiency and helps reduce power consumption, making the DSP cost-effective to operate.

Terminal Pitch: 0.5 mm

The fine terminal pitch allows for high-density mounting and compact design integration, making the DSP suitable for space-constrained applications.

Format: FLOATING POINT

Support for floating-point format enables precise and accurate data processing, making the DSP ideal for computational tasks that require high precision.

Moisture Sensitivity Level (MSL): 3

MSL 3 ensures that the DSP is protected against moisture and humidity, enhancing its reliability and longevity in various environments.

Low Power Mode: YES

The inclusion of a low power mode allows for energy-efficient operation and extends the battery life of devices using the DSP, making it a sustainable choice.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6747CZKB3 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

13

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

50 MHz

External Data Bus Width:

16

Format:

FLOATING POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B256

JESD-609 Code:

e1

Length:

17 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

256

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA256,16X16,40

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,1.8,3.3

Qualification:

Not Qualified

RAM Words:

8192

Maximum Seated Height:

2.05 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

17 mm

Peripheral IC Type:

Trade Compliance

TMS320C6747CZKB3 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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