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TMS320C6746EZCE3

Texas Instruments

TMS320C6746EZCE3 by Texas Instruments

TMS320C6746EZCE3 by Texas Instruments is a DSP with 30MHz clock, 327680 RAM words, and 80 DMA channels. Ideal for digital signal processing applications requiring low power mode, it features a single internal bus architecture and integrated cache for efficient data handling.

Median Price

$11.408

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 4,661 parts In-Stock

1+ parts

$11.408

100+ parts

$9.964

1k+ parts

$6.872

10k+ parts

-

4,661

$11.408

$9.964

$6.872

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,564 parts In-Stock

1+ parts

$10.838

100+ parts

-

1k+ parts

-

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1,564

$10.838

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-

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Vyrian

USA . 4,632 parts In-Stock

1+ parts

-

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-

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4,632

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-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 660 parts In-Stock

1+ parts

$10.267

100+ parts

-

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-

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660

$10.267

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-

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Corohmni

South Africa . 159 parts In-Stock

1+ parts

$14.150

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-

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159

$14.150

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AZTECH Wire

Italy . 823 parts In-Stock

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$15.710

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823

$15.710

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Parana Technologies

USA . 1,588 parts In-Stock

1+ parts

$16.429

100+ parts

-

1k+ parts

$16.721

10k+ parts

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1,588

$16.429

-

$16.721

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DigiPath Technology Company

USA . 2,174 parts In-Stock

1+ parts

$18.090

100+ parts

$16.643

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-

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2,174

$18.090

$16.643

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ChromeModa Solutions

Germany . 5,099 parts In-Stock

1+ parts

$18.459

100+ parts

$15.136

1k+ parts

-

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5,099

$18.459

$15.136

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IDEA Electronic Components Group

UK . 673 parts In-Stock

1+ parts

$18.459

100+ parts

$17.536

1k+ parts

$16.613

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673

$18.459

$17.536

$16.613

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Component Stockers USA

USA . 246 parts In-Stock

1+ parts

$154.730

100+ parts

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246

$154.730

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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1,000

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Overview

Experience the power of advanced signal processing with the TMS320C6746EZCE3 by Texas Instruments. As a leader in digital signal processors, Texas Instruments delivers unparalleled quality and reliability. Ideal for a wide range of applications, this DSP offers integrated cache, low power mode, and boundary scan capabilities. With a maximum clock frequency of 30 MHz and 80 DMA channels, this product provides customers with high performance and efficiency. Trust Texas Instruments to provide cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and cost-effective.

Integrated Cache: YES

Having an integrated cache helps in improving the processing speed and efficiency of the DSP.

Maximum Supply Voltage: 1.05 V

Allows for efficient power consumption and operation within safe voltage limits.

On Chip Data RAM Width: 8

A wider data RAM width allows for faster data processing and storage capabilities.

Address Bus Width: 23

With a wider address bus, the DSP can access a larger memory space, enabling more complex operations.

No. of Terminals: 361

Having a high number of terminals allows for more connectivity options and interfaces.

Maximum Operating Temperature: 90 °C

The high maximum operating temperature ensures reliable performance under various environmental conditions.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature allows for usage in colder environments without performance issues.

External Data Bus Width: 16

A wider external data bus width enables faster data transfer between the processor and external devices.

Maximum Clock Frequency: 30 MHz

The high maximum clock frequency indicates fast processing speeds and real-time operation capabilities.

Technology: CMOS

CMOS technology offers low power consumption and high speed, making the DSP energy efficient and efficient in processing.

No. of DMA Channels: 80

Having a high number of DMA channels allows for efficient data transfer and management, enhancing overall performance.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6746EZCE3 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO OPEARTES AT 1.1V AND 1.2V SUPLLY

Address Bus Width:

23

Barrel Shifter:

NO

Boundary Scan:

YES

Maximum Clock Frequency:

30 MHz

External Data Bus Width:

16

Format:

FLOATING POINT

Integrated Cache:

YES

Internal Bus Architecture:

SINGLE

JESD-30 Code:

S-PBGA-B361

JESD-609 Code:

e1

Length:

13 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

80

No. of Terminals:

361

No. of Timers:

8

On Chip Data RAM Width:

8

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Words:

327680

Maximum Seated Height:

1.3 mm

Maximum Supply Voltage:

1.05 V

Minimum Supply Voltage:

.95 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

13 mm

Peripheral IC Type:

Trade Compliance

TMS320C6746EZCE3 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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