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TMS320C6747AZKB3

Texas Instruments

TMS320C6747AZKB3 by Texas Instruments

TMS320C6747AZKB3 by Texas Instruments is a 32-bit DSP with 8192 RAM words. Operating at temperatures from 0 to 70°C, it has power supplies of 1.2V, 1.8V, and 3.3V. This DSP is used in applications requiring floating-point format processing like audio and video signal processing.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,885 parts In-Stock

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4,885

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Vyrian

USA . 2,020 parts In-Stock

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2,020

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Distributors (Availability)

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One Stop Electronics

USA . 640 parts In-Stock

1+ parts

$11.000

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640

$11.000

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AZTECH Wire

Italy . 773 parts In-Stock

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$13.222

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773

$13.222

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Parana Technologies

USA . 867 parts In-Stock

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$49.698

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867

$49.698

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DigiPath Technology Company

USA . 354 parts In-Stock

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$54.724

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354

$54.724

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ChromeModa Solutions

Germany . 6,898 parts In-Stock

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$55.841

100+ parts

$45.790

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6,898

$55.841

$45.790

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IDEA Electronic Components Group

UK . 1,833 parts In-Stock

1+ parts

$55.841

100+ parts

$53.049

1k+ parts

$50.257

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1,833

$55.841

$53.049

$50.257

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Corohmni

South Africa . 1,046 parts In-Stock

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$82.687

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1,046

$82.687

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Corphita

USA . 1,661 parts In-Stock

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1,661

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Microchip USA

USA . 344 parts In-Stock

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344

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Overview

Unlock the power of cutting-edge technology with the TMS320C6747AZKB3 by Texas Instruments. As a leading manufacturer in the electronics industry, Texas Instruments delivers top-notch quality and reliability. Designed as a Digital Signal Processor (DSP), this product is ideal for a wide range of applications. With its advanced features and innovative design, the TMS320C6747AZKB3 offers unmatched value, benefits, and advantages to customers looking for high-performance solutions. Experience seamless performance and efficiency with this state-of-the-art processor.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Being made of plastic/epoxy, this DSP is lightweight and durable, making it suitable for portable applications.

Surface Mount: YES

With surface mount capability, this DSP is easy to integrate into compact electronic devices.

Bit Size: 32

A 32-bit architecture allows for high precision calculations and processing, making this DSP suitable for complex algorithms and signal processing tasks.

Power Supplies (V): 1.2, 1.8, 3.3

Support for multiple voltage levels (1.2V, 1.8V, 3.3V) allows flexibility in power supply options to meet different design requirements.

No. of Terminals: 256

With 256 terminals, this DSP offers ample connectivity for interfacing with other components in a system.

Package Style (Meter): GRID ARRAY

The grid array package style provides high density packaging, enabling efficient use of board space in compact designs.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this DSP can reliably operate in various environmental conditions.

Minimum Operating Temperature: 0 °C

The ability to operate at as low as 0°C allows this DSP to be used in temperature-sensitive applications.

RAM Words: 8192

Having 8192 RAM words provides ample memory for storing data and program instructions, enabling efficient processing of tasks.

Temperature Grade: COMMERCIAL

Being rated for commercial temperature grade ensures reliable performance in standard operating conditions.

Terminal Form: BALL

The ball terminal form offers robust connections, ensuring secure and reliable connectivity in the system.

Terminal Pitch: 1 mm

With a terminal pitch of 1mm, this DSP allows for precise and compact routing of connections on a circuit board.

Format: FLOATING POINT

Support for floating-point format enables high precision calculations and processing of numerical data, making this DSP suitable for advanced algorithms and computations.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6747AZKB3 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Bit Size:

32

Format:

FLOATING POINT

JESD-30 Code:

S-PBGA-B256

No. of Terminals:

256

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA256,16X16,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Power Supplies (V):

1.2,1.8,3.3

Qualification:

Not Qualified

RAM Words:

8192

Sub-Category:

Digital Signal Processors

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Trade Compliance

TMS320C6747AZKB3 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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